Abstract: An interposer for mechanically and electrically connecting two circuit boards is described. The interposer can be bent to enclose an area of a circuit board. The interposer can include a first layer external to the enclosed area. The first layer can be conductive and can serve as an EMI shield. The interposer can also include a second layer internal to the enclosed area. The second layer can be non-conductive but can carry multiple discrete pins that can electrically couple the first and second circuit boards and provide signal transmission pathways between the circuit boards. The interposer can be formed by folding a sheet of conductive material having different cutout regions that forms a comb pattern into multiple stacked layers. Then, the bent regions that connect the stacked layers can be removed so that the conductive bars in the comb patterns can be separated and isolated to form discrete pins.

Abstract: Systems and methods that may be implemented to provide on-board trace impedance testing for a system level board of an information handling system. A printed circuit board (PCB) of the system level board may include built-in test trace circuitry that may be used to measure board trace impedance so that the trace impedance of a fully assembled system level board may be tested and verified for compliance with trace impedance specification, and without requiring any disassembly of the board.

Abstract: An electrical conductor includes a substrate; and a first conductive layer disposed on the substrate and including a plurality of metal oxide nanosheets, wherein adjacent metal oxide nanosheets of the plurality of metal oxide nanosheets contact to provide an electrically conductive path between the contacting metal oxide nanosheets, wherein the plurality of metal oxide nanosheets include an oxide of Re, V, Os, Ru, Ta, Ir, Nb, W, Ga, Mo, In, Cr, Rh, Mn, Co, Fe, or a combination thereof, and wherein the metal oxide nanosheets of the plurality of metal oxide nanosheets have an average lateral dimension of greater than or equal to about 1.1 micrometers. Also an electronic device including the electrical conductor, and a method of preparing the electrical conductor.

Abstract: Substrates configured to route electrical signals may include a first dielectric material and an electrically conductive material located on a first side of the first dielectric material. A second dielectric material may be located on a second, opposite side of the first dielectric material. A series of voids may be defined by the second dielectric material extending from the first dielectric material at least partially through the second dielectric material. Footprints of at least some of the voids of the series of voids may at least partially laterally overlap with the electrically conductive material.

Abstract: A flexible circuit board for all-in-one chip on film according to an embodiment may include: a substrate; a conductive pattern part disposed on the substrate; and a protective layer partially disposed on the conductive pattern part, wherein the conductive pattern part includes a first conductive pattern part and a second conductive pattern part which are spaced apart from each other, each of the first conductive pattern part and the second conductive pattern part includes a wiring pattern layer, a first plating layer, and a second plating layer that are sequentially placed on the substrate, the first conductive pattern part includes a first open region in which the protective layer is open, the second conductive pattern part includes a second open region in which the protective layer is open, and a content of tin of the second plating layer in the first open region is greater than that of the second plating layer in the second open region.

Abstract: A multilayer wiring board includes first and second insulating layers, a first conductive wiring layer on the first insulating layer, a second conductive wiring layer on a surface of the second insulating layer facing the first insulating layer, an interlayer connection conductor including an intermetallic compound and penetrating through the first insulating layer to interconnect the first and second conductive wiring layers, a first intermetallic compound layer between the first conductive wiring layer and the interlayer connection conductor, and a second intermetallic compound layer between the second conductive wiring layer and the interlayer connection conductor, wherein the intermetallic compounds in the first and second intermetallic compound layers have a composition different from that of the intermetallic compound in the interlayer connection conductor, and the first intermetallic compound layer is located at a level different from a level of an interface between the first conductive wiring layer an

Abstract: According to one embodiment, an electronic device includes a panel including a mounting edge and pad portions, a flexible printed circuit board mounted on the panel. The flexible printed circuit board includes a base member including a first surface and a second surface, wiring lines placed on a side of the first surface and a protective layer covering the wiring lines, and including a bent portion, the base member includes a groove portion located in the bend portion and formed in the second surface, the groove portion includes concavity portions extending along a second direction and arranged along the first direction, and a thickness of the base member in a site where the groove portion is formed is less than a thickness of the base member in a site overlapping the driver IC chip.

Abstract: A method for manufacturing connection structure, the method includes arranging a first composite on a first surface of a first member where a first electrode is located and arranging conductive particles on the first electrode, arranging a second composite on a region other than the first electrode of the first surface, arranging the first surface and a second surface of a second member where a second electrode is located, so that the first electrode and the second electrode are opposed to each other, pressing the first member and the second member, and curing the first composite and the second composite.

Abstract: A wire soldered structure includes a substrate including a main body, a first conducting layer disposed on the main body, and a through hole extending through the main body and the first conducting layer; a wire including a soldered portion that is disposed on the first conducting layer and that is adjacent to the through hole; and a solder disposed in the through hole; wherein the soldered portion of the wire is soldered to the first conducting layer of the substrate via the solder.

Abstract: The invention refers to a component carrier realized as a printed circuit board, an intermediate printed circuit board product or an IC-substrate, comprising at least one heat-passage component, said at least one heat-passage component being realized in form of a heat-generating or a heat-absorbing component that is mounted on an outside surface layer or is embedded within at least one inner layer of the component carrier, and further comprising at least one latent-heat storage unit with a phase-change material. The phase-change material is arranged within at least one cavity and integrated within a laminated build-up of the component carrier and is directly thermoconductively coupled with the at least one heat-passage component. The invention also refers to a method for producing said component carrier.

Abstract: A manufacturing method of a multilayer board includes: forming a metal core layer including a main body, an island portion, and four connection portions, the island portion having a substantially rectangle shape and being located in an opening formed in the main body, the opening having a substantially rectangle shape, the four connection portions connecting side surfaces of four corners of the island portion or side surfaces of vicinities of the four corners of the island portion to a side surface of the main body; forming a first insulating layer on the metal core layer and in the opening; and forming, in the first insulating layer, a hole reaching each of the four connection portions and removing at least a part of each of the four connection portions through the hole to electrically separate the main body and the island portion from each other

Abstract: A conductive component includes a first electrode pattern made of metal thin wires, and includes a plurality of first conductive patterns that extend in a first direction alternating with first non-conductive patterns. Each first conductive pattern includes break parts in portions other than intersection parts of the thin metal wires. The conductive component further includes a second electrode pattern made of thin metal wires, and includes a plurality of second conductive patterns that extend in a second direction orthogonal to the first direction and alternating with second non-conductive patterns. Each second conductive pattern includes break parts in portions other than intersection parts of thin metal wires.

Abstract: An electronic module on a flexible planar circuit substrate with a conductor configuration on a first substrate surface and a plurality of electronic components on the opposite, second substrate surface, wherein the components have component contacts, which are electrically connected selectively by way of vias in the circuit substrate and the conductor configuration, wherein the circuit substrate is a thermoplastic polymer and the component contacts are melted or thermally pressed into the second substrate surface in the region of the vias.

Abstract: A method of the present invention includes preparing a substrate having a surface on which a electrode pad is formed, forming a resist layer on the substrate, the resist layer having an opening on the electrode pad, filling conductive paste in the opening of the resist layer; sintering the conductive paste in the opening to form a conductive layer which covers a side wall of the resist layer and a surface of the electrode pad in the opening, a space on the conductive layer leading to the upper end of the opening being formed, filling solder in the space on the conductive layer and removing the resist layer.

Abstract: A security apparatus for securing a portable electronic device to an immovable object includes a locking head having a base and a plurality of pillar structures extending from the base. The plurality of pillar structures is configured to be inserted into an aperture of the portable electronic device. The locking head also has a ball positioned within each of the plurality of pillar structures. The ball is extendable outwardly from a corresponding pillar structure to inhibit the locking head from being removed from the aperture. The locking head further has a linear movable structure positioned within each of the plurality of pillar structures and operable to selectively extend outwardly each ball from the plurality of pillar structures. The security apparatus also includes a security device attached to the locking head and configured to engage the immovable object.

Abstract: An electrical connector element, for use on a printed circuit board assembly, includes a soldering pad having a longitudinal length and a cross-sectional width. The soldering pad is configured to be electrically-coupleable to a PCB device conductor. At least one impedance inducing feature is positioned along the longitudinal length of the soldering pad.

Abstract: A substrate includes: (1) a first patterned conductive layer, the first patterned conductive layer including a pair of first transmission lines adjacent to each other; and (2) a first reference layer above the pair of first transmission lines, the first reference layer defining an opening, wherein the pair of first transmission lines are exposed to the opening.

Abstract: An approach to forming an electronic device assembly that includes a plurality of interconnect pads on an electronic device, an interconnect die with a first set of interconnect pads adjacent to a first edge of the interconnect die connecting to a second set of interconnect pads adjacent to a second edge of the interconnect die, where a first set of connections between the plurality of interconnects on the electronic device and the first set of interconnect pads on the interconnect die occurs. Furthermore, the electronic assembly includes a second set of connections between the second set of interconnects on the interconnect die and a set of interconnect pads on a flex cable.

Abstract: A thermally expandable material includes microcapsules and a binder having a conducting property, each microcapsule including a shell having an insulating property, and a thermally expandable component contained in the shell and having a property of expanding by heating, the shell deforming due to expansion of the thermally expandable component to come in contact with another capsule and have an insulating state with the other capsule.

Abstract: A living body-attachable electrode includes a substrate that has a first main surface and a second main surface and is made of a material having stretchability, a first electrode pair that is formed on/in the first main surface and includes two opposite electrodes, a second electrode pair that is formed on/in the first main surface and includes two opposite electrodes sandwiching the first electrode pair, and a plurality of gel electrodes that are formed on the second main surface and are in a one-to-one correspondence with the electrodes in the first and second electrode pairs. Each of the electrodes in the first and second electrode pairs and corresponding one of the gel electrodes are electrically connected to each other via a plurality of via conductors penetrating through the substrate.