Abstract: A multi-pin connector for connecting a signal line on a backboard side and a signal line on a daughter board side has open pins where the signal lines are not connected. In order to prevent transmission loss on the signal lines caused by these open pins, terminating resistances are connected to both ends of the open pins, and ends of the terminating resistances opposite to the open pins are connected to ground or to a power supply.

Abstract: An electronic circuit device, includes: internal terminals; a board on which wirings to the internal terminals are formed; an electronic component that is mounted on the board and is connected with the internal terminals; and an encapsulation resin with which the electronic component and the internal terminals are encapsulated. A part of the wiring forms a ring-shaped portion, and the ring-shaped portion has a plurality of gaps by which the ring-shaped portion is divided into a plurality of discontinuous ring-constituting sections. The plurality of ring-constituting sections are connected to the respective internal terminals, and a coating region of the encapsulation resin is surrounded with the ring-shaped portion. The applied area of the encapsulation resin can be controlled to be constant without using a special element for controlling the flow of the encapsulation resin.

Abstract: In a printed circuit board of the invention, a first signal wiring layer, a first ground layer, a second ground layer and a second signal wiring layer are laminated via an insulating material. A first signal wiring is formed on the first signal wiring layer and a second signal wiring is formed on the second signal wiring layer. The two signal wirings are connected via a first through hole. The conductive first ground layer and the conductive second ground layer are connected via a second through hole. The second through hole is insulated from the first through hole and formed so as to surround the first through hole.

Abstract: In a lead-free solder comprising an alloy composition composed mainly of tin, the alloy composition further contains 0.002 to 0.015% by mass of phosphorus. This lead-free solder can be used as a plating in a connection lead comprising: a copper strip or other strip conductor; and the plating provided on at least one side of the strip constructor, the plating having a shape such that the plating in the widthwise direction of the strip conductor has a bulge as viewed in section with the apex being located at a proper position in the widthwise direction of the strip conductor. By virtue of this constitution, the lead-free solder on its surface is less likely to be oxidized, and the connection lead has excellent bond strength owing to the property of the lead-free solder and, in addition, has the function of breaking the formed oxide layer and the function of removing included gas bubbles and can eliminate the need to form the plating in very large thickness.

Abstract: A recording apparatus that has a recording head and a flexible printed circuit board. The recording head, which performs recording on a recording medium, has a plurality of recording elements. One end of the flexible printed circuit board has plurality of feeder wires that connect to one of the terminal lands of each of the recording elements. A first common voltage wire connects the other terminal lands of each of the recording elements to a common potential. A drive circuit is attached to the flexible printed circuit board to drive the recording head via the feeder wires. The other end of the flexible printed circuit board is connected to another circuit board used by the recording apparatus.

Abstract: A wiring substrate is formed of a plurality of metal wirings 14e formed on a substrate 7c. A guard wiring 29 fabricated of an electrically conductive oxide such as ITO is interposed between at least a pair of adjacent ones of a plurality of metal wirings 14e. When voltages V1, V2, V3, and V4 applied to the metal wirings 14e are related to be V1>V2>V3>V4, a guard wiring 29 is present between a metal wiring 14e functioning as an anode and a metal wiring 14e functioning as a cathode, and the anode metal wiring 14e is prevented from being corroded.

Abstract: A system for communicating with an electronic device within a sealed vessel comprises a generally enclosed housing having an opening. A printed circuit board is provided for covering the housing opening to create a fully enclosed sealed vessel. An electronic device is located within the interior of the sealed vessel and an external device is located outside the sealed vessel. At least one conductive path comprised of at least one conductive trace and at least one conductive via extends through the printed circuit board from the first surface located on the outside of the sealed vessel to a second surface located on the inside of the sealed vessel. The conductive path has a first end on the first surface which is connected to the external device and a second end on the second surface which is connected to the electronic device.

Abstract: An electronic device having a replaceable casing panel comprises a first portion and a second portion. The first portion includes a gliding member having a plurality of second positioning elements corresponding to a plurality of first positioning elements, and each second positioning element includes a fixing element for fixing the gliding member in the first portion and restricting the moving direction of the gliding member, and the gliding member includes a first panel that slides with the gliding member. The second portion includes a second panel having a plurality of third embedding elements and a plurality of fourth embedding elements embedded with each other, and the second portion includes a plurality of first embedding elements and a plurality of second embedding elements, such that the first panel can be pushed to form a gap for replacing the second panel.

Abstract: A blade (202a) with first circuit entity (210) having a transmit output (280) coupled to a first connector (260) and a receive input (282) coupled to a third connector (264), and a second circuit entity (212) having a transmit output (284) coupled to the fourth connector (266) and a receive input (286) coupled to a second connector (262). The first, second, third and fourth connectors of the blade (202a) are adapted to connect to a peer-to-peer backplane (104) that electrically connects the blade (202a) to a remote blade (202b) through remote connectors (150, 152, 154, 156) on the backplane (104). The backplane (104) cross-connects the first connector (140) to a remote second connector (152) cross-connects the second connector (142) to the remote first connector (150). The backplane cross-connects the fourth connector (146) to a remote third connector (154) and cross-connects the third connector (144) to a remote fourth connector (156).

Abstract: The present invention relates to power supplies and methods of installing power supplies.

Abstract: A slot apparatus for a memory module on a printed circuit board. The slot apparatus includes a first memory slot set, a second memory slot set, a terminal resistor, and a serial resistance. The first and second memory slot sets are disposed on the printed circuit board. The terminal resistor is disposed between the first and second memory slot sets. The serial resistance is disposed on the printed circuit board and is electrically connected to the first and second memory slot sets through the printed circuit board. The terminal resistor is respectively and electrically connected to the first and second memory slot sets through the printed circuit board. The terminal resistor and the first and second memory slot sets are connected to a terminator voltage.

Abstract: An optically connectable circuit board and optical components mounted thereon. At least one component includes optical transceivers and provides an optical connection to the board. Electronic components may be directly connected to the board electrically or optically. Also, some electronic components may be indirectly connected optically to the board through intermediate optical components.

Abstract: A processor mounted to a circuit board is provided with regulated voltage through lower-inductance circuit board traces by mounting a voltage regulator module for the processor, on the side of the circuit opposite to the processor. Current from the voltage regulator is provided to the processor by way of one or more conductors between the regulator and processor that extend through the circuit board from one side to the other. Inductance attributable to lead length is reduced by locating the voltage regulator close to its load. Circuit board space on the processor side of the circuit board is increased by moving the voltage regulator to the opposite side.

Abstract: A conductive sash is etched around the periphery of a land grid array interconnection on a carrier for dense integrated circuit connections. If the array comprises more than one module or module chip domain, the conductive sash is also positioned between the modules. The dimensions of the sash are such that it is slightly larger than a frame of an interposer or other electrical connector which is placed upon the array. In this fashion, the interposer or other electrical connector rests upon the sash and provides protection against particulate and gaseous contamination of the array.

Abstract: A high-frequency circuit comprises a substrate having an electronic component on an obverse side thereof, a first ground pattern formed on almost an entire reverse side of the substrate, a microstrip line formed on the obverse side of the substrate, and a bias line connected to the electronic component on the obverse side of the substrate and formed continuously on the obverse side and the reverse side of the substrate so as to cross the microstrip line on the reverse side of the substrate in plan view so as to supply a bias voltage to the electronic component, wherein the first ground pattern is formed so as to circumvent the bias line formed on the reverse side of the substrate, a portion of the first ground pattern that circumvents the bias line on the reverse side of the substrate is continuously formed on the obverse side of the substrate as a second ground pattern so as to divide the microstrip line in two parts, and a chip jumper is arranged to bridge the two divided parts of the microstrip line over t

Abstract: A circuit assembly (1) and electronic device (30) having a printed circuit board (2), with conductive runners (3) and a ground plane (4). There is electronic circuitry (5) mounted to the circuit board (2) and electrically coupled to the runners (3). The circuit assembly (1) also has a Liquid Crystal Display (6) electrically coupled to the electronic circuitry (5), and a monopole element (7) is mounted on a surface of the Liquid Crystal Display (6) by a dielectric mount (10) that is proximal to an edge (11) of the printed circuit board (2).

Abstract: The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent resistance against cracking under a thermal shock or due to heat cycle. The multilayer printed wiring board is comprised of conductor circuitry layers and interlaminar insulative resin layers deposited alternately one on another, the interlaminar insulative resin layers each having formed through them holes each filled with a plating layer to form a viahole. The surface of the plating layer exposed out of the hole for the viahole is formed substantially flat and lies at a substantially same level as the surface of the conductor circuit disposed in the interlaminar insulative resin layer. The thickness of the conductor circuitry layer is less than a half of the viahole diameter and less than 25 ?m.

Abstract: A circuit board device suppress with a small number of terminal elements unwanted irradiation originating between a power supply layer and a ground layer, even when a configuration of the power supply layer and the ground layer on the circuit board is complex, and a design support device thereof. The circuit board device has a power supply layer and a ground layer disposed in opposition to one another. A dielectric is disposed between the power supply layer and the ground layer. A power supply surface is divided into two power supply surfaces and by a slit having a generally T-shaped configuration to form power supply surface edges. The power supply surface edges retain across a predetermined length L a characteristic impedance present between the power supply layer and the ground layer. A terminal load is connected to a terminal portion of the power supply surface edges.

Abstract: In a flat pin to be used in a circuit board made of resin with pins comprising a rod portion having a diameter of not greater than 0.35 mm and a concentric tabular large diameter portion having a larger diameter than that of the rod portion formed on one end of the rod portion, the ratio (W/S) of the diameter of the large diameter portion to the rod portion is from not smaller than 2.16 to not greater than 2.67 and the ratio (T/S) of the thickness of the large diameter portion to the diameter of the rod portion is from not smaller than 0.40 to not greater than 0.67 supposing that the diameter of the rod portion and the large diameter portion of the flat pin are S and W, respectively, and the thickness of the large diameter portion is T.

Abstract: In an electronic circuit having an integrated circuit (110) having a power supply terminal, a noise filter disposed adjacent to the integrated circuit, and a printed board (101) having a pattern for supplying a power supply to the power supply terminals of the integrated circuit through the noise filter, the noise filter consists of a transmission line type noise filter (121–124) for removing noises having a wide frequency band.