Abstract: A method analyzes an operation of a power semiconductor device. The method includes: providing a set of reference voltages of the power semiconductor device and a set of corresponding reference currents; measuring an on-state voltage and a corresponding on-state current of the power semiconductor device to obtain a measurement point; adapting the set of reference voltages by adapting two of the set of reference voltages lying closest to the measurement point by extrapolating the measurement point; and using the adapted set of reference voltages to analyze the operation of the power semiconductor device. The extrapolation is based on a predefined reference increment current and a predefined reference increment voltage.

Abstract: A probing system includes a chuck configured to support a device under test (DUT); a probe card disposed above the chuck and including a plurality of probes protruding from the probe card toward the chuck; and a platen disposed between the chuck and the probe card and configured to support the probe card, wherein the chuck includes a shielding member disposed between the platen and the chuck.

Abstract: An apparatus and method for testing a circuit board included in a battery management system. The circuit board includes a first test point connected in common to one end of a first resistor, one end of a first capacitor and one end of a second resistor; a second test point connected in common to the other end of the second resistor and one end of a second capacitor; a third test point connected to the other end of the first resistor; and a fourth test point connected in common to the other end of the first capacitor and the other end of the second capacitor. The apparatus determines an open-circuit fault of at least one of the first capacitor and the second capacitor based on a first diagnosis voltage between the first and fourth test points and a second diagnosis voltage between the second and fourth test points.

Abstract: The invention relates to a system in particular a quantum sensor system, for testing a device-under-test, DUT, comprising: an optically excitable medium which is arranged to receive electromagnetic, EM, radiation emitted by the DUT, at least one light source configured to irradiate the medium with at least one light beam, wherein the medium is optically excited by the at least one light beam, a field generator unit configured to generate an electric and/or magnetic field within the medium, wherein a resonance frequency of the excited medium is modified by an amplitude of the electric and/or magnetic field, wherein an optical parameter, in particular a luminescence, of the exited medium is locally modified if a frequency of the EM radiation corresponds to the resonance frequency at a position in the medium, an image detector configured to acquire an image of the medium, wherein the image shows an intensity profile that results from the modification of the optical parameter, a processor configured to analyze th

Abstract: A test module, is provided including a tester that electrically tests a semiconductor device. A device under test (DUT) board is connected to the tester and the semiconductor device. A base board is disposed between the DUT board and the tester. The base board includes a lower plate, a plurality of connection lines that penetrate the lower plate, an upper plate disposed on the lower plate, and a first temperature controller disposed in the base board. The first temperature controller maintains the connection lines at a first temperature. A docking connector is disposed on the first temperature controller. The docking connector connects the connection lines to the DUT board. A second temperature controller is disposed between the first temperature controller and the upper plate. The second temperature controller maintains the docking connector at a second temperature different from the first temperature.

Abstract: Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.

Abstract: A method of testing a semiconductor device having a DC line configured to carry either a DC signal or a DC voltage and a circuit electrically connected to the DC line includes: during a first part of a test sequence, enabling a switch device so as to electrically connect a capacitor to the DC line via the switch device and applying a test signal to the circuit while the capacitor is electrically connected to the DC line; and during a second part of the test sequence, disabling the switch device so as to electrically disconnect the capacitor from the DC line via the switch device, injecting an AC signal onto the DC line after the capacitor is electrically disconnected from the DC line, and measuring a response of the circuit to the AC signal.

Abstract: An accurately positionable computer host power-on detection machine comprises a detection box with an opening on the left side, the detection box is internally connected with a detection discharge block through a lifting device, the right part of the detection discharge block is provided with a positioning interception block, the height of the positioning intercept block is the same as the host and the center of the positioning interception block is provided with a detection port of 0.6-0.8 times the size of the rear side plate of the host, the inner side of the upper plate of the detection box is connected with an upper limit plate through a connecting plate, the detection box is provided with a positioning and clamping device cooperated with the left and right side plates of the host, and the inner side of the right side plate of the detection box is provided with a detection device which enables a detection insert block to move horizontally left and right.

Abstract: A test socket assembly for a semiconductor device used for burn-in testing comprising a base assembly, a floating plate coupled to the base assembly, and a latch assembly mounted on the floating plate for the retention and movement of the semiconductor device. The base assembly further includes a pin assembly for electrically coupling to the semiconductor device for burn-in testing and at least two upstanding flex arms. In addition, the floating plate and the latch assembly move to a test position for accommodating a varying height of the semiconductor device when mating with a test fixture while the latch still effectively retains the semiconductor device. Lastly, the floating plate is held in a fixed load position due to the support provided by the upstanding flex arms when inserting the semiconductor device into the test socket.

Abstract: A test and measurement instrument, including a memory configured to store a waveform data record; one or more processors, and a display. The one or more processors are configured to receive the waveform data record, determine a measurement value and location for a plurality of occurrences of a measurement event in the waveform data record, detect one or more logical path segments in the plurality of occurrences, and generating a visual representation of each measurement value and overlaying each of the visual representations of each measurement value. The visual representations of each measurement value and/or the one or more logical path segments may be displayed on the display.

Abstract: An apparatus for providing a supply voltage to a device under test includes a controlled source configured to provide a voltage in dependence on one or more control signals; a switchable resistor circuited between the output of the controlled source and a DUT port, having first and second resistances in first and second switch states, respectively, the second resistance being smaller than the first resistance; a regulator configured to provide a control signal to the controlled source, to regulate a voltage to be provided to the DUT in dependence on information about a desired voltage; a capacitor circuited in parallel to the switchable resistor at least during switching of the switchable resistor and configured to slow a voltage change across the switchable resistor which is caused by changing a switch state of the switchable resistor; the apparatus being configured to change a switch state of the switchable resistor while a voltage is provided to the DUT via the switchable resistor.

Abstract: A testing device (100) is for electrically testing integrated circuits on a wafer (102). The testing device (100) includes a vacuum chamber (109), a chuck (101) for holding the wafer (102), a probe card (103) for electrically contacting the integrated circuits, and a radiation shield (107) arranged inside the vacuum chamber (109) and enclosing the chuck (101) and the probe card (103). In the testing device (100), the vacuum chamber (109) is provided with a gate valve (123), the radiation shield (107) is provided with a hatch (122), and the testing device (100) includes a wafer loading assembly (125) for loading the wafer (102) onto the chuck (101) through the gate valve (123) and the hatch (122).

Abstract: A probe device according to an embodiment is a probe device for inspecting electrical characteristics of an inspection target object, mounted on a mounting table, by electrically contacting probes and the inspection target object to each other. The probe device includes a support base having on an upper surface thereof a needle trace transfer member for transferring needle traces of the probes, a fixed support portion extending from a side of the mounting table and configured to fix and support the support base from below, and a movable support unit that is disposed below the support base and is configured to be moved up and down to be in contact with the support base and movably support the support base.

Abstract: A method and an apparatus for detecting a micro short circuit of a battery are provided. The detection method includes: obtaining a first reference charge capacity at a first charging end moment and a second reference charge capacity at a second charging end moment of a to-be-detected single battery included in a to-be-detected battery pack (S201), where the reference charge capacity is a difference between an electric quantity of the to-be-detected single battery and an electric quantity of a reference single battery, and the reference single battery is a single battery, which has a largest voltage value at a charging end moment, in all single batteries included in the to-be-detected battery pack; and determining, based on a difference between the first reference charge capacity and the second reference charge capacity, that a micro short circuit occurs in the to-be-detected single battery.

Abstract: A work machine includes a control device including a lead position detecting section to detect a lead position which is positions of a pair of leads based on imaged data imaged by an imaging device, a first detecting region setting section to set, based on the lead position detected by the lead position detecting section, a first detecting region outside the pair of leads including a part of a bottom section outside the pair of leads, a second detecting region outside the pair of leads, being opposed to the first detecting section across the pair of leads including a part of the bottom section, and a polarity determining section configured to determine the polarity of the pair of leads based on whether the mark portion exists in each of the first detecting region and the second detecting region.

Abstract: A system for monitoring the charging performance of a capacitor in an electric circuit in a manufacturing machine installed in a production line includes a charging voltage detecting section for detecting the charging voltage of the capacitor. A control device of the production machine measures, as the charging time, a time from starting charging to a time when a specified charging complete determination voltage that can be used to determine when the charging voltage of the capacitor has reached full charge is reached based on the charging voltage of the capacitor detected by charging voltage detecting section, determines whether the capacitor has deteriorated by determining whether the measured charging time is equal to or less than a specified deterioration threshold value, and upon determining that the capacitor has deteriorated, issues a warning to an operator via a display or sound.

Abstract: An electrical connection device includes: a plurality of probes (10) in which distal end portions contact an inspection object (2) during measurement; and a space transformer (30) including a plurality of connection wirings (33), in each of which a first terminal electrically connected to any of proximal end portions of the plurality of probes (10) is arranged on a first main surface (301), and a second terminal is exposed to a second main surface (302), and having a short-circuit wiring pattern formed on the first main surface, the short-circuit wiring pattern electrically connecting, to the same connection wiring (33), proximal end portions of a plurality of same-potential probes (10) set at a same potential during measurement among the plurality of probes (10).

Abstract: A position detection device includes a first magnetic field generation unit for generating a first magnetic field, a second magnetic field generation unit for generating a second magnetic field, and a magnetic sensor. The position of the second magnetic field generation unit relative to the first magnetic field generation unit is variable. The magnetic sensor detects the direction of a target magnetic field at a detection position in a reference plane. The target magnetic field is a composite magnetic field of first and second magnetic field components which are respective components of the first and second magnetic fields parallel to the reference plane. The magnetic sensor includes a magnetoresistive element including a free layer and a magnetization pinned layer. In the reference plane, two directions orthogonal to the magnetization direction of the magnetization pinned layer are each different from both of directions of the first and second magnetic field components.

Abstract: A load pull system for making measurements on a DUT at millimeter wave frequencies using active tuning. The system uses phase and amplitude control of each signal at low frequency before being upconverted to the millimeter wave measurement frequencies. The measured signals at the DUT plane may be down-converted for measurement with a low frequency analyzer.

Abstract: A low frequency active load pull tuner allows creating and controlling the reflection factor in a different frequency range than the operation frequency. It includes an active feedback loop and a remotely controlled digital electronic tuner, wherein the electronic tuner operates at an ordinary octave wide (Fmax/Fmin=2) frequency range (i.e. as an example 1-2 GHz), which leads to a low intermediate frequency band of 6 octaves or more. All required MHz range components for the tuner, except the custom-made digital electronic tuner, are readily available.