Abstract: A chip testing method for being implemented by a chip testing system includes: a chip mounting step implemented by using a chip mounting apparatus to respectively dispose a plurality of chips onto electrical connection sockets of a chip testing device; a moving-in step implemented by transferring the chip testing device carrying the chips into one of accommodating chambers of an environment control apparatus; a temperature adjusting step implemented by controlling a temperature adjusting device of the one of the accommodating chambers so that the chips are in an environment having a predetermined temperature; and a testing step implemented by providing electricity to the chip testing device, so that each testing module of the chip testing device performs a predetermined testing process on the chips on the corresponding electrical connection sockets connected thereto.

Abstract: An inspection equipment is used for inspecting an antenna, and includes a testing device having a first circuit structure, a carrier, a supporting part and a second circuit structure detachably stacked on one another sequentially. Therefore, the carrier, the first circuit structure, the second circuit structure or the supporting part can be detached when different devices under test are inspected, without replacing the whole testing device, thereby achieving effects of modular replacing and cost saving.

Abstract: An inspection method of a present electrical storage device includes: constituting a circuit with the electrical storage device being charged and a power supply, and passing a current by the power supply to the circuit in a direction of charging or discharging the electrical storage device; and in passing the current, determining the quality of the electrical storage device based on a converging state of the passing current. In passing the current, an output voltage of the power supply is changed from an initial value with the passage of time.

Abstract: The present invention provides an electrically isolated acquisition of a measurement signal by means of a measurement probe. For this purpose, a probe arrangement is provided with a probe head for electrically measuring a signal. The probe head is coupled to a probe coupler via optical links. In particular, optical links are used for power supply of the probe head and for forwarding optical signals corresponding to the measured electrical signal.

Abstract: The present invention provides a testing device for electrically testing integrated circuits on a wafer. The testing device comprises a vacuum chamber, a chuck for holding the wafer, a probe card for electrically contacting the integrated circuits, means for moving the chuck relative to the probe card, a first radiation shield arranged inside the vacuum chamber and enclosing the chuck and the probe card, and a cooling unit thermally connected to the first radiation shield. The means for moving the chuck relative to the probe card comprises a supporting column having a first end and a second end, the first end of the supporting column being attached to the chuck, and the first radiation shield comprises a first fixed part having a first aperture through which the supporting column is arranged to pass, and a first movable part that is attached to the supporting column and arranged to cover the first aperture.

Abstract: Various embodiments are described herein for a testing system for performing burn-in testing of electronic devices under a test temperature range using at least one test chamber and a tester. The at least one test chamber is doorless and has a frame defining a chamber opening for receiving at least one burn-in board containing the electronic devices. The tester includes a main frame, a plurality of carrier magazines mounted to the main frame and containing the at least one burn-in board containing the electronic devices, a door panel at a front end of the tester to allow for access into the tester; and a wall panel disposed on a surface opposite the door panel. The wall panel is placed adjacent and secured to the chamber opening of the at least one test chamber to provide an air and temperature seal during testing.

Abstract: A measuring system for measuring signals with multiple measurement probes comprises a multi probe measurement device comprising at least two probe interfaces that each couple the multi probe measurement device with at least one of the measurement probes, a data interface that couples the multi probe measurement device to a measurement data receiver, and a processing unit coupled to the at least two probe interfaces that records measurement values via the at least two probe interfaces from the measurement probes, wherein the processing unit is further coupled to the data interface and provides the recorded measurement values to the measurement data receiver, and a measurement data receiver comprising a data interface, wherein the data interface of the measurement data receiver is coupled to the data interface of the multi probe measurement device.

Abstract: A power distribution network monitoring system includes a CT sensor and a power management device. The CT sensor includes a measurement component and a transmitter. The measurement component is installed at a plurality of predetermined positions along a power line constituting the power distribution network, and measures current of the power line at each predetermined position. The transmitter wirelessly transmits, as transmission data, the power spectrums of the fundamental wave, third harmonic, and fifth harmonic, as well as the effective current values used to detect abnormalities in the power distribution network, the data being at least part of the data measured by the measurement components. The power management device includes a receiver and a management database. The receiver receives the transmission data. The management database stores the received data.

Abstract: Provided is a diagnostic device for a coil including a voltage application unit applying an impulse voltage to the coil; a response voltage detection unit detecting a response voltage from the coil with respect to the impulse voltage; an index calculation unit calculating a determination index indicating an electrical feature of the coil based on the response voltage; and a determination unit determining whether there is an abnormality in a target coil to be diagnosed by comparing the determination index of a reference coil that is the coil that is normal and the determination index of the target coil. At least one of a zero cross point at which the response voltage intersects with a reference voltage and a peak voltage on a positive side and a negative side of the response voltage is used as the determination index, in addition to a circuit constant of the coil.

Abstract: Example circuitry includes a first circuit to provide a low signal; a second circuit to provide a high signal, where the high signal has a greater voltage magnitude than the low signal; and a differential amplifier configured to receive the low signal from the first circuit and the high signal from the second circuit. The differential amplifier is for producing an output voltage that is based on the high signal and the low signal. The example circuitry includes a first measurement circuit to measure the output voltage; a second measurement circuit to measure the low signal at the first circuit; and processing logic to determine a differential measurement based on the output voltage measured by the first measurement circuit, the low signal measured by the second measurement circuit, and calibration values obtained for the circuitry.

Abstract: Provided are a monitoring device and method. A monitoring device includes a laser processor configured to emit a processing laser beam to perform a melting annealing process on a wafer; a laser monitor configured to emit a monitoring laser beam onto the wafer while the laser processor performs the melting annealing process, the laser monitor configured to measure reflectivity of the wafer; and a data processor configured to process data on the reflectivity measured by the laser monitor, and monitor one or more characteristics of the wafer based on the data on the reflectivity.

Abstract: A system includes a power supply configured to adjust a voltage supplied to a device under test (DUT) based on one of an input voltage of the DUT supplied to a power supply sense input of the power supply and a feedback signal indicative of an internal voltage of the DUT supplied to the power supply sense input, and a relay circuit configured to transition between supplying the input voltage to the power supply sense input and supplying the feedback signal to the power supply sense input. When supplying the feedback signal to the power supply sense input, the relay circuit establishes an electrical path between the input voltage and the power supply sense input to prevent the power supply sense input from floating during the transition.

Abstract: A single-phase electric meter having a phase conductor intended to be connected to a phase of an electric line located upstream of the single-phase electric meter and to a phase of an electric installation located downstream of the single-phase electric meter, the single-phase electric meter further including a breaking unit mounted on the phase conductor, an upstream voltage sensor arranged to periodically measure an upstream voltage upstream of the breaking unit, and a processing device arranged to acquire upstream voltage measurements and to open the breaking unit when the upstream voltage drops below a first predetermined threshold voltage.

Abstract: A sensor system includes an eddy current sensor including at least one coil with excitation electronics coupled across the coil. An optical displacement sensor is secured to the eddy current sensor so that a vertical distance between the sensors is fixed. The optical displacement sensor is located on top of and concentric with the coil so that a measurement axis of the optical displacement sensor is collinear with an axis of symmetry of the coil. A computing device including a processor and memory is coupled to receive sensor data from the eddy current sensor and the optical displacement sensor that is adapted for analyzing the sensor data obtained from measuring a coated substrate including a coating layer on at least one side of a metal substrate to determine at least a thickness of the coating layer.

Abstract: Disclosed is a camera module inspector of rotating type distributing a load of processing test raw data. In an exemplary embodiment, the camera module inspector of rotating type includes a rotary index table including a plurality of socket units, a plurality of testers arranged around the rotary index table, a plurality of test control processors connected to correspond to the plurality of socket units, respectively, to be fixed on the rotary index table, a network connection unit establishing network connections with respect to the plurality of test control processors, a redundancy check processor processing the test raw data faster than the test control processor, connected to the network connection unit and data controller test raw data requiring a great deal of processing time out of the test raw data generated in the plurality of test control processors to be transmitted to the redundancy check processor through the network connection unit.

Abstract: An inspection device is provided, which is capable of detecting a short circuit failure even when a connector is provided on a wiring board. The inspection device is configured to inspect a short circuit failure generated at any connected part of a plurality of pins 153 to a wiring board via solder. The plurality of pins 153 is included in a connector provided on the wiring board. The inspection device includes: a wiring 11 connected to certain pins 153 of the plurality of pins 153; a second wiring 12 connected to remaining pins 153 of the plurality of pins 153; and a tester unit connected to the first wiring 11 and to the second wiring 12 so as to inspect insulation between the certain pins 153 and the remaining pins 153.

Abstract: A digitally controlled hybrid (active-passive) tuning system includes a passive slide screw tuner using a slabline in which also fixed and adjustable signal couplers (wave-probes) are mounted, leading to and from an active feedback loop, digitally controlled using an electronic tuner. The wave-probes control the static amplitude and phase of the feedback signal and the electronic tuner controls the actual dynamic (high speed) amplitude and phase of the re-injected signal. The slide screw tuner serves as an additional static pre-matching for reducing the required feedback injection power. Appropriate passive and active calibration and search routines allow identifying tuner states satisfying DUT parameter targets.

Abstract: Provided is a probe device used for electrical inspection of a printed wiring board, the probe device including at least one probe group including a plurality of wire probes configured to be able to simultaneously abut against a wire provided on the printed wiring board and extending in a specified direction, the plurality of wire probes abutting against the wire along the direction and being electrically connected to each other.

Abstract: A sensor device for detecting voltage in a conductor cable includes a sense electrode to be disposed over a surface of the conductor cable to cover a sense region having a sense axial width and a sense circumferential length and a reference electrode to be disposed over the surface of the conductor cable to cover a reference region. The reference region has an axial position adjacent the axial position of the sense region and has a reference circumferential length greater than the sense circumferential length. The sensor device further includes a charge measurement circuit connected in series between the sense electrode and the reference electrode to measure a charge measurement and circuitry to compare the charge measurement to a threshold to detect a presence of the voltage in the conductor cable.

Abstract: A device for testing performance of main boards of electronic devices includes a housing, two bases, a control device, a humidifier, a heating device, and a refrigerating device. A cavity in the housing comprises separated first and second portions. The heating device is interconnected with the first portion to create a predefined high temperature environment and the refrigerating device is interconnected with the second portion to create a predefined low temperature environment. The humidifier is interconnected with the first portion and the second portion, and configured to create predefined degrees of humidity respectively in the first portion and the second portion. The bases are inside the first portion and the second portion, and electrically connected to the control device.