Abstract: An electronic device, a signal validator, and a method for signal validation are provided. The electronic device includes a circuit board generating a plurality of signals and a signal validator. The signal validator records a current voltage level of each signal as a sequence code and records a time interval between the sequence code and a previous sequence code as a delay time corresponding to the sequence code when a voltage level of one of the plurality of signals changes. The signal validator sequentially determines whether the sequence code matches with a prearranged sequence code. When the sequence code matches with the prearranged sequence code, the signal validator determines whether each delay time corresponding to each sequence code exceeds a predetermined delay time. When the delay time is less than the predetermined delay time, the signal validator determines that the plurality of signals passes signal validation.

Abstract: The disclosure relates to a test system for improving test stability. One end of the connection pin is fixed to a bottom surface of a corresponding pin socket, the bottom surface is near an end of the plug end, the other end of each connection pin is disposed in the corresponding pin socket and a portion of the other end of the connection pin protrudes from a top surface of an end of the plug end. The connection pin in the plug end will not be deformed by external force, which can avoid the deformation of the connection pin caused by external force, and ensure the electrical connection and test stability.

Abstract: A sensor device may include a rotor, a stator disposed outside the rotor and a sensor module disposed outside the stator. The rotor may include a sleeve and a magnet coupled to the sleeve, and the magnet may be disposed inside the sleeve. The sleeve may include a fixing part which protrudes from an end of the sleeve and is in contact with the magnet. The sleeve includes a second body, and a third body. The second body is disposed to cover an upper surface of the magnet, and the third body is disposed to cover an outer circumferential surface of the magnet. The magnet is disposed between the shaft and the third body, thereby providing an advantageous effect of increasing a coupling force between the magnet of the rotor and a yoke.

Abstract: A method of screening a lot of capacitors is provided. The method includes measuring a first leakage current of each individual capacitor in a first set of capacitors and calculating a first mean leakage current; removing each of the individual capacitors having a measured first leakage current equal to or above a first predetermined value, forming a second set of capacitors; subjecting the second set of capacitors to a burn in treatment; measuring a second leakage current for each of the individual capacitors in the second set and calculating a second mean leakage current; comparing the second leakage current for each of the individual capacitors to the first leakage current for each of the individual capacitors; and removing each of the individual capacitors having a second leakage current equal to or above a second predetermined value and/or having a second leakage current that does not change by a specified amount compared to the first leakage current for each of the individual capacitors.

Abstract: A detector of microwave radiation includes a signal input and a detector output. An absorber element of ohmic conductivity is coupled to said signal input through a first length of superconductor. A variable impedance element, the impedance of which is configured to change as a function of temperature, is coupled to the detector output through a second length of superconductor. The detector also includes a heating input and a heating element coupled to the heating input through a third length of superconductor. The absorber element, the variable impedance element, and the heating element are coupled to each other through superconductor sections of lengths shorter than any of said first, second, and third lengths of superconductor.

Abstract: Methods and systems for collecting operational data from a target digital system are disclosed. In some embodiments, a method includes determining a test configuration to be used to configure a probe circuit. Determining the test configuration may include selecting one or more signal sources, defining one or more signal patterns within the selected signal sources, and defining one or more trigger events associated with the one or more signal patterns. Based on the test configuration, the probe circuit selects input/output (I/O) channels for a test cycle and captures one or more traces from the selected I/O channels during the test cycle.

Abstract: The present disclosure provides for a kit-less pick and place handler which conducts thermal testing of at least one device. An exemplary handler includes a thermal soak plate, a first prime mover, a second prime mover, a test site actuator, and a test contactor. The thermal soak plate can receive devices and maintain an accurate position of the devices using a friction between the thermal soak plate and the device. The test contactor can electrically contact the device. The first prime mover can place the device on the thermal soak plate. The second prime mover can carry the device to the test contactor, hold the device during thermal testing, and move the device from the test contactor. The test site actuator can exert force on the second prime mover during thermal testing.

Abstract: To provide a magnetic sensor element and a magnetic sensor device that can be easily manufactured and can reduce a loss of light to the extent possible. The above-described problem is solved by a magnetic sensor element comprising a planar lightwave circuit (11) provided with a light branching part (12), an input optical fiber (19) and an output optical fiber (20) connected to the planar lightwave circuit (11), a metal magnetic body type light transmitting film (30) that is provided on one end surface of the planar lightwave circuit (11) and transmits light entered from the input optical fiber (19), and a reflecting film (40) that is provided on the metal magnetic body type light transmitting film (30) and reflects the transmitted light. The output optical fiber (20) is a polarization-plane maintaining optical fiber, and the input optical fiber (19) and the output optical fiber (20) are aligned and connected to the planar lightwave circuit (11).

Abstract: Systems and methods of detecting non-uniform aging and degradation of power assembly units are disclosed. The system may include a first power assembly unit and a second power assembly unit adjacent to the first power assembly unit. Each of the first and second power assembly units has a coupling capacitor and a number of electrical components. The system may further include a current sensor in between the coupling capacitors of the first and second power assembly units to detect a current spike in the coupling capacitors and the electrical components.

Abstract: A deskew fixture includes first and second deskew probe points for contacting first and second probes, respectively, during deskew calibration, a signal generating circuit for generating a calibration signal provided to the first and second deskew probe points, and a feedback loop for automatically self-calibrating the deskew fixture. The feedback loop includes first and second analog to digital converters (ADCs) for digitizing the calibration signal at the first and second deskew probe points while contacting the first and second probes, respectively, to provide first and second digitized calibration signals, and a processing unit programmed to determine inherent skew of the deskew fixture between the first and second skew probe points using the first and second digitized calibration signals, and to provide the determined inherent skew to a test instrument for use in the deskew calibration of the first and second probes.

Abstract: A method of monitoring a condition of a SiC MOSFET can include (a) applying a first test gate-source voltage across a gate-source of a SiC MOSFET in-situ, the first test gate-source voltage configured to operate the SiC MOSFET in saturation mode to generate a first drain current in the SiC MOSFET, (b) applying a second test gate-source voltage across the gate-source of the SiC MOSFET in-situ, the second test gate-source voltage configured to operate the SiC MOSFET in fully-on mode to generate a second drain current in the SiC MOSFET, (c) determining a drain-source saturation resistance using the first drain current to provide an indication of a degradation of a gate oxide of the SiC MOSFET; and (d) determining a drain-source on resistance using the second drain current to provide an indication of a degradation of contact resistance of the SiC MOSFET.

Abstract: An apparatus for inspecting an electronic device, includes: a placement table on which a substrate having the electronic device provided thereon is placed and including a refrigerant flow path; a light irradiation mechanism having LEDs directed to the substrate; and a controller for controlling heat absorption by the refrigerant and heating by light from the LEDs. The controller includes: a temperature information acquisition part for acquiring information on a temperature of the electronic device; a heating controller for performing the heating control based on the temperature of the electronic device as a current inspection object; and a heat absorption controller for estimating a transition of power applied to the electronic device at a next inspection based on a transition of the temperature of the electronic device in a past inspection, and performing the heat absorption control at a time of the next inspection.

Abstract: Heat spreaders for use in semiconductor device testing, such as burn-in testing, are disclosed herein. In one embodiment, a heat spreader is configured to be coupled to a burn-in testing board including a plurality of sockets. The heat spreader includes a base portion and a plurality of protrusions extending from the base portion. When the heat spreader is coupled to the burn-in testing board, the protrusions are configured to extend into corresponding ones of the sockets to thermally contact semiconductor devices positioned within the sockets. The heat spreader can promote a uniform temperature gradient across the burn-in board during testing of the semiconductor devices.

Abstract: According to an embodiment, a semiconductor integrated circuit device has a first switching element that is connected between first and second nodes, a second switching element that is connected between the first node and a third node and outputs a current that is 1/K times as much as an output current of the first switching element, and an amplifier that controls, by a signal provided by amplifying a voltage difference between the third node and a fourth node, a conduction state of a third switching element that is connected between the fourth node and a fifth node.

Abstract: Double-sided probe systems with thermal control systems and related methods. Thermally-controlled, double-sided probe systems include a probe assembly configured to test one or more devices under test (DUTs) of a substrate and a chuck configured to support the substrate. The probe assembly includes a thermal control system configured to at least partially control a substrate temperature of the substrate while the probe assembly tests the DUT(s). The chuck is configured to support the substrate such that the probe assembly has access to each of a first substrate side of the substrate and a second substrate side of the substrate while the substrate is operatively supported by the chuck. In some examples, methods of operating double-sided probe systems include regulating the substrate temperature with the thermal control system.

Abstract: A device having at least one power semiconductor die coated with a metallization and at least one light guide having two opposite ends. The first end is able to be connected at least to a light source and to a light receiver. The second end is permanently fixed facing to a surface of the metallization such that to form a light path towards said surface and a light path from said surface.

Abstract: One example relates to a monitoring circuit that includes a capacitive digital-to-analog converter that receives a binary code, a reference voltage, a monitored voltage, and a ground reference, the capacitive digital-to-analog converter outputting an analog signal based on the binary code, the reference voltage, the monitored voltage, and the ground reference. The monitoring circuit further includes a comparator including a first input coupled to receive the analog signal and a second input coupled to the reference voltage, the comparator comparing the analog signal to the reference voltage and outputting a comparator signal based on the comparison. The monitoring circuit yet further includes a binary code generator that generates the binary code based on the comparator signal, the binary code approximating a magnitude of the monitored voltage.

Abstract: The present disclosure refers to a method of measuring resistance of the resistive sensor (5), where the value of resistance of the resistive sensor (5) is determined from its series connection with actively controlled resistor network (3) with selectable value of resistance and with a periodic waveform voltage source (7), and further a device for measuring resistance of the resistive sensor (5) including a periodic waveform voltage source (7), actively controlled resistor network (3), and a resistive sensor (5), wherein the terminals of the periodic waveform voltage source (7) are connected to the first node (2) and the third node (6), terminals of actively controlled resistor network (3) are connected to the first node (2) and the second node (4), and terminals of the resistive sensor are connected to the second node (4) and the third node (6), thus forming a connection in a resistive voltage divider with an automatic selection of one resistor of the divider, and usage of this method for measuring time-vary

Abstract: A chip testing device and a chip testing system are provided. The chip testing system includes a chip testing device and a plurality of environment control apparatuses. A plurality of electrical connection sockets are disposed on one side of a circuit board, and a plurality of testing modules are disposed on another side of the circuit board. A first fixing member and a second fixing member fix the electrical connection sockets on one side of the circuit board, and no screwing members are required to be screwed between the electrical connection sockets and the circuit board. Each of the electrical connection sockets with a chip disposed thereon can be disposed in a high temperature environment or a low temperature environment for testing along with the chip testing device, so that each of the chips does not need to be detached repeatedly.

Abstract: A temperature compensation method for a SAR sensor (3) of a terminal, and a terminal are disclosed. The terminal comprises: a temperature sensing unit (1), a processor (2), and an SAR sensor (3); the temperature sensing unit (1) is configured to send a first trigger signal to the processor (2) in response to detecting that a temperature change amount of the SAR sensor (3) exceeds a preset value; the processor (2) is configured to send a first temperature control signal to the SAR sensor (3) upon receiving the first trigger signal; and the SAR sensor (3) is configured to activate a second-order temperature compensation of the SAR sensor (3) according to the first temperature control signal, and the second-order temperature compensation compensates for baseline data of the SAR sensor (3) together with a first-order temperature compensation of the SAR sensor (3).