Abstract: Systems, methods, and apparatus related to memory devices. In one approach, a memory device has a memory array including memory cells. A controller of the memory device evaluates background leakage in order to select a write voltage to apply to a memory cell when performing a programming operation. The write voltage is dynamically selected from two or more write voltages. These write voltages include a first write voltage that is a normal or default voltage, and a second write voltage that is a boosted write voltage. The controller applies a pre-sensing voltage and pre-read voltage to the memory cell, and determines first and second respective currents that result from applying these voltages. In response to determining that the first current exceeds a first threshold (indicating background leakage), and the second current is below a second threshold that is greater than the first threshold (indicating that the memory cell does not snap), the controller selects the second (boosted) write voltage.

Abstract: A data storage device having a reduced overhead according to an embodiment of the disclosed technology may include a plurality of memory chips each including a plurality of planes, and a memory controller configured to perform recovery algorithms that recover data corresponding to failed read operations among read operations performed on the plurality of memory chips, and the memory controller may generate a read voltage to be used in a first recovery algorithm using an address related to a selected read operation among the failed read operations and perform the first recovery algorithm on a memory location associated with the failed read operations using the read voltage.

Abstract: A non-volatile memory device is disclosed. The non-volatile memory device comprises an array of flash memory cells comprising a plurality of flash memory cells organized into rows and columns, wherein the array is further organized into a plurality of sectors, each sector comprising a plurality of rows of flash memory cells, and a row driver selectively coupled to a first row and a second row.

Abstract: A semiconductor device includes a monitoring circuit suitable for generating a monitoring signal indicating whether a speed of a memory clock signal is changed based on a speed information signal representing speed information of the memory clock signal; a cycle control circuit suitable for generating a refresh cycle control signal for controlling a refresh cycle based on a system clock signal, the memory clock signal, the monitoring signal and a refresh flag signal; and a control circuit suitable for generating the memory clock signal and the refresh flag signal based on the speed information signal, the system clock signal and the refresh cycle control signal.

Abstract: A memory sub-system includes a power management integrated circuit (PMIC) compatible with operation at an uppermost PMIC supply voltage that is lower than a primary supply voltage of the memory sub-system. The PMIC is configured to output multiple voltages for operation of the memory sub-system based on a PMIC supply voltage. The memory sub-system further includes a capacitive voltage modifier (CVM) coupled to the PMIC. The CVM is configured to receive the primary supply voltage of the memory sub-system as an input and provide a first modified primary supply voltage (MPSV) to the PMIC as the PMIC supply voltage, where the first MPSV is not higher than the uppermost PMIC supply voltage.

Abstract: Apparatuses and techniques are described for avoiding current consumption peaks during a program operation for a memory device. The timing of scan operations of latches is adjusted to avoid overlapping with an increase in word line voltages. The scan operations can include a pre-charge select scan, which identifies memory cells subject to a verify test, and a fill operation for latches of memory cells which fail a verify test in a prior program loop. The pre-charge select scan can occur before the increase in the word line voltages, while the fill operation occurs after the increase in word line voltages. In another approach, the start of the increase in the word line voltages is delayed when a state bit scan is expected to take a relatively long time, e.g., when a verify test is passed in a prior program loop.

Abstract: Provided are a memory device and an operation method thereof. The memory device includes a plurality of word lines. The operation method comprising: performing a pre-fill operation on the word lines, in a first loop, applying a selected word line voltage on a first selected word line group and applying an unselected word line voltage on a first unselected word line group, and in a second loop, applying the selected word line voltage on a second selected word line group and applying the unselected word line voltage on a second unselected word line group, the first selected word line group being different from the second selected word line group, and the first unselected word line group being different from the second unselected word line group; performing an erase operation on the word lines; and performing a programming operation on the word lines.

Abstract: Methods, systems, and devices for accessing a multi-level memory cell are described. The memory device may perform a read operation that includes pre-read portion and a read portion to access the multi-level memory cell. During the pre-read portion, the memory device may apply a plurality of voltages to a plurality of memory cells to identify a likely distribution of memory cells storing a first logic state. During the read portion, the memory device may apply a first read voltage to a memory cell based on performing the pre-read portion. The memory device may apply a second read voltage to the memory cell during the read portion that is based on the first read voltage. The memory device may determine the logic state stored by the memory cell based on applying the first read voltage and the second read voltage.

Abstract: Embodiments of the present disclosure relate to a memory system and an operating method thereof. According to the embodiments of the present disclosure, the memory system may store target data to be programmed in a memory device in a first memory, selectively store the target data in a second memory, program the target data stored in the first memory into the memory device, and reprogram the target data stored in the first memory or the second memory into the memory device when the programming of the target data stored in the first memory into the memory device fails. The buffer circuit may input the target data input from the memory controller into the second memory or discard the target data.

Abstract: Memory device systems and methods for using methods include multiple access lines arranged in a grid. Multiple memory cells are located at intersections of the access lines in the grid. Multiple drivers are included with each configured to transmit a corresponding signal to respective memory cells of the multiple memory cells. Remapping circuitry is configured to remap a near memory cell of the multiple memory cells to a far memory cell of the multiple memory cells. The near memory cell is relatively nearer to a respective driver of the multiple drivers than the far memory cell is to a respective driver of the multiple drivers.

Abstract: A memory apparatus and method of operation is provided. The apparatus includes a block of memory cells each connected to one of a plurality of word lines and arranged in strings and configured to retain a threshold voltage. A control circuit couples to the word lines and the strings determines a program lower tail voltage of a distribution of the threshold voltage following a first program pulse. The control circuit calculates a second program voltage of a second program pulse based on the program lower tail voltage and applies the second program pulse to each of selected ones of the plurality of word lines associated with the memory cells to program the memory cells such that the distribution of the threshold voltage of the memory cells have a desired program lower tail voltage without further program pulses.

Abstract: A method of operating a storage device including a non-volatile memory includes storing program and erase counts of the non-volatile memory as metadata in units of super blocks, wherein each of the super blocks includes a pre-defined number of blocks of the non-volatile memory, performing a read operation on a first block included in a first super block based on a first read level, storing the first read level as a history read level of the first super block in a history buffer when the read operation on the first block is successful, receiving a read request for a second block of the first super block and an address of the second block from a host, and performing a read operation on the second block based on the history read level stored in the history buffer. The pre-defined number is at least two.

Abstract: A memory sub-system includes a power management integrated circuit (PMIC) compatible with operation at an uppermost PMIC supply voltage that is lower than a primary supply voltage of the memory sub-system. The PMIC is configured to output multiple voltages for operation of the memory sub-system based on a PMIC supply voltage. The memory sub-system further includes a capacitive voltage modifier (CVM) coupled to the PMIC. The CVM is configured to receive the primary supply voltage of the memory sub-system as an input and provide a first modified primary supply voltage (MPSV) to the PMIC as the PMIC supply voltage, where the first MPSV is not higher than the uppermost PMIC supply voltage.

Abstract: A program method of a nonvolatile memory device including receiving a write address and write data, generating a seed corresponding to the write address, generating a random sequence by using the seed, randomizing the write data by using the random sequence, and programming the randomized write data to a memory area corresponding to the write address may be provided. The seed may provide state shaping variable depending on a location of a word line, at which the received write data is to be programmed.

Abstract: According to one embodiment, a memory system includes a semiconductor memory having a plurality of memory cells and a memory controller that controls the semiconductor memory to perform write and read operations and a read operation. The memory controller causes the semiconductor memory to execute a first write operation using a first voltage, detects, in a read operation, first memory cells among the plurality of memory cells that have a threshold voltage higher than a voltage value corresponding to data to be stored and sets a second voltage used for a second write operation after the first write operation based on a detection result of the first memory cells.

Abstract: Memory might include a controller configured to cause the memory to apply a boost voltage level to each capacitance of a plurality of capacitances each connected to a respective node of a sense circuit, selectively discharge each of the nodes through respective memory cells selected for a sense operation, measure a current demand of the plurality of capacitances while each of the nodes is connected to its respective memory cell, determine a deboost voltage level in response to the measured current demand, apply the deboost voltage level to each capacitance of the plurality of capacitances, and determine a respective data state of each memory cell of the plurality of memory cells while the deboost voltage level is applied to each capacitance of the plurality of capacitances.

Abstract: The present disclosure relates to a memory device may include a plurality of memory cells coupled to a selected word line and to be programmed to one of first to n-th program states distinguished from each other based on threshold voltages thereof, a sensing latch storing data sensed from a bit line coupled to one memory cell, a pre-latch storing pre-verify information and a plurality of data latches storing data to be stored in the one memory cell, wherein at least one data latch stores main verify information on the main verify voltage during verify operations for the first program state to a threshold program state among the first to n-th program states until the verify operation for the threshold program state passes, and wherein the pre-latch stores the main verify information on the n-th program state after the verify operation for the threshold program state passes.

Abstract: A memory device includes a communication circuit configured to communicate a first signal and a second signal; and a selection mechanism coupled to the communication circuit and configured to select between operating the communication circuit the first signal and the second signal (1) independent signals for separate memory operations or (2) a complementary set for a memory operation.

Abstract: A flash memory system includes a memory controller, flash memory, power supply circuit, and control circuit. The power supply circuit includes a power supply terminal fed with external power, a step-up circuit for boosting a first voltage associated with the external power and thereby generating a second voltage higher than the first voltage, a capacitor charged at the second voltage, and a first step-down circuit for lowering the second voltage and thereby generating a third voltage lower than the second voltage, and supplying the generated third voltage to the flash memory as the operating voltage. The control circuit includes a circuit for controlling the active or inactive state of the flash memory based on the level of the third voltage, and a circuit for controlling the active or inactive state of the memory controller based on both the levels of the voltage of the external power and the third voltage.

Abstract: According to one embodiment, a semiconductor integrated circuit includes a first circuit, a second circuit, a third circuit, and a switch circuit. The second circuit is different from the first circuit. The third circuit is configured to adjust a timing of an edge of a signal. The switch circuit is configured to connect the third circuit to the first circuit in a case where a first signal is output from the first circuit to an outside of the semiconductor integrated circuit, and configured to connect the third circuit to the second circuit in a case where a second signal is output from the second circuit to the outside, the second signal being different from the first signal.