Abstract: A semiconductor integrated circuit includes: a first circuit, a second circuit, a third circuit, and a first switch circuit. The first circuit is configured to output a first signal. The second circuit is configured to output a second signal different from the first signal. The third circuit is configured to output a third signal corresponding to either the first signal or the second signal. The first switch circuit is configured to output the third signal to the first circuit in a case that the first circuit outputs the first signal. The first switch circuit is configured to output the third signal to the second circuit in a case that the second circuit outputs the second signal.

Abstract: A memory device includes a memory cell region including a first metal pad, a peripheral circuit region including a second metal pad and vertically connected to the memory cell region by the first and second metal pads, a memory cell array in the memory cell region including cell strings including memory cells, word lines respectively connected to the memory cells, bit lines connected to one side of the cell strings, and a ground selection line connected to the cell strings, a control logic in the peripheral circuit region including a precharge control circuit for controlling precharge on partial cell strings among the cell strings and controlling a plurality of data program steps on the memory cells, and a row decoder in the peripheral circuit region for activating at least some of the word lines in response to a control of the control logic.

Abstract: A write cycle recording device includes a storage device and a controller. The storage device is corresponding to a memory block of a non-volatile memory. The storage device has a plurality of bits for recording a plurality of recorded writing loop counts corresponding to a plurality of writing operations of the memory block. The controller is configured to: perform a writing operation on the memory block; record a performed writing loop count of the writing operation; and, update a recorded writing loop count corresponding to the writing operation in the storage device according to the performed writing loop count.

Abstract: A memory device includes a memory cell array including a plurality of memory cells; a voltage generator configured to generate voltages used for a program operation and a verify operation for the memory cells; and control logic configured to perform a plurality of program loops while writing data to the memory cell array, such that first to N-th (e.g., N>=1) program loops including a program operation and a verify operation are performed and at least two program loops in which the verify operation is skipped are performed when a pass/fail determination of the program operation in the N-th program loop indicates a pass.

Abstract: Apparatuses and methods are provided for processing in memory. An example apparatus comprises a host and a processing in memory (PIM) capable device coupled to the host via an interface comprising a sideband channel. The PIM capable device comprises an array of memory cells coupled to sensing circuitry and is configured to perform bit vector operations on data stored in the array, and the host comprises a PIM control component to perform virtual address resolution for PIM operations prior to providing a number of corresponding bit vector operations to the PIM capable device via the sideband channel.

Abstract: Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes a memory cell, first, second, and third data lines, and first and second access lines. Each of the first, second, and third data lines includes a length extending in a first direction. Each of the first and second access lines includes a length extending in a second direction. The memory cell includes a first transistor including a charge storage structure, and a first channel region electrically separated from the charge storage structure, and a second transistor including a second channel region electrically coupled to the charge storage structure. The first data line is electrically coupled to the first channel region. The second data line is electrically coupled to the first channel region. The third data line is electrically coupled to the second channel region, the second channel region being between the charge storage structure and the third data line.

Abstract: Apparatus might include a controller configured to cause the apparatus to program a plurality of memory cells from a first data state to a second data state higher than the first data state, determine a respective first voltage level of a control gate voltage deemed to cause each memory cell of a first and second subset of memory cells of the plurality of memory cells to reach the second data state, determine a respective second voltage level of a control gate voltage deemed sufficient to cause each memory cell of the first subset of memory cells to reach a third data state higher than the second data state, and determine a respective second voltage level of a control gate voltage deemed sufficient to cause each memory cell of the second subset of memory cells to reach a fourth data state higher than the third data state.

Abstract: A semiconductor memory device includes a memory cell array having memory strings that include memory cells and first and second selection transistors. During a read operation, a controller applies a first voltage higher than ground to a source line, and a second voltage to a first and second selection gate lines that are connected to a selected memory string. The second voltage is also applied to the first selection gate lines connected to non-selected memory strings during a first period of the read operation. A third voltage higher than ground and lower than the second voltage is applied to the first selection gate lines connected to non-selected memory strings during a second period of the read operation subsequent to the first period.

Abstract: A command to program data to a memory device is received. Target charge levels of a set of memory cells in the memory device for a first programming step are determined based on the data. A first set of indicators are provided to the memory device. The first set of indicators indicate the target charge levels for the first programming step. Target charge levels of the set of memory cells for a second programming step are determined based on the data. A second set of indicators are provided to the memory device. The second set of indicators indicate the target charge levels for the second programming step.

Abstract: Methods and apparatus for performing surface code computations using Auto-CCZ states. In one aspect, a method for implementing a delayed choice CZ operation on a first and second data qubit using a quantum computer includes: preparing a first and second routing qubit in a magic state; interacting the first data qubit with the first routing qubit and the second data qubit with the second routing qubit using a first and second CNOT operation, where the first and second data qubits act as controls for the CNOT operations; if a received first classical bit represents an off state: applying a first and second Hadamard gate to the first and second routing qubit; measuring the first and second routing qubit using Z basis measurements to obtain a second and third classical bit; and performing classically controlled fixup operations on the first and second data qubit using the second and third classical bits.

Abstract: An optical synapse comprises a memristive device for non-volatile storage of a synaptic weight dependent on resistance of the device, and an optical modulator for volatile modulation of optical transmission in a waveguide. The memristive device and optical modulator are connected in control circuitry which is operable, in a write mode, to supply a programming signal to the memristive device to program the synaptic weight and, in a read mode, to supply an electrical signal, dependent on the synaptic weight, to the optical modulator whereby the optical transmission is controlled in a volatile manner in dependence on programmed synaptic weight.

Abstract: A memory device includes a cell array including a plurality of pages and a control logic configured to control program and read operations of the cell array. The control logic controls the program and read operations to store first through N-th codewords in a first page among the pages and program a page parity corresponding in common to the first through N-th codewords to the first page in response to a program command for a page unit and to selectively read the first codeword among the first through N-th codewords in response to a read command for a sub-page unit, where N is an integer of at least 2. The first codeword includes first sub-page data and a first sub-parity corresponding thereto, and the first sub-parity includes information for correcting an error in the first sub-page data through error correction code (ECC) decoding independently performed on each codeword.

Abstract: A method for programming a target memory cell in a memory array of a non-volatile memory system, the method comprising defining a default read biasing voltage value and a default verify biasing voltage value for each program state of a target memory cell of a memory structure, determining a location of a target memory cell within the memory structure and, based upon the determined location of the target memory cell, applying a first incremental offset voltage to the default read biasing voltage value with respect to each program state, and applying a second incremental offset voltage to the default verify biasing voltage value with respect to each program state.

Abstract: Apparatuses and techniques are described for programming data in memory cells while concurrently storing backup data. Initial pages of multiple bit per cell data are encoded to obtain at least first and second pages of single bit per cell data. The initial pages of multiple bit per cell data are programmed into a primary set of memory cells, while concurrently the first and second pages of single bit per cell data are programmed into first and second backup sets of memory cells, respectively. In the event of a power loss, the first and second pages of single bit per cell data are read from the first and second backup sets of memory cells, and decoded to recover the initial pages of multiple bit per cell data.

Abstract: Non-volatile memory systems are disclosed. The memory systems include rows of memory holes FC-SGD and SC-SGD, the latter of which may be created by a SHE cutting operation. The SC-SGD include erase speeds slower than those of FC-SGD. In order to overcome the erase speed disparities, SC-SGD are programmed to a higher Vt as compared to FC-SGD. By programming SC-SGD to a higher Vt, the erase speed increases and matches the erase speed of FC-SGD. Further, different SC-SGDs are cut to different amounts, creating different erase speeds among SC-SGD. SC-SGDs with a greater degree/amount of cut have slower erase speeds as compared to SC-SGDs with a lesser degree/amount of cut. However, verify levels among SC-SGDs can differ to produce SC-SGDs with Vt's such that their erase speeds match with each other as well as with FC-SGD.

Abstract: A semiconductor device includes a semiconductor substrate including a fin of semiconductor material having a fin width and a fin length. The fin length is greater than the fin width and extends between a first fin end and a second fin end. A gate electrode extends over the fin at a first fin location between the first fin end and the second fin end. A dummy gate electrode extends over the first fin end and is floating.

Abstract: A nonvolatile memory device comprising: a cell string comprising a plurality of memory cells, a bit line coupled to the cell string, and a page buffer suitable for precharging the bit line, a first sensing node and a second sensing node to a preset level in a first period, and double-sensing the bit line through the first and second sensing nodes in a second period, wherein the page buffer comprises: a first coupling unit suitable for coupling the bit line and the first sensing node, a second coupling unit suitable for coupling the first and second sensing nodes, and controlling the first and second sensing nodes to have a voltage level interval according to a preset ratio in the second period, a first and second latch units suitable for latching a logic levels corresponding to a voltage levels of the first and second sensing nodes, respectively.

Abstract: Described is an ultra-dense ferroelectric memory. The memory is fabricated using a patterning method by that applies atomic layer deposition with selective dry and/or wet etch to increase memory density at a given via opening. A ferroelectric capacitor in one example comprises: a first structure (e.g., first electrode) comprising metal; a second structure (e.g., a second electrode) comprising metal; and a third structure comprising ferroelectric material, wherein the third structure is between and adjacent to the first and second structures, wherein a portion of the third structure is interdigitated with the first and second structures to increase surface area of the third structure. The increased surface area allows for higher memory density.

Abstract: A column control circuit may include a column control signal generation circuit and a column access block signal generation circuit. The column control signal generation circuit is configured to activate an input/output strobe signal when a column access block signal is deactivated. The column control signal generation circuit is configured to deactivate the input/output strobe signal when the column access block signal is activated. The column access block signal generation circuit is configured to activate the column access block signal when gap-less read commands may be inputted. The column access block signal generation circuit may deactivate the column access block signal during a period corresponding to an N-th read command among the gap-less read commands. N is an integer that is no less than 2.

Abstract: Sensing devices might include a first voltage node configured to receive a first voltage level, a second voltage node configured to receive a second voltage level lower than the first voltage level, a p-type field-effect transistor (pFET) selectively connected to a data line, and a sense node selectively connected to the pFET. The pFET might be connected between the first voltage node and the data line, between the second voltage node and the data line, and between the first voltage node and the data line. Memories might have controllers configured to cause the memories to determine whether a memory cell has an intended threshold voltage using similar sensing devices.