Abstract: The invention relates to a method and to an arrangement for adjusting the magnetization of a permanent magnet machine, i.e. the magnetic flux induced by permanent magnets of a rotor in a stator, i.e. the air gap flux. According to the invention, the air gap flux is adjusted by adjusting the leakage flux of the permanent magnet.

Abstract: Disclosed is a printed circuit unit that includes a flexible member which has an upper surface and a lower surface and includes a first end and a second end. An output pad is disposed at the first end and is implemented to be connected to a bent display panel. A connecting unit is disposed at the second end and is implemented to be connected to a system board, and a drive chip is located between the output pad and the connecting unit.

Abstract: A housing configuration for an electric machine includes a housing having a stator receiving region with a wall. A stator is disposed in the stator receiving region of the housing and a sleeve is pushed onto the stator. A cooling jacket surrounds the stator for liquid cooling of the stator. The cooling jacket has a radially outer cooling-jacket surface and a radially inner cooling-jacket surface with a gap between the radially outer cooling-jacket surface and the radially inner cooling-jacket surface. The wall of the stator receiving region forms the radially outer cooling-jacket surface of the cooling jacket. The sleeve forms the radially inner cooling-jacket surface of the cooling jacket. Bilaterally acting seal carriers are inserted into the gap between the radially outer cooling-jacket surface and the radially inner cooling-jacket surface. The bilaterally acting seal carriers provide an axial sealing of the cooling jacket. An electric machine is also provided.

Abstract: The method for manufacturing a printed circuit board element (10) having an inlay (16) and a current sensor (30) for determining a current flowing in the inlay (16), wherein, for the improvement of the positional accuracy of the inlay (16) relative to the current sensor (30), the method comprises the following steps: providing a layer (12) of printed circuit board material having a recess (14), providing an inlay (16) having an inlay outline, inserting the inlay (16) in the recess (14); embedding the inlay (16) in the recess (14); completing and laminating the layered printed circuit board structure; applying at least two alignment markings (M1, M2) on an uppermost printed circuit board layer (AL); forming a defined cross-section tapering (S) on the inlay outline, the tapering being aligned with the at least two alignment markings (M1, M2); applying an assembly marking for a current sensor (30) on an uppermost printed circuit board layer (AL), the assembly marking being aligned with the at least two alignm

Abstract: A knob claim lock has been developed. The knob clamp lock includes a frame piece with two slots and a shackle opening that fits over a lock piece with two tabs and a matching shackle opening. The tabs and slots fit together to make sure the shackle openings align to allow the knob clamp lock to be secured.

Abstract: A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface with connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the semiconductor chip; and a second connection member disposed on the first connection member and the semiconductor chip. The first connection member and the second connection member respectively include first redistribution layers and second redistribution layers electrically connected to the connection pads and formed of one or more layers, at least one of the first redistribution layers is disposed between a plurality of insulating layers of the first connection member, and at least one of the second redistribution layers includes sensor patterns recognizing a fingerprint.

Abstract: A display device is capable of detecting defects of a PCB, the display device including: a display panel on which a driving integrated circuit is mounted; a printed circuit board disposed on at least one edge of the display panel and connected to the driving integrated circuit; signal lines disposed on the printed circuit board; and an inspection portion connected to signal lines. The inspection portion includes: a power line connected to one point of at least two signal lines of signal lines to apply an inspection signal, the at least two signal lines including a first signal line and a second signal line; a first resistor connected to the first signal line; a second resistor connected to the second signal line; and a signal detection line connected to the first resistor and the second resistor to detect a change value of the inspection signal.

Abstract: A rollable display device includes a roller defining a rolling direction, and a rollable display unit. A first side of the rollable display unit is fixed to the roller, and the rollable display unit includes a plurality of spacers spaced apart from one another and arranged in the rolling direction. Heights of the spacers disposed near a second side of the rollable display unit opposing the first side are greater than heights of the spacers disposed near the first side of the rollable display unit.

Abstract: Methods and systems for reducing the number of, and values of, passive components, such as capacitors, in System-in-Package devices below vendor recommendations for an active component are provided.

Abstract: The subject matter of this specification generally relates to electronic packages. In some implementations, a lidless electronic package includes a substrate having a surface and a die disposed on the surface of the substrate. The die has an outside perimeter, a bottom surface adjacent to the surface of the substrate, and a top surface. The electronic package includes a stiffener disposed on the surface of the substrate. The stiffener includes a first surface that is a first distance from the surface of the substrate and a second surface disposed between the die and the first surface. The first distance is greater than a distance between the surface of the substrate and the top surface of the die. The second surface is a second distance from the surface of the substrate that is less than the distance between the surface of the substrate and the top surface of the die.

Abstract: A method of manufacturing a semiconductor package includes mounting and electrically connecting a semiconductor die to a substrate. The semiconductor die and the substrate are encapsulated to form an encapsulation. Via holes are laser-ablated through the encapsulation and conductive material is deposited within the via holes to form vias. A first buildup dielectric layer is formed on the encapsulation. Laser-ablated artifacts are laser-ablated in the first buildup layer. The laser-ablated artifacts in the first buildup layer are filled with a first metal layer to form a first electrically conductive pattern in the first build up layer. The operations of forming a buildup layer, forming laser-ablated artifacts in the buildup layer, and filling the laser-ablated artifacts with an electrically conductive material to form an electrically conductive pattern can be performed any one of a number of times to achieve the desired redistribution.

Abstract: An electronic device is provided. The electronic device includes a display substrate and a connector connected to one side of the display substrate and having a dummy pattern. A cutting part is formed in the display substrate and the connector, and the cutting part is formed adjacent to the dummy pattern.

Abstract: Circuit boards and methods for their manufacture are disclosed. The circuit boards carry high-speed signals using conductors formed to include lengthwise channels. The channels increase the surface area of the conductors, and therefore enhance the ability of the conductors to carry high-speed signals. In at least some embodiments, a discontinuity also exists between the dielectric constant within the channels and just outside the channels, which is believed to reduce signal loss into the dielectric material.

Abstract: A slot coil 25 is inserted into a slot 23 provided in a stator core 21 and is covered with an insulating material 28. The insulating material 28 has an ear portion 29 on an outer circumferential surface thereof. The slot coil 25 is fixed to the stator core 21 by the ear portion 29 welded to an end surface 21b of the stator core 21.

Abstract: Embodiments of the present invention may provide a wafer-capped rechargeable power source. The wafer-capped rechargeable power source may comprise a device wafer, a rechargeable power source disposed on a surface of the device wafer, and a capping wafer to encapsulate the rechargeable power source. The rechargeable power source may include an anode component, a cathode component, and an electrolyte component.

Abstract: A fan motor according to the present invention comprises a rotor 10 which rotates together with a shaft 30; a stator 20 which is installed to be oriented towards the rotor 10; a top-covering bracket 60 which is coupled to an upper insulator 21 and a core 22 constituting the stator 20; a motor bracket 80 which is mounted on a fixed-installation bracket 70 and coupled to the core 22, upper insulator 21 and lower insulator 23 of the stator 20 and a printed circuit board 50; and a sealing element 100 which is filled in a space portion S formed between a lower surface of the printed circuit board 50 coupled to the bottom of the lower insulator 23 and an inner lower surface of the motor bracket 80.

Abstract: A laminate having an integrated electrical component disposed within the laminate is disclosed. The laminate includes a first paper layer having at least first and second vias through the first paper layer; a first electrically-conductive layer, comprising an electrically-conductive material, disposed over a portion of the first paper layer; a second electrically-conductive layer, comprising the electrically-conductive material, disposed over another portion of the first paper layer; an electrical component disposed over the first and second electrically-conductive layers; and an insulating layer disposed over the electrical component. The first paper layer and the insulating layer encapsulate the first electrically-conductive layer, the second electrically-conductive layer, and the electrical component.

Abstract: Fan-Out Wafer Level Packages (FO-WLPs) having Embedded Ground Plane (EGP) connections are provided. In one embodiment, the FO-WLP includes a molded package body having a frontside and an opposing backside. An EGP and a first preformed EGP connection are contained within the molded package body. The first preformed EGP connection is bonded to the EGP and extends therefrom to the backside of the molded package body. The FO-WLP further includes an electrically-conductive structure, such as an Electromagnetic Interference (EMI) shield, provided on the backside of the molded package body. The electrically-conductive structure is electrically coupled to the EGP through the first preformed EGP connection.

Abstract: Disclosed herein is a method and an apparatus using microfluidic channel array for converting mechanical energy into electric energy by streaming potential and streaming current caused when the electrolyte liquid flows in a charged surface due to a pressure drop. The present invention relates to a method and an apparatus for designing channels with hierarchical structure in which a primary multi-channel is provided by radially arranging one or more unit channels, and each of the unit channels includes an inflow channel, an outflow channel, and a secondary multi-channel provided by arranging one or more channels in parallel, thereby improving output power and flow stability.

Abstract: A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.