Patents Examined by Yuriy Semenenko
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Patent number: 10574113Abstract: The invention relates to an electric motor (1) comprising —a fitting (10) having a plurality of teeth (20) and grooves (30) formed between the teeth (20), —at least one winding (40) formed by a winding conductor (42), wherein at least a part of the winding (40) extends within one of the grooves (30), —an insulating element (50) which electrically separates the winding (40) from the fitting (10). It is proposed according to the invention that the insulating element (50) comprises a guide means (52) which is formed within one of the grooves (30), the guide means (52) guiding a winding conductor section (44) of a winding conductor (42) and the winding conductor (42) being guided out of the fitting (10) by the guide means (52).Type: GrantFiled: April 19, 2016Date of Patent: February 25, 2020Assignee: Robert Bosch GmbHInventors: Harold Bitzer, Peter Hauser, Ralf Lehmann, Wolfgang Glueck
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Patent number: 10566857Abstract: To provide an iron core and a motor for preventing reduction in motor drive efficiency. An iron core includes laminate section made up of a lamination of plural soft magnetic ribbons, fixed to metal substrate, and provided with winding, and fastening part that pressurizes laminate section in a lamination direction of soft magnetic ribbons. Also, the fastening part is disposed around an opening of through-hole that penetrates laminate section. Furthermore, a metal plate shaped so as not to cover winding section is provided between laminate section and fastening part. Besides, the motor includes a rotor and the iron core.Type: GrantFiled: December 6, 2017Date of Patent: February 18, 2020Assignee: Panasonic CorporationInventors: Yukio Nishikawa, Taihei Okada, Tohru Kojima
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Patent number: 10555428Abstract: The present disclosure provides a board unit including a circuit board, a connector portion mounted on the circuit board, and a case housing the circuit board. The case includes a lower case having an upper opening; an upper cover covers the upper opening, and an opening portion is formed in a side wall of the case, through which the connector portion extends inside and outside the side wall. The upper cover includes an inner circumferential surface that forms at least a portion of the opening portion and a predetermined gap with an outer circumferential surface of the connector portion. A groove portion is formed continuously along the inner circumferential surface, is open in the inner circumferential surface and is in communication with the gap. A size of the gap and a size of the groove portion are configured to form a water film by water droplets entering the case.Type: GrantFiled: May 10, 2017Date of Patent: February 4, 2020Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.Inventors: Jun Ikeda, Munsoku O
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Patent number: 10555414Abstract: Discussed is a display device. The display device according to one example includes a first substrate including a display part, a bending part formed at one side of the display part, and a pad part formed at an end of the bending part. The display device further includes a second substrate facing the display part, and a back film adhered to a portion corresponding to the display part and the pad part on the bottom of the first substrate.Type: GrantFiled: August 29, 2017Date of Patent: February 4, 2020Assignee: LG DISPLAY CO., LTD.Inventors: Ji Sun Park, Dal Jae Lee, Ji Yong Jeong
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Patent number: 10555418Abstract: A component module includes a circuit board having a first base, a second base facing the first base, and a side section connected to the first and second bases. A wiring pattern is formed on at least one of a first facing surface of the first base that faces the second base, a second facing surface of the second base that faces the first base, and a side section facing surface of the side section that faces a direction in which the first and second bases extend. The component module further includes an electronic component that is in contact with at least one of the first facing surface, the second facing surface, and the side section facing surface. A sealing resin is formed in a region surrounded by the first facing surface, the second facing surface, and the side section facing surface so as to seal the electronic component.Type: GrantFiled: January 12, 2018Date of Patent: February 4, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Masashi Yamaura
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Patent number: 10541631Abstract: This invention relates to a linear type actuator unit, said actuator unit (100), including an electric motor (1) driving a linear actuator (2) of, said motor (1) having a casing (11), a stator (14,15) fixed to the casing, a rotor (13) fixed to a rotary part (10), preferably a rotary motor shaft (10), wherein said rotary part (10) is arranged to be operatively connected to a reduction gear (5) which drives the mechanical output of the actuator (2), a separate magnetic brake unit (3), said magnetic brake (3) including a rotating brake member (30,31) connected to the motor shaft (10), directly or indirectly, and a plurality of fixed brake members (32, 33), wherein said magnetic brake (3) is arranged to produce a torque that will strive to position a rotary member (10, 20) with said rotating brake member (30,31) into one or more specific angular positions in relation to the fixed brake members (32, 33), and wherein said rotating brake member (30,31) is in the form of a separate annulus (30, 31) attached to said rType: GrantFiled: April 22, 2016Date of Patent: January 21, 2020Assignee: REAC ABInventor: Johan Olsson
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Patent number: 10539431Abstract: A resolver which includes a resolver rotor and a resolver stator. The resolver stator includes a resolver stator core, a winding bracket mounted on the resolver stator core, and a plurality of resolver windings wound on the winding bracket. The winding bracket includes an annular portion surrounding the resolver rotor, a connector extending outwardly from the annular portion, and a cover mounted on the connector. The connector includes a plurality of conductive terminals connecting both the resolver winding and lead wires, and a body receiving the conductive terminals. The cover abuts against the lead wires to secure the lead wires to connector.Type: GrantFiled: December 6, 2017Date of Patent: January 21, 2020Assignee: JOHNSON ELECTRIC INTERNATIONAL AGInventors: Xing Liu, Chengshun Du, Ning Sun, Ruifeng Qin, Yanbin Li
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Patent number: 10532650Abstract: A drive motor includes a coolant channel in which coolant is circulated around a motor housing surrounding the stator, and an oil path in which the temperature of oil decreases by heat exchange between the oil and the coolant in a motor internal space defined by a motor cover and a reducer cover that are coupled to the respective left and right sides of the motor housing.Type: GrantFiled: December 6, 2017Date of Patent: January 14, 2020Assignees: Hyundai Motor Company, Kia Motors CorporationInventors: Jung-Woo Lee, Dong-Yeon Han
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Patent number: 10535694Abstract: Among other things, one or more support structures for integrated circuitry and techniques for forming such support structures are provided. A support structure comprises one or more trench structures, such as a first trench structure and a second trench structure formed around a periphery of integrated circuitry. In some embodiments, one or more trench structures are formed according to partial substrate etching, such that respective trench structures are formed into a region of a substrate. In some embodiments, one or more trench structures are formed according to discontinued substrate etching, such that respective trench structures comprise one or more trench portions separated by separation regions of the substrate. The support structure mitigates stress energy from reaching the integrated circuitry, and facilitates process-induced charge release from the integrated circuitry.Type: GrantFiled: July 1, 2019Date of Patent: January 14, 2020Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Volume Chien, Yun-Wei Cheng, I-I Cheng, Shiu-Ko JangJian, Chi-Cherng Jeng, Chih-Mu Huang
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Patent number: 10530205Abstract: A rotary electric machine includes a stator and a rotor. The rotor includes a rotor core and a plurality of permanent magnets. The permanent magnets are disposed to be divided into two layers, the two layers being a layer on the outer peripheral side and a layer on the inner peripheral side of the rotor core, and the permanent magnets are disposed line-symmetrically with respect to a magnetic pole center of the rotor core and in a V-shape or a U-shape in each of the two layers. An angle that each of the permanent magnets disposed on the outer peripheral side makes with the magnetic pole center of the V-shape or the U-shape is larger than an angle that each of the permanent magnets disposed on the inner peripheral side makes with the magnetic pole center of the V-shape or the U-shape.Type: GrantFiled: November 2, 2017Date of Patent: January 7, 2020Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventor: Hiroyuki Hattori
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Stacking integrated circuits containing serializer and deserializer blocks using through silicon via
Patent number: 10522516Abstract: A system comprising a die stack having at least a first die and a second die; one or more Redistribution Layer(s); one or more Through Silicon Via(s); one or more Serial I/O(s); one or more contact pad(s); and a substrate. The die stack is configured to communicate through said one or more Redistribution Layer(s) and said Through Silicon Via(s). The first die and/or said second die is/are configured to communicate through said one or more Redistribution Layer(s) and said Through Silicon Via(s). The one or more Serial I/O(s) is/are configured to communicate through said one or more Redistribution Layer(s) and said Through Silicon Via(s).Type: GrantFiled: March 16, 2019Date of Patent: December 31, 2019Assignee: BroadPak CorporationInventor: Farhang Yazdani -
Patent number: 10522515Abstract: Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and an aperture extending at least partially into the module material. The computer modules can also include a microelectronic package carried by the module substrate. The microelectronic package includes a semiconductor die carried by a package substrate. At least a portion of the semiconductor die extends into the substrate material via the aperture.Type: GrantFiled: February 25, 2019Date of Patent: December 31, 2019Assignee: Micron Technology, Inc.Inventors: Kevin Gibbons, Tracy V. Reynolds, David J. Corisis
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Patent number: 10516309Abstract: Provided is a rotating machine capable of obtaining a uniform temperature distribution by improving a cooling air flow to a heat generation portion. The rotating machine has a salient pole rotor (11) and a stator (12). The salient pole rotor (11) has a rotation shaft (15), a disk-shaped spoke (22), a cylindrical rib (23), and a plurality of salient poles (25) arranged in a radial shape on an outer circumferential surface of the rib (23), each of the salient poles (25) being formed along an axial direction of the rotation shaft (15). The disk-shaped spoke (22) is provided to an anti-feeding side end of the cooling air of the salient pole rotor (11). The cylindrical rib (23) is provided with through-holes (231) extending from an inner space of the cylindrical rib (23) through gaps between a plurality of salient poles (25).Type: GrantFiled: June 20, 2016Date of Patent: December 24, 2019Assignee: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATIONInventors: Takayuki Mihara, Dan Umeda
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Patent number: 10515886Abstract: An electronic package comprising a first substrate; a second substrate; at least one standoff substrate positioned between the first substrate and the second substrate, wherein the at least one standoff substrate is affixed to each of the first substrate and the second substrate, wherein the at least one standoff substrate forms a clearance between the first substrate and the second substrate, and wherein the at least one standoff substrate comprises an intervening plurality of through-substrate vias passing through the entire thickness of the at least one standoff substrate, and wherein a portion of the second plurality of through-substrate vias are electrically connected to a portion of the first through-substrate vias by way of a portion of the intervening through-substrate vias; and at least three electronic components located within the clearance.Type: GrantFiled: November 11, 2017Date of Patent: December 24, 2019Assignee: BroadPak CorporationInventor: Farhang Yazdani
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Patent number: 10512163Abstract: An electronic component mounting board includes: a circuit board having a wiring layer; a pocket part provided on a main surface of one side of the circuit board; a passive component housed in the pocket part; an active component arranged above the passive component and the main surface of the one side of the circuit board and connected to the passive component; and a shield layer formed of a material containing a magnetic material and provided between a bottom surface of the pocket part and a lower surface of the passive component.Type: GrantFiled: March 23, 2017Date of Patent: December 17, 2019Assignee: TDK CORPORATIONInventor: Kazuo Ishizaki
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Patent number: 10512164Abstract: Disclosed is a flexible electronic circuit substrate that includes a device that is fabricated from layers of the flexible electronic circuit substrate as part of construction of the flexible electronic circuit substrate. Such devices could be functional units such as micro electro mechanical devices (MEMS) devices such as micro-accelerometer sensor elements, micro flow sensors, micro pressure sensors, etc.Type: GrantFiled: September 27, 2018Date of Patent: December 17, 2019Assignee: Encite LLCInventor: Stephen A. Marsh
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Patent number: 10506715Abstract: Disclosed are highly scalable fabrication methods for producing electronic circuits, devices, and systems. In one aspect, a fabrication method includes attaching an electronic component at a location on a substrate including a flexible and electrically insulative material; forming a template to encase the electronic component by depositing a material in a phase to conform on the surfaces of the electronic component and the substrate, and causing the material to change to solid form; and producing a circuit or electronic device by forming openings in the substrate to expose conductive portions of the electronic component, creating electrical interconnections coupled to at least some of the conductive portions in a selected arrangement on the substrate, and depositing a layer of an electrically insulative and flexible material over the electrical interconnections on the substrate to form a flexible base of the circuit, in which the produced circuit or electronic device is encased.Type: GrantFiled: December 19, 2014Date of Patent: December 10, 2019Assignee: The Regents of the University of CaliforniaInventors: Todd Prentice Coleman, Yun Soung Kim, Michael Bajema, Robert N. Weinreb
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Patent number: 10505416Abstract: A rotor assembly has a rotor including a plurality of laminations each defining a plurality of poles arranged such that values of a pair of angles corresponding to each of the poles and defined between a magnetic axis of the pole and respective interpolar axes adjacent thereto are different. The values of the pairs define a repeating sequence around the lamination. The angles opposite an axis of rotation of the rotor are equal.Type: GrantFiled: November 9, 2017Date of Patent: December 10, 2019Assignee: FORD GLOBAL TECHNOLOGIES, LLCInventors: Franco Leonardi, Feng Liang, Michael W. Degner
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Patent number: 10498199Abstract: A rotary electric machine of the present invention includes, inside a housing, a rotor and a stator that are concentric with each other. The stator has a plurality of coil portions in a circumferential direction. In the stator, a first flow channel and a second flow channel, through which cooling water flows, are provided along the plurality of coil portions, each of the channels having one end connected to a flow channel inlet and the other end connected to a flow channel outlet. The lengths of the first flow channel and the second flow channel are mutually different. A temperature detection element is provided in a coil portion on a high temperature side among the coil portions positioned along the first flow channel and the coil portions positioned along the second flow channel.Type: GrantFiled: November 9, 2017Date of Patent: December 3, 2019Assignee: Mitsubishi Electric CorporationInventors: Ken Nishikawa, Norihiro Watanabe, Koichi Ojima
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Patent number: 10490232Abstract: A storage container includes a base housing member coupled to an inner cover and including an inner cavity. The storage container further includes an outer cover coupled to the base housing member and covering the inner cover. A rack assembly includes a plurality of storage devices and is mounted within the inner cavity.Type: GrantFiled: May 3, 2018Date of Patent: November 26, 2019Assignee: Seagate Technology LLCInventors: Christopher M Woldemar, YiChao Ma, Xiong Liu, Li Hong Zhang