Abstract: An approach for through-hole component soldering for a PCB, and a resulting PCB assembly, that eliminates protruding solder joints, is provided. The approach comprises back-drilling, from a bottom surface of a PCB, one or more through-holes, wherein each back-drilled through-hole is back-drilled to a depth partially through the PCB and at a diameter that is larger than the diameter of the through hole. Solder paste is applied to the PCB. The components are placed on the PCB, inserting each pin into a corresponding through-hole. The PCB is passed through a solder process, whereby, within each through-hole having a component pin inserted therein, the solder paste is wicked into the through-hole, and forms a solder joint with the respective pin. Each solder joint of a back-drilled through-hole is situated within the through-hole in a manner whereby the solder joint does not protrude beyond the bottom surface of the PCB.

Abstract: A wire harness protector includes a bottom panel, a first side panel rising from one edge of the bottom panel, and a second side panel rising from another edge of the bottom panel. The bottom panel, first side panel, and second side panel demarcate an accommodation route that accommodates a main line of a wire harness. The first side panel is provided with a notch through which a branch line that branches from the main line is drawn out to an exterior of the accommodation route. A surface of the first side panel that faces the accommodation route is a route forming surface, and a projecting portion projects from the route forming surface.

Abstract: A package substrate includes a dielectric layer, a first circuit layer, a second circuit layer and at least one electrically conductive pole. The dielectric layer includes a first side and a second side opposite to the first side. The first circuit layer is located at the first side of the dielectric layer, and includes a plurality of spaced first circuit patterns embedded into the dielectric layer. The second circuit layer is located at the second side of the dielectric layer, and includes a plurality of spaced second circuit patterns located on the second side the dielectric layer. The electrically conductive pole electrically couples the first circuit layer to the second circuit layer. Each of the first circuit patterns has an extension direction from the first side toward the second side, and has widths gradually decreasing along the extension direction.

Abstract: According to an aspect of the present inventive concept there is provided a system comprising: a conductive textile including conductive fibers, an electronic circuit unit arranged on a first main surface of the conductive textile and including circuitry and a carrier supporting the circuitry, the carrier having a first main surface and a second main surface facing the first main surface of the textile and including a through-hole extending from the first main surface to the second main surface, a conductive pin including an leg segment arranged at least partly in the through-hole, and a grip segment arranged to grip about at least one fiber of the conductive textile. There is also provided a method for mounting an electronic circuit unit on a conductive textile.

Abstract: An electrical contact-making arrangement for electrical power components, having a printed circuit board for mounting the electrical power components, and a line element which is fixed to the printed circuit board. The line element has a metal main body and the main body has an electrical connection contact in order to electrically contact-connect the line element to the printed circuit board or one of the electrical components. The main body has a fastening section in order to fix the line element to the printed circuit board. The line element is produced separately from the printed circuit board, and the electrical connection contact and the fastening section are formed separately from one another.

Abstract: The rotor includes: a rotor core having a plurality of insertion holes penetrating in an axial direction at intervals in a circumferential direction; and magnets respectively provided in the insertion holes. A space is formed between a hole inner side peripheral surface of each insertion hole and a magnet inner side peripheral surface of each magnet. An adhesion layer portion is formed between a hole outer side peripheral surface of each insertion hole and a magnet outer side peripheral surface of each magnet, and the hole outer side peripheral surface of each insertion hole and the magnet outer side peripheral surface of each magnet with which the adhesion layer portion contacts are formed in a flat-surface shape. A width in a radial direction of the space is longer than a width in the radial direction of the adhesion layer portion.

Abstract: A rotary electric machine includes: a stator including a stator core and a stator coil wound around the stator core; and an annular outer rotor including an outer core disposed around an outer periphery of the stator and a plurality of outer magnets arranged at intervals in a circumferential direction, in which the stator core has an annular yoke and a plurality of outer teeth protruding radially outward from an outer periphery of the yoke, the outer magnets are magnetized in the circumferential direction such that magnetization directions of the outer magnets adjacent to each other in the circumferential direction are opposite to each other in the circumferential direction, and a circumferential distance of a gap between the outer magnets adjacent to each other is 1.5 times or more a disposition pitch in the circumferential direction of the outer teeth.

Abstract: Close-contact layers that are capable of improving the degree of contact between electrodes and a ceramic insulating layer can be formed at low cost by firing a glass paste. When the electrodes, the ceramic insulating layer, and the close-contact layers are fired at the same time, the glass paste is sintered last, and thus, formation of voids, defects, and the like in portions of the ceramic insulating layer, on which the electrodes are disposed, as a result of shrinkage of the electrodes and the ceramic insulating layer at the time of firing being hindered by stress generated due to the difference in the degree of shrinkage can be suppressed. Therefore, the structure of the ceramic insulating layers in the above portions can be elaborated by the close-contact layers.

Abstract: An electronic component is mounted on the mounting face of a printed wiring board and a plurality of terminals arranged on the mounting face of the printed wiring board are respectively bonded to a plurality of terminals arranged on the bottom surface of the electronic component by means of solder. Solder paste containing powdery solder and thermosetting resin is provided to the plurality of terminals on the mounting face, then the electronic component is mounted on the mounting face of the printed wiring board, and subsequently the solder paste is heated to bond the corresponding terminals by means of molten solder. Thereafter, the molten solder is allowed to solidify and the thermosetting resin separated from the solder paste is allowed to cure in a state where it is held in contact with metal members arranged separately relative to the terminals.

Abstract: A computing system includes a circuit board assembly and multiple expansion cards connected to one another and also connected to the circuit board assembly. The connected expansion cards form a modular expansion card bus that allows the expansion cards to communicate between each other without routing the communications through the circuit board assembly. In some embodiments, the expansion cards are mounted on a tray that includes mounting pins that engage mounting slots of the expansion cards, allowing for simple installation of various combinations of expansion cards connected together to form a modular expansion card bus.

Abstract: A high-frequency module includes a multilayer substrate that includes an insulator layer and a wiring electrode, a component on one main surface of the multilayer substrate, a resin layer on the one main surface so as to cover the component, and a shield electrode covering at least a portion of a surface of the resin layer and at least a portion of a side surface of the multilayer substrate. The wiring electrode includes a capacitor via electrode that is spaced away from the shield electrode inside the multilayer substrate, and a first capacitor is defined by the shield electrode and the capacitor via electrode.

Abstract: A linear vibration generating device, which includes a stator fixed on a bracket and having a center yoke concentrically fixed in an inner space of coil winding units and at least one blade extending from the center yoke in a direction perpendicular to the concentric axis, and a vibrator having a magnet surrounding outer circumferences of the coil winding units, and an elastic body disposed between the stator and the vibrator. The blade has at least one passage through which a coil wire for electrically connecting the coil winding units passes.

Abstract: An apparatus including a substrate including a first side and an opposite second side; at least one first circuit device on the first side of the substrate, at least one second device on the second side of the substrate; and a support on the second side of the substrate, the support including interconnections connected to the at least one first and second circuit device, the support having a thickness dimension operable to define a dimension from the substrate greater than a thickness dimension of the at least one second circuit device. A method including disposing at least one first circuit component on a first side of a substrate; disposing at least one second circuit component on a second side of the substrate; and coupling a support to the substrate, the substrate defining a dimension from the substrate greater than a thickness dimension of the at least one second circuit component.

Abstract: A circuit assembly for a power converter includes power stage blocks. A power stage block includes a power stage IC die, an output inductor that is connected to a switch node of the power stage IC die, and capacitors that form an output capacitor of the power stage block. The output capacitors of the power stage blocks are symmetrically arranged. The output inductors can be placed on the same side of the substrate as the power stage IC dies, or on a side of the substrate that is opposite to the side where the power stage IC dies are disposed. A power stage block may generate two output phases of the power converter.

Abstract: A circuit board, a display device including the same, and a method of manufacturing a circuit board are provided. A circuit board includes a base substrate, a wiring line provided on the base substrate, a passivation layer provided on the wiring line, an elastic bump provided on the passivation layer, and a conductive layer provided on the elastic bump. The passivation layer includes a first opening and a second opening that expose a partial region of the wiring line, and the second opening is arranged in a region adjacent to the first opening.

Abstract: An axial flux machine includes a modulated stator, a rotor, and a plurality of spacers. The modulated stator includes plural stator units. Each stator unit includes a magnetic core and at least one winding. The magnetic core has first plate, a second plate, and a sidewall connecting the first plate to the second plate, and the winding is disposed on the magnetic core. The stator units construct the modulated stator. By modulating the stator, the slot fill factor and the cogging torque performance can be improved. The spacers are disposed to isolate the magnetic cores. The rotor is disposed in the modulated stator and includes plural first magnetic pieces and second magnetic pieces arranged alternately, and the magnetic flux lines of the first and second magnetic pieces respectively pass through sidewalls of the magnetic cores to construct C-type magnetic loops of opposite directions thereby improving power density.

Abstract: A system for protecting electronics includes a printed wiring assembly (PWA) having a surface with at least one electronic component. The system also includes a water resistant film configured to be used as a conformal coating on the PWA and further configured to be placed on the surface of the PWA and to shrink about the at least one electronic component.

Abstract: A component carrier includes a base structure and an electrically conductive wiring structure on the base structure. The wiring structure has a nonrectangular cross-sectional shape configured so that an adhesion promoting constriction is formed by at least one of the group consisting of the wiring structure and a transition between the base structure and the wiring structure.

Abstract: A display device includes a display device, a window, and an adhesive material. The display panel includes a display area and a non-display area. The window is on the display panel. The adhesive material is between the display panel and the window. The window includes a base substrate and a blocking barrier. The base substrate includes a first area overlapping the display area, a second area overlapping the non-display area, and a third area protruding outwardly from the display panel. The blocking barrier is on the second area of the base substrate, includes convex patterns and an inner surface facing a central portion of the base substrate. The inner surface of the blocking barrier and the convex patterns contact the adhesive material.

Abstract: A vibration motor includes a housing; a stator; an vibrator accommodated in the housing; an elastic piece suspending the vibrator in the housing; a protrusion protruding along the center axis from the hole wall of the accommodation hole and formed at a position on the mass block corresponding to and fit with the bending structure; at least two magnets fixed on one side of the first side walls far from the hole wall of the accommodation hole. The vibrator includes a mass block with an accommodation hole, a center axis passing through a geometrical center thereof along a vibration direction of the vibrator; and a yoke disposed along a hole wall of the accommodation hole. The yoke includes a first side wall, a second side wall, and bending structures.