Patents Examined by Yuriy Semenenko
-
Patent number: 10680486Abstract: An external rotor motor, including: a rotary shaft; a plastic-packaged stator including a sleeve base, a stator core, a terminal insulator, coil windings, and a plastic-packaged body; and an external rotor sleeving on the plastic-packaged stator. The terminal insulator is disposed on the end face of the stator core. The coil windings are coiled on the terminal insulator. The sleeve base is disposed in an axle hole in the center of the stator core. The rotary shaft is disposed in the sleeve base. Two ends of the rotary shaft are supported by the bearing. One end of the rotary shaft protrudes out from the sleeve base and is connected to the external rotor. The top of the sleeve base extends outwards to form a plurality of arms, and the plurality of arms each includes an outer end which is provided with a bolt.Type: GrantFiled: December 11, 2017Date of Patent: June 9, 2020Assignee: ZHONGSHAN BROAD-OCEAN MOTOR CO. LTD.Inventors: Jinhao He, Jincheng Zhu, Xiongcheng Wang
-
Patent number: 10681821Abstract: Techniques for constructing a wafer based module are provided herein. For example, the techniques include providing a substrate, forming a pattern of conductive material relative to at least one of a surface plane of the substrate and an internal location within the substrate with the pattern of the conductive material including at least an exposed portion, mounting at least one electronic module to the exposed portion of the pattern of the conductive material, orienting the substrate orthogonal relative to a planar mounting surface such that the surface plane of the substrate is substantially orthogonal to the planar mounting surface, mounting one or more additional electronic modules on the planar mounting surface; and forming the semiconductor device by encapsulating the substrate, including the pattern of conductive material, the at least one electronic module and the one or more additional electronic modules within a mold compound.Type: GrantFiled: October 16, 2014Date of Patent: June 9, 2020Assignee: THE CHARLES STARK DRAPER LABORATORY, INC.Inventor: Maurice S. Karpman
-
Patent number: 10679766Abstract: A printed circuit board has a printed wiring board and a semiconductor package mounted on the printed wiring board. The printed wiring board and the semiconductor package are connected with a plurality of solder balls. An underfill material covering the plurality of solder balls is filled between the printed wiring board and the semiconductor package. The underfill material has a relative dielectric constant of 8.6 or more and 54.4 or less. Thus, crosstalk noise generated in wiring in the out-of-plane direction is reduced without increasing the mounting area.Type: GrantFiled: March 19, 2018Date of Patent: June 9, 2020Assignee: Canon Kabushiki KaishaInventors: Takuya Kondo, Shoji Matsumoto, Seiji Hayashi
-
Patent number: 10674597Abstract: A structure for delivering power is described. In some embodiments, the structure can include conductors disposed on two or more layers. Specifically, the structure can include a first set of interdigitated conductors disposed on a first layer and oriented substantially along an expected direction of current flow. At least one conductor in the first set of interdigitated conductors may be maintained at a first voltage, and at least one conductor in the first set of interdigitated conductors may be maintained at a second voltage, wherein the second voltage is different from the first voltage. The structure may further include a conducting structure disposed on a second layer, wherein the second layer is different from the first layer, and wherein at least one conductor in the conducting structure is maintained at the first voltage.Type: GrantFiled: February 5, 2018Date of Patent: June 2, 2020Assignee: Rambus Inc.Inventors: Kyung Suk Oh, Ralf M. Schmitt, Yijiong Feng
-
Patent number: 10671124Abstract: A rollable display device includes: a window member; a first pressure sensitive adhesive member arranged under the window member; a display module detachable from and attachable to the window member by the first pressure sensitive adhesive member; a housing having a groove through which the window member, the first pressure sensitive adhesive member, and the display module are configured to enter and exit from the housing; a first rotation member on which the window member and the first pressure sensitive adhesive member are rollable or slidable; and a second rotation member on which the display module is rollable or slidable.Type: GrantFiled: January 2, 2019Date of Patent: June 2, 2020Assignee: Samsung Display Co., Ltd.Inventors: Jeongho Kim, Hyunwoo Koo, Kyuyoung Kim, Taewoong Kim, Jinhwan Choi, Hayk Kachatryan
-
Patent number: 10653190Abstract: Elastic electrical connectors that may be incorporated into a garment to connect multiple electrical components in the garment. These electrical connectors are typically long strips of fabric substrate to which wires are attached along a length of one side in a sinusoidal or zig-zag pattern. The connector may also include an adhesive coating on one side to secure it to a fabric. The wires are electrically insulated, which may be a thermoremovable insulation (e.g., a polyurethane having a melting point of <400° C.). The wires may be attached to the surface of the fabric strip by a stitch at each peak and trough of the sinusoidal or zig-zag pattern with a length between peak and trough stitches between about 1 mm and 15 mm.Type: GrantFiled: January 22, 2018Date of Patent: May 19, 2020Assignee: L.I.F.E. Corporation S.A.Inventors: Gianluigi Longinotti-Buitoni, Andrea Aliverti, Fabrizio Pallai
-
Patent number: 10660205Abstract: A circuit device formed from a functional substrate. The circuit device comprises a functional substrate component and printed electronic elements formed on the functional substrate component. The printed electronic elements formed on the functional substrate component interact with the substrate component to perform a function and to modify the functional substrate component. The circuit device typically needs a passive base material that takes no functional part in the device operation except mechanical support.Type: GrantFiled: December 1, 2017Date of Patent: May 19, 2020Assignee: AVERY DENNISON RETAIL INFORMATION SERVICES, LLCInventor: Ian J. Forster
-
Patent number: 10658281Abstract: According to various embodiments of the present disclosure, a substrate for an integrated circuit includes a dielectric layer. The substrate further includes a conductive layer extending in an x or y direction. The conductive layer is at least partially embedded within the dielectric layer. The conductive layer includes a via having a first end and an opposite second end. The via has a first height in a z-direction and a constant cross-sectional shape between the first end and the second end. A trace is adjacent to the via and has a second height in the z-direction that is different than the first height.Type: GrantFiled: September 29, 2017Date of Patent: May 19, 2020Assignee: Intel CorporationInventors: Rahul N. Manepalli, Kousik Ganesan, Marcel Arlan Wall, Srinivas Pietambaram
-
Patent number: 10660203Abstract: A display and a circuit board structure thereof are provided. The circuit board structure includes a first circuit board, a second circuit board and a connection structure. The connection structure is disposed on the first circuit board, the second circuit board has gold fingers, the connection structure has pins corresponding to the gold fingers, and the connection structure conducts the first circuit board and the second circuit board by connecting the pins with the gold fingers. Therefore, an extra FFC and a connector disposed on the second circuit board for connecting the first circuit board and the second circuit board are saved to achieve cost reduction and assembling process simplification.Type: GrantFiled: January 17, 2018Date of Patent: May 19, 2020Assignee: HUIZHOU CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.Inventor: Yanxue Zhang
-
Patent number: 10638610Abstract: A memory layout is provided. The layout comprises a circuit board, a plurality of memories, a processing unit, and a reflection absorption unit. The circuit board has a first surface and a second surface. The first surface is set with a first wire unit and a second wire unit corresponding to each other. The memories are separately set on the first and second surfaces of the circuit board and connect to the first and second wire units. The processing unit connects to the first wire unit. The reflection absorption unit connects to the second wire unit. Thus, not only the capacity of the memories is increased, but also, during operating the memories, related reflection signals are absorbed by the reflection absorption unit for stably operating the memories with operation velocity enhanced as well.Type: GrantFiled: January 22, 2019Date of Patent: April 28, 2020Assignee: EOREX CORPORATIONInventors: Cheng-Lung Lin, Wan-Tung Liang
-
Patent number: 10638608Abstract: Frames and other structures for system-in-package modules that may allow components on boards in the modules to communicate with each other.Type: GrantFiled: September 28, 2018Date of Patent: April 28, 2020Assignee: Apple Inc.Inventors: Lan H. Hoang, Raghunandan R. Chaware, Chang Liu, Takayoshi Katahira
-
Patent number: 10627867Abstract: The present invention provides a hinge of a mobile terminal with a flexible screen. The outer side of the hinge supports the flexible screen. The hinge comprises a main support body, a first bracket and a second bracket rotatably connected to a rotating shaft of the hinge, a first support body and a second support body respectively slidably connected to the first bracket and the second bracket, and a synchronous control mechanism. An auxiliary support body is separately provided between the first support body and the main support body and between the second support body and the main support body. The auxiliary support body is correspondingly located at a bend portion of the hinge in a closed state. The hinge is further provided with a first guide structure rotating around the rotating shaft of the hinge together with the first bracket and a second guide structure rotating around the rotating shaft of the hinge together with the second bracket.Type: GrantFiled: April 6, 2017Date of Patent: April 21, 2020Assignee: Hangzhou Amphenol Phoenix Telecom Parts Co., Ltd.Inventors: Guanlun Cheng, Yang Xiao, Mengyu Si
-
Patent number: 10624210Abstract: A printed circuit board and a display device are provided. The printed circuit board includes a plurality of insulation layers; at least one metal layer between the plurality of insulation layers; and a fixing member fixed to a surface of one of the at least one metal layer and passing through an outermost one of insulation layers to protrude to the outside.Type: GrantFiled: November 10, 2016Date of Patent: April 14, 2020Assignee: LG Display Co., Ltd.Inventor: Jaeseung Lee
-
Patent number: 10617018Abstract: A circuit board includes a board, circuitry provided on the board that supplies electric power to a motor, a positive-electrode-side power source terminal portion connected to a positive electrode terminal of the circuitry, and a negative-electrode-side power source terminal portion connected to a negative electrode terminal of the circuitry. The circuitry includes a first capacitor connected to the positive-electrode-side power source terminal portion, and a second capacitor connected to the negative-electrode-side power source terminal portion. The first and second capacitors are connected in series between the positive-electrode-side and the negative-electrode-side power source terminal portions. The board includes a through hole, at least a portion of which is between at least two of the first capacitor, the second capacitor, the positive-electrode-side power source terminal portion, and the negative-electrode-side power source terminal portion.Type: GrantFiled: September 28, 2018Date of Patent: April 7, 2020Assignee: NIDEC ELESYS CORPORATIONInventors: Kazuki Harada, Naoki Yamamoto
-
Patent number: 10602630Abstract: A platform for a military radio with a vehicle adapter amplifier has been developed. The apparatus includes a base for supporting an AN/PRC-117G Man Pack radio in combination with a SINCGARS RT-1523 radio, a for electrically connecting with the AN/PRC-117G Man Pack radio and the SINCGARS RT-1523 radio, and a vehicular power supply system.Type: GrantFiled: January 22, 2019Date of Patent: March 24, 2020Assignee: Perkins Technical Services, Inc.Inventors: Frank N. Perkins, III, Jeffrey K. Taylor, Lloyd W. Childs, Josh Crowe
-
Patent number: 10601265Abstract: A stator is provided for a multiphase electric motor. The stator has a stator core having a multiplicity of stator teeth situated along a circumference of the stator core, coils wound on the stator teeth, and a multiplicity of connecting terminals for contacting the electric motor in a delta connection, with a parallel circuit of the coils per phase. Here, a respective winding wire of the coils is connected directly to the connecting terminal at each connecting terminal. In addition, a multiplicity of coils is connected in parallel to at least one of the connecting terminals, and the connecting terminals are provided for at least one of the phases in each case as a terminal pair made up of a main terminal and a secondary terminal connected to the main terminal by an electrically conductive connecting piece. In addition, an associated winding method is described.Type: GrantFiled: December 5, 2017Date of Patent: March 24, 2020Assignee: Robert Bosch GmbHInventor: Michael Palsule Desai
-
Patent number: 10591958Abstract: An exemplary embodiment provides a rollable display device including: a rollable display panel including a front surface and a rear surface, a first damping layer positioned on the front surface of the rollable display panel, and a second damping layer positioned on the rear surface of the rollable display panel. The first damping layer and the second damping layer have a shear thickening characteristic.Type: GrantFiled: September 28, 2018Date of Patent: March 17, 2020Assignee: Samsung Display Co., Ltd.Inventors: Tae Woong Kim, Khachatryan Hayk, Hyun Woo Koo, Min-Sung Kim, Jeong Ho Kim, Jin Hwan Choi
-
Patent number: 10582616Abstract: Disclosed are a uniformly emitting linear LED light source assembly and a method thereof. The linear LED light source assembly comprises a first light strip, at least one second light strip and at least one connecting board which are all provided with a plurality of LEDs closely arranged at equal intervals, wherein the equal interval is less than 3.5 mm to realize uniform illumination. The connecting board connects the first light strip and the second light strip. The LED closest to the first light strip on the connecting board and the LED closest to the connecting board on the first light strip are formed at the same pitch as the equal interval. In addition, the LED closest to the second light bar on the connecting board and the LED closest to the connecting board on the second light bar are formed at the same pitch as the equal interval.Type: GrantFiled: December 17, 2018Date of Patent: March 3, 2020Assignee: EXCELLENCE OPTOELECTRONICS INC.Inventors: Yen-Cheng Chen, Tse-Wei Chiu, Cheng-Tai Jao
-
Patent number: 10582613Abstract: A printed circuit board includes: a board body including one or more wiring layers; a control chip and a target electronic component arranged on one of the one or more the wiring layers on a surface of the board body; a target wiring layer where the target electronic component is placed including a copper absent area around the target electronic component, and a ground backflow connection arranged around the target electronic component to electrically connect a copper area which is formed by the copper absent area with a primary copper area on the target wiring layer.Type: GrantFiled: October 9, 2018Date of Patent: March 3, 2020Assignee: Hisense Mobile Communications Technology Co., LtdInventor: Qingyi Zhao
-
Patent number: 10581327Abstract: A circuit assembly for a power converter includes power stage blocks and heat-dissipating substrate. A power stage block includes a power stage IC die, an output inductor that is connected to a switch node of the power stage IC die, and capacitors that form an output capacitor of the power stage block. The output capacitors of the power stage blocks are symmetrically arranged. The output inductors can be placed on the same side of the substrate as the power stage IC dies, or on a side of the substrate that is opposite to the side where the power stage IC dies are disposed. A power stage block may generate two output phases of the power converter.Type: GrantFiled: June 11, 2019Date of Patent: March 3, 2020Assignee: Monolithic Power Systems, Inc.Inventors: Jinghai Zhou, Chia-Hsin Chang