Patents by Inventor An-Cheng Chang

An-Cheng Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11637204
    Abstract: A device includes a semiconductive substrate, a semiconductive fin, a stop layer, a fin isolation structure, and a spacer. The semiconductive fin is over the substrate. The stop layer is between the semiconductive substrate and the semiconductive fin. The fin isolation structure is in contact with the semiconductor fin and over the stop layer. A topmost surface of the fin isolation structure is higher than a topmost surface of the semiconductive fin. The spacer at least partially extends along a sidewall of the fin isolation structure.
    Type: Grant
    Filed: December 6, 2020
    Date of Patent: April 25, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Che-Cheng Chang, Chih-Han Lin, Horng-Huei Tseng
  • Publication number: 20230120593
    Abstract: Disclosed herein includes a system, a method, and a device for compressing image data. The device includes one or more processors, coupled to memory, configured to identify a plurality of sub-blocks of a block of image data including a first sub-block and a second sub-block. The one or more processors are configured to identify a first data characteristic of data of the first sub-block and a second data characteristic of data of the second sub-block, determine a first compression technique based at least on the first data characteristic of the first sub-block, determine a second compression technique based at least on the second data characteristic of the second sub-block, and compress the first sub-block using the first compression technique and the second sub-block using the second compression technique.
    Type: Application
    Filed: October 21, 2022
    Publication date: April 20, 2023
    Inventors: Cheng Chang, Richard Lawrence Greene, Richard Webb
  • Publication number: 20230123118
    Abstract: An embodiment of the present invention provides a picture processing method in an embedded system. The picture processing method includes: performing a bit setting operation on an input/output register corresponding to a communication GPIO port of a camera module in the embedded system, so as to improve a picture collection speed of the camera module; compressing a collected picture using a preset picture compression algorithm and transmitting the compressed picture to a picture preprocessing unit in the embedded system; and filtering out, by the picture preprocessing unit, a picture background using a preset filtering algorithm to obtain picture features of a target object in the picture. With the picture processing method, requirements for an occupied memory resource are balanced while a picture collection speed and a picture data processing speed are increased.
    Type: Application
    Filed: October 9, 2021
    Publication date: April 20, 2023
    Inventors: Yihuai WANG, Chunping LIU, Jin WANG, Lianmin SHI, Zhanpeng HU, Cheng CHANG
  • Patent number: 11628450
    Abstract: A tramp metal removing device has a primary housing to define a product flow path for being passed by a stream of raw materials and a moving path. A secondary housing is connected to the primary housing. A plurality of drawer units are sequentially stacked on the primary housing and secondary housing. Each drawer unit has a frame, a plurality of magnetic members and a scraping assembly. The frame is coupled with the primary and secondary housings in a movable way. Each of magnetic members is secured on the frame and has a magnetic section and a non-magnetic section. The scraping assembly is coupled with the frame in a way that it is only moveable in the secondary housing for removing tramp metals of a stream of raw materials in a two-stage manner.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: April 18, 2023
    Assignee: TAI HAN EQUIPMENT ENTERPRISE CO., LTD.
    Inventors: Shyh-Yi Wey, Wen-Cheng Chang, Kuen Ting Hsieh, Ken-Der Lin, Bao-Ding Li, Rong-Huei Wang, Jia-Ying Hong, Fu-Chen Wang, Ho-Chi Kang
  • Patent number: 11631748
    Abstract: Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a semiconductor substrate and a gate electrode over the semiconductor substrate. The semiconductor device structure also includes a source/drain structure adjacent to the gate electrode. The semiconductor device structure further includes a spacer element over a sidewall of the gate electrode, and the spacer element has an upper portion having a first exterior surface and a lower portion having a second exterior surface. Lateral distances between the first exterior surface and the sidewall of the gate electrode are substantially the same. Lateral distances between the second exterior surface and the sidewall of the gate electrode increase along a direction from a top of the lower portion towards the semiconductor substrate.
    Type: Grant
    Filed: October 8, 2020
    Date of Patent: April 18, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Bo-Feng Young, Che-Cheng Chang, Mu-Tsang Lin, Tung-Wen Cheng, Zhe-Hao Zhang
  • Patent number: 11630362
    Abstract: A one-way glass with switching modes includes an absorbing layer located on a weak light side, a reflecting layer located on an intense light side, and a converting layer stacked between the absorbing layer and the reflecting layer. The absorbing layer absorbs first polarized light and allows second polarized light to pass through. The reflecting layer reflects the first polarized light and allows the second polarized light to pass through. Unpolarized light incident from the weak light side or from the intense light side is respectively converted into the polarized light. During the process of gradually adjusting the converting layer from a twisted state to a vertical state, rotated angles of polarization directions of the first polarized light and the second polarized light gradually decrease.
    Type: Grant
    Filed: June 17, 2022
    Date of Patent: April 18, 2023
    Assignee: NATIONAL SUN YAT-SEN UNIVERSITY
    Inventors: Tsung-Hsien Lin, Chun-Ta Wang, Heng-Yi Tseng, Cheng-Chang Li, Li-Min Chang, Kuan-Wu Lin, Hung-Chang Jau
  • Publication number: 20230114917
    Abstract: A FinFET structure with a gate structure having two notch features therein and a method of forming the same is disclosed. The FinFET notch features ensure that sufficient spacing is provided between the gate structure and source/drain regions of the FinFET to avoid inadvertent shorting of the gate structure to the source/drain regions. Gate structures of different sizes (e.g., different gate widths) and of different pattern densities can be provided on a same substrate and avoid inadvertent of shorting the gate to the source/drain regions through application of the notched features.
    Type: Application
    Filed: December 5, 2022
    Publication date: April 13, 2023
    Inventors: Chang-Yin Chen, Che-Cheng Chang, Chih-Han Lin, Horng-Huei Tseng
  • Publication number: 20230109951
    Abstract: A semiconductor device and method of manufacture are provided. A source/drain region is formed next to a spacer, which is adjacent to a gate electrode. An implantation is performed through an implantation mask into the source/drain region as well as the first spacer, forming an implantation region within the spacer.
    Type: Application
    Filed: December 13, 2022
    Publication date: April 13, 2023
    Inventors: Che-Cheng Chang, Chih-Han Lin, Horng-Huei Tseng
  • Publication number: 20230116545
    Abstract: A semiconductor device structure and method for forming the same are provided. The semiconductor device structure includes a first metal layer formed over a substrate and a dielectric layer formed over the first metal layer. The semiconductor device structure further includes an adhesion layer formed in the dielectric layer and over the first metal layer and a second metal layer formed in the dielectric layer. The second metal layer is electrically connected to the first metal layer, and a portion of the adhesion layer is formed between the second metal layer and the dielectric layer. The adhesion layer includes a first portion lining with a top portion of the second metal layer, and the first portion has an extending portion along a vertical direction.
    Type: Application
    Filed: December 13, 2022
    Publication date: April 13, 2023
    Inventors: Che-Cheng Chang, Chih-Han Lin
  • Patent number: 11625082
    Abstract: A computing system includes a target device to be cooled, a fan unit, a storage device storing a first portion and a second portion of firmware, and a baseboard management controller (BMC). In the firmware, only the first portion is related to heat-dissipation control. The BMC executes the firmware for monitoring the target device, generating a monitoring report for the target device, and controlling the rotational speed of the fan unit based on the monitoring report thus generated and on cooling parameters and cooling algorithms stored in the first portion of the firmware.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: April 11, 2023
    Assignee: Jabil Circuit (Shanghai) Co., Ltd.
    Inventors: Yen-Cheng Chang, Chin Liang
  • Publication number: 20230103404
    Abstract: A detection system and a portable detection device for detecting an object of interest in a lateral flow immunoassay strip. The lateral flow immunoassay strip has a detection carrier and a reporter, the detection carrier has a control zone and a test zone. The detection system has a laser light source, a scanning and spatial modulation module, a signal acquisition assembly, and a processing device. The laser light source provides a laser light. The scanning and spatial modulation module receives the laser light, and then provides a scanning and spatially modulating laser beam for irradiating a lateral flow immunoassay strip to generate a detecting signal. The signal acquisition assembly receives the detecting signal. The processing device electronic connects to the signal acquisition assembly and receives the detecting signal from the signal acquisition assembly.
    Type: Application
    Filed: October 4, 2022
    Publication date: April 6, 2023
    Inventors: Huan-Cheng CHANG, Yuen-Yung HUI, Yi-Xiu TANG
  • Publication number: 20230106008
    Abstract: A power supply device, a power supply management module and method are provided. The power supply device includes a power supply management module. The power supply management module includes a first and a second power supply module, a detection unit, and a switching control module. The first power supply module includes a first alternating current input end, a first rectifier circuit, and a first switch unit. A first end of the first switch unit is connected to the first rectifier circuit. The second power supply module includes a second alternating current input end, a second rectifier circuit, and a second switch unit. A third end and a fourth end of the second switch unit are connected to the second rectifier circuit and a second end of the first switch unit, respectively. The switching control module controls the first and the second switch unit according to a detection signal.
    Type: Application
    Filed: November 17, 2021
    Publication date: April 6, 2023
    Inventors: Yung-Hung Hsiao, Chia-Hsien Yen, Hao-Chieh Chang, Cheng-Chang Hsiao, Da-Shian Chen
  • Publication number: 20230106960
    Abstract: A semiconductor device includes a substrate, a photo sensing region, and a plurality of semiconductor plugs. The photo sensing region is in the substrate. The photo sensing region forms a p-n junction with the substrate. The semiconductor plugs extend from above the photo sensing region into the photo sensing region.
    Type: Application
    Filed: November 28, 2022
    Publication date: April 6, 2023
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsin-Hsiang TSENG, Chih-Fei LEE, Chia-Pin CHENG, Fu-Cheng CHANG
  • Publication number: 20230107892
    Abstract: To provide a negative type photosensitive composition which is capable of forming a cured film having good light shielding properties and high reflectance. [Means for Solution] A negative type photosensitive composition comprising an alkali-soluble resin having a particular structure, a reflectance modifier, a polymerization initiator, and a solvent.
    Type: Application
    Filed: March 5, 2021
    Publication date: April 6, 2023
    Inventors: Suryani LIN, Yi-Meng YEN, Yung-Cheng CHANG, Daishi YOKOYAMA, Atsuko NOYA
  • Patent number: 11618728
    Abstract: An ether-bridged dication is provided with two monovalent cations bonded via a carbon chain having ether group(s). The ether-bridged dication, monovalent cations, and anions are contained together within an ionic liquid electrolyte which is applied to a charge storage device. The ether-bridged dication, the ionic liquid electrolyte, and the charge storage device have operational abilities at room temperatures or below, and a reachable working potential of 3.5 V.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: April 4, 2023
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Hsisheng Teng, I-wen Sun, Hsin-Chieh Huang, Yung-Che Yen, Jui-Cheng Chang
  • Patent number: 11621191
    Abstract: In a method of manufacturing a semiconductor device, initial connection patterns are prepared, initial cutting patterns for cutting the initial connection patterns are prepared, non-functional connection patterns at least from the initial connection patterns are identified, final cutting patterns are prepared from the initial cutting patterns and the non-functional connection patterns, a photo mask is prepared from the final cutting patterns, a photo resist pattern is formed over a target layer by a lithography operation using the photo mask, the target layer is patterned to form openings in the target layer by using the photo resist pattern, and connection layers are formed by filling the openings with a conductive material.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: April 4, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yuan-Yen Lo, Chia-Cheng Chang, Ming-Jhih Kuo, Chien-Yuan Chen
  • Patent number: 11622169
    Abstract: An embodiment of the present invention provides a picture processing method in an embedded system. The picture processing method includes: performing a bit setting operation on an input/output register corresponding to a communication GPIO port of a camera module in the embedded system, so as to improve a picture collection speed of the camera module; compressing a collected picture using a preset picture compression algorithm and transmitting the compressed picture to a picture preprocessing unit in the embedded system; and filtering out, by the picture preprocessing unit, a picture background using a preset filtering algorithm to obtain picture features of a target object in the picture. With the picture processing method, requirements for an occupied memory resource are balanced while a picture collection speed and a picture data processing speed are increased.
    Type: Grant
    Filed: October 9, 2021
    Date of Patent: April 4, 2023
    Assignee: SOOCHOW UNIVERSITY
    Inventors: Yihuai Wang, Chunping Liu, Jin Wang, Lianmin Shi, Zhanpeng Hu, Cheng Chang
  • Publication number: 20230102783
    Abstract: An automatic detection method for a paper size is disclosed. a plurality of mark points is set on a paperweight along a paperweight direction that is different from a feeding direction. The disclosure senses a plurality of row images combining into a scan image during a paper passing between the paperweight and an image sensor, determines an edge length of the paper based on a range of the mark points covered by the paper, and determines a paper size based on the edge length. The disclosure can effectively detect the paper size without any additional sensors.
    Type: Application
    Filed: December 13, 2021
    Publication date: March 30, 2023
    Inventors: Yung-Sen CHENG, Tzu-Cheng CHANG
  • Patent number: 11614561
    Abstract: A glass clamping model based on microscopic displacement experiment, including a frame, a transparent silicone sleeve having a horizontal through hole, a piston, a piston cap arranged on the frame, a connecting plate, a screw compression bracket, a clamp support, a glass sheet entirety placed in the transparent silicone sleeve, a boss, a light source and a microscope. The transparent silicone sleeve is sheathed on the piston cap, the piston penetrates through the horizontal penetration hole; the connecting plate and the clamp support are respectively connected to both ends of the frame, the end of the screw compression bracket is clamped between the frame and the connecting plate, and the piston and the frame are connected with the clamp support; an emptying channel and an inlet passage are respectively arranged at both ends of the piston, and an outlet passage is arranged at an end of the piston.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: March 28, 2023
    Inventors: Yongming Li, Tai Chang, Yu Peng, Huohai Yang, Guowei Deng, Juhui Zhu, Cheng Chang
  • Patent number: D983841
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: April 18, 2023
    Inventor: Chi-Cheng Chang