Abstract: An integrated cooling unit configured to effect the removal of heat via a circulating liquid coolant includes a reservoir to contain the liquid coolant, a tubing arrangement disposed at an outer surface of the reservoir, a pump disposed within the reservoir, and a fan configured to provide a flow of air across the tubing arrangement to remove the heat. The tubing arrangement is fluidly communicable with a heat exchanging device, and the pump is configured to circulate the liquid coolant through the tubing arrangement to the heat exchanging device.

Abstract: Impingement plate and jet nozzle assemblies are presented for use in cooling an electronic module. The assemblies include a thermally conductive plate having a first main surface and a second main surface with a plurality of concave surface portions formed in the second main surface extending towards the first main surface. Each concave surface portion has a conic section profile. A plurality of jet nozzles are disposed above the thermally conductive plate with each jet nozzle being aligned over a respective concave surface portion, wherein fluid introduced into a concave surface portion through the respective jet it nozzle impinges upon a lower portion thereof and flows outward along the concave surface portion. Each conic section profile is one of an elliptical section, a circular section, or a parabolic section.

Abstract: Impingement plate and jet nozzle assemblies are presented for use in cooling an electronic module. The assemblies include a thermally conductive plate having a first main surface and a second main surface with a plurality of concave surface portions formed in the second main surface extending towards the first main surface. Each concave surface portion has a conic section profile. A plurality of jet nozzles are disposed above the thermally conductive plate with each jet nozzle being aligned over a respective concave surface portion, wherein fluid introduced into a concave surface portion through the respective jet nozzle impinges upon a lower portion thereof and flows outward along the concave surface portion. Each conic section profile is one of an elliptical section, a circular section, or a parabolic section.

Abstract: A cooling system and method of fabrication are provided for cooling one or more heat-generating electronic elements within a portable computer. The cooling system includes a cold plate assembly thermally coupled to a heat-generating electronic element, and a heat exchange structure disposed within the cover of the portable computer. The heat exchange structure includes a hollow channel and an expansion chamber in fluid communication with the channel. A conduit carries coolant between the cold plate assembly and the hollow channel in the heat exchange structure, and a circulation pump circulates coolant through the conduit between the cold plate assembly and the heat exchange structure in a manner to remove heat from the heat-generating electronic component. The expansion chamber integrated within the heat exchange structure provides a reservoir for the circulation pump from which to draw coolant for circulation through the cold plate assembly.

Abstract: A method and apparatus for removing moisture from within an electronics enclosure is provided. In particular, dehumidification is accomplished by removing air from the enclosure, cooling the air thereby causing condensation of water vapor from the air, then heating the dehumidified air and returning the heated and dehumidified air to the enclosure. A single heat pump provides cooling and heating functions, effectively recouping heat extracted from the air to be cooled, and transferring the extracted heat to the air prior to its return to the enclosure. In this manner, electronics within the enclosure may be operated at temperatures below the dew point of ambient air surrounding the enclosure, without requiring a thermally insulated enclosure. Devices are provided to collect and purge condensate from the system, either in a continuous or periodic manner. Embodiments employing conventional vapor compression cycle heat pumps and thermoelectric heat pumps are described.

Abstract: An electronic module is provided having an integrated thermoelectric cooling assembly disposed therein coupled to the module's electronic device. The thermoelectric assembly includes one or more thermoelectric stages and a thermal space transformer, for example, disposed between a first thermoelectric stage and a second thermoelectric stage. The electronic device is mounted to a substrate with the thermoelectric assembly disposed in thermal contact with the electronic device and a thermally conductive cap is positioned over the thermoelectric assembly, and is also in thermal contact with the thermoelectric assembly. Power to the thermoelectric assembly can be provided using electrically conductive springs disposed between one or more stages of the assembly and pads on an upper surface of the substrate, which electrically connect to power planes disposed within the substrate.

Abstract: The invention relates to a method and apparatus for transmitting control information over an audio data stream, such as PCM coded speech information. The device comprises a control unit having two inputs receiving the PCM speech samples and control information signal. Each PCM sample is made up of a plurality of bits arranged according to different significance positions, such as position 0, 1, 2, 3, _N, where N+1 is the number of bits in the sample. The control unit receives a selected sample and shifts a bit at a selected significance position to a lower significance position. The empty slot at the predetermined significance position is used to receive a bit from the control information signal. The compound signal thus obtained is then released over a transport path, such as a T1 link, for transmission to a remote location.

Abstract: A system and method of digitizing characteristic parameters of a quasi-sinusoidal analog signal of unknown magnitude, frequency and phase-offset, includes digitizing the analog signal at a first sampling rate, thereby generating a plurality of sets of digital signal waveform samples. Successive sets of the digital signal waveform samples are digitally processed to generate continually updated digital characteristic parameters representing a characteristic behavior of the quasi-sinusoidal analog signal.

Abstract: A method and apparatus for monitoring and controlling the operating point of a satellite transponder amplifier. In one aspect of the invention, a time domain signal received at a ground station is digitally sampled. Then, a histogram of the received signal is computed. To form the histogram, the digital samples are categorized according to which of a plurality of amplitude ranges each sample falls within. When plotted as a graph, the number of occurrences within each amplitude range forms the histogram. Under low compression levels, the histogram generally appears as an approximately bell-shaped curve. However, under higher compression levels, the bell-shaped curve becomes distorted. By correlating the acquired histogram to a template histogram, an amount of compression can be determined. This amount of compression indicates the operating point of the transponder amplifiers.

Abstract: A chair having a swingable chair back with a top pivot includes a frame having laterally spaced first and second uprights. A back having upper and lower ends is attached to the frame. Also attached to the frame adjacent the lower end of the back is a seat. A pivot assembly couples the first and second uprights to the back and permits pivoting of the back about a substantially horizontal pivot axis. The pivot axis projects laterally of the back and is positioned in the vicinity of the upper end of the back. A biasing device cooperates with the back and normally urges the lower portion of the back forwardly away from a rearward position.

Abstract: A chair having adjustable height arms includes a rigid chair frame having first and second uprights. A back is attached to the chair frame and includes upper and lower ends. A seat is also attached to the chair frame and is adjacent the lower end of the back. Cantilevered to each of the first and second uprights is an arm assembly that projects outwardly therefrom adjacent opposite sides of the seat. Each arm assembly includes a coupling structure that is releasably engaged with a respective upright and is configured to release from the upright when the arm assembly is tilted upward relative to the respective upright to permit the elevational position of the arm assembly to be adjusted.

Abstract: A method and apparatus for removing moisture from within an electronics enclosure is provided. In particular, dehumidification is accomplished by removing air from the enclosure, cooling the air thereby causing condensation of water vapor from the air, then heating the dehumidified air and returning the heated and dehumidified air to the enclosure. A single heat pump provides cooling and heating functions, effectively recouping heat extracted from the air to be cooled, and transferring the extracted heat to the air prior to its return to the enclosure. In this manner, electronics within the enclosure may be operated at temperatures below the dew point of ambient air surrounding the enclosure, without requiring a thermally insulated enclosure. Devices are provided to collect and purge condensate from the system, either in a continuous or periodic manner. Embodiments employing conventional vapor compression cycle heat pumps and thermoelectric heat pumps are described.

Abstract: Cavity plate and jet nozzle assemblies are presented for use in cooling an electronic module. The assemblies include a cavity plate having one or more blind holes formed therein and one or more jet nozzles each configured to reside within a respective blind hole of the cavity plate. A lower surface of the blind hole and/or jet nozzle is curved to facilitate the flow of fluid from the blind hole after impinging upon the lower surface of the blind hole. Various jet nozzle configurations are also provided which employ pedestals or radially extending fins. Further, the radially extending fins may interdigitate with inwardly extending fins on the inner sidewall of a respective blind hole in the cavity plate. Methods of fabricating the cavity plate and jet nozzle assemblies are also presented.

Abstract: A thermal dissipation subassembly is provided for an electronic device. The subassembly includes a thermal spreader configured to thermally couple to a surface of a heat generating component of the electronic device. The heat generating component, e.g., an integrated circuit chip, has a non-uniform thermal distribution across the surface thereof between at least one first region of the surface and at least one second region of the surface, with the at least one first region having a higher heat flux than the at least one second region. The subassembly further includes at least one thermoelectric device aligned to at least a portion of each first region having the higher heat flux, wherein the at least one thermoelectric device facilitates dissipation of the higher heat flux. In one embodiment, one or more thermoelectric devices are embedded within the thermal spreader and thermally isolated therefrom.

Abstract: Cavity plate and jet nozzle assemblies are presented for use in cooling an electronic module. The assemblies include a cavity plate having one or more blind holes formed therein and one or more jet nozzles each configured to reside within a respective blind hole of the cavity plate. A lower surface of the blind hole and/or jet nozzle is curved to facilitate the flow of fluid from the blind hole after impinging upon the lower surface of the blind hole. Various jet nozzle configurations are also provided which employ pedestals or radially extending fins. Further, the radially extending fins may interdigitate with inwardly extending fins on the inner sidewall of a respective blind hole in the cavity plate. Methods of fabricating the cavity plate and jet nozzle assemblies are also presented.

Abstract: A cooling system and method of fabrication are provided for cooling an electronics device. The cooling system includes a cooling unit and an evaporator plate having at least one isolated refrigerant loop therein for receiving coolant from the cooling unit. A thermal buffer unit having a phase change material therein is thermally coupled to the evaporator plate to maintain temperature of the evaporator plate within a predefined range for a period of time upon failure or shut down of the cooling unit. A thermal conductor structure, such as a metal foam structure and/or thermal transfer rods, is disposed within the thermal buffer unit to facilitate heat transfer between the phase change material and the evaporator plate.