Abstract: A method and apparatus for chemically mechanically planarizing (CMP) a semiconductor wafer includes directing acoustic waves at the wafer and receiving reflected acoustic waves from the wafer during the (CMP) process. By analyzing the acoustic waves and reflected acoustic waves a thickness of the wafer can be determined and an endpoint and thickness of films formed on the wafer can be monitored in real time during the (CMP) process. The process parameters of the (CMP) process can then be adjusted as required to improve the uniformity of the process.

Abstract: A thermoplastic composition is provided which comprises a polyamide, a grafted polymer of an isomonoolefin and an alkylstyrene, such as a maleic anhydride-grafted copolymer of isobutylene and para-methylstyrene, and optionally a polyolefin polymer.

Abstract: Poly(arylene sulfide/sulfone) polymers are treated in order to increase melt stability and decrease impurities by contacting the poly(arylene sulfide/sulfone) polymer with a soluble zinc compound and an acidic solution. In one embodiment, the polymer is treated first with the soluble zinc compound, followed by treatment with the acidic solution. In another embodiment, the polymer is treated in one step with a solution comprising a water soluble zinc compound in an acidic solution.

Abstract: Fabrication of spacer supports for use in flat panel displays through a process which involves 1) depositing an insulating material on an electrode plate, 2) optionally, patterning a reflective material superjacent the insulating material, 3) irradiating the electrode plate, and thereby removing the exposed insulating material, 4) optionally, removing the reflective material, and thereby exposing the remaining insulative material which will serve as the spacer supports, after which the plate can be aligned with a complementary electrode plate, and a vacuum formed therebetween.

Abstract: A semiconductor processing method of chemical mechanical polishing a predominately copper containing metal layer on a semiconductor substrate includes, a) providing a chemical mechanical polishing slurry comprising H.sub.2 O, a solid abrasive material, and a third component selected from the group consisting of HNO.sub.3, H.sub.2 SO.sub.4, and AgNO.sub.3 or mixtures thereof; and b) chemical mechanical polishing a predominately copper containing metal layer on a semiconductor substrate with the slurry. Such slurry also constitutes part of the invention. Such slurry may also contain an additional oxidant selected from the group consisting of H.sub.2 O.sub.2, HOCl, KOCl, KMgO.sub.4 and CH.sub.3 COOH or mixtures thereof to form a copper oxide passivating-type layer at the copper surface.

Abstract: A method and system for controlling the depth of removal by polishing of a selected material on a supporting underlayer where it is desired to terminate removal of the selected material, such as tungsten, at the material-underlayer interface. In accordance with this novel method and system, the selected material such as a surface metallization layer is polished to initiate removal thereof in the direction of the material-underlayer interface. A microphone is positioned at a predetermined distance from the wafer to sense acoustical waves generated when the depth of material removal reaches a certain determinable distance from the interface to thereby generate output detection signals. These output detection signals are amplified and then applied to a spectrum analyzer which operates to analyze the sound intensity-versus-frequency characteristic of the acoustical waves received by the microphone.

Abstract: Poly(biphenylene sulfide/poly(phenylene sulfide) copolymers are produced by contacting a p-dihalobenzene and a bis-p-halobiphenyl under polymerization conditions. Additionally a poly(biphenylene sulfide)/poly(phenylene sulfide) copolymer/fiber reinforced composite is provided.

Abstract: A semiconductor processing method of chemical mechanical polishing an aluminum containing metal layer on a semiconductor substrate includes, a) providing a chemical mechanical polishing slurry comprising H.sub.3 PO.sub.4 at from about 0.1% to about 20% by volume; H.sub.2 O.sub.2 at from about 1% to about 30% by volume, H.sub.2 O, and a solid abrasive material; and b) chemical mechanical polishing an aluminum containing metal layer on a semiconductor substrate with the slurry. Such process and slurry are also usable in chemical mechanical polishing of other layers, such as Ti, TiN and TiW materials. Such enables chemical mechanical polishing of a barrier metal/aluminum layer composite in a single polishing step, leading to increased controllability and resulting increased throughput. With respect to aluminum containing metal layers, the H.sub.2 O.sub.2 is understood to cause oxidation to aluminum oxide, which is subsequently removed by both chemical and mechanical action the result of the polish and slurry.

Abstract: Polyethylene terephthalate molding compositions are provided which comprise polyethylene terephthalate, an aliphatic polyester, a warp resisting amount of an arylene sulfide copolymer, filler, and optionally, colorants.

Abstract: An articulated support for an audio amplifier housing comprising a first arm pivotable from a retracted position in the housing to an angularly extended position and then translatable in and out with respect to the housing, and a second arm pivotable at one end from a retracted position in the first arm to an angularly extended position, with an adjustable speaker mount at the other end of the second arm allowing a speaker to be rotated and tilted.

Abstract: A process for selectively electrodepositing a pattern of metal such as copper on a substrate comprises the deposition of two successive layers over the entire substrate, photolithographic patterning of the upper layer, and placement of the exposed part of the first deposited layer to a lower surface potential then the patterned second layer. The metal is then deposited under a periodical modulated voltage signal that is adjusted in reference to the reduction potential of the metal so that any metal deposited on the exposed part of the first layer during the positive duty cycle of the signal is removed during the negative duty cycle while little or none of the metal deposited on the second layer is removed due to the second layer higher surface potential. The remaining exposed part of the first layer is etched away after the electrodeposition process is terminated.

Abstract: Low temperature heat curable arylene sulfide copolymer compositions which are particularly suitable for use in coating applications are provided. The compositions basically comprise a first arylene sulfide copolymer having unsubstituted para- and ortho-aromatic sulfide repeating units in the polymer chain, and a second arylene sulfide copolymer having unsubstituted para-aromatic sulfide repeating units and alkyl-substituted aromatic sulfide repeating units in the polymer chain.

Abstract: The present invention is a surface modification process which provides a means of rapidly heating a thin layer of a polymer surface or a thin coating of material on a coated substrate and various surfaces produced by such a process.

Abstract: Method is disclosed of treatment of waste paper or the like at high temperatures in the range of 160.degree. C. to about 230.degree. C. The furnish is treated in a digester with or without added chemicals but in the presence of saturated steam. The preferred dwell times are in the range of about 1 minute to about 6 minutes. The treated furnish is then discharged from the digester, preferably, but not exclusively, by an explosive discharge.The advance in the art is in an improved de-inking effect, reduced consumption of chemicals and power. Also, some furnishes previously unsuitable for re-cycling, have been successfully processed by the method of the invention.

Abstract: A durable filter driving mechanism for a color optical reader that is capable of being positively and accurately positioned is proposed. The filter driving mechanism includes a guiding piece mounting thereon a reduction gear assembly having a reduction gear set meshing with a rack of a sliding piece having a rail coupling thereto a color filter assembly operating in cooperation with a lens assembly and a charge coupled element.

Abstract: There are provided compositions comprising poly(arylene sulfide), polymeric rubber, polyethylene, and carboxylic anhydride; and methods for making these compositions. Articles produced from the compositions have reduced shrinkage and improved impact strength.

Abstract: This invention relates to aqueous epoxy resin-containing compositions and to such compositions which are particularly useful for depositing coatings on metallic substrates in order to protect substrates against corrosion. The aqueous compositions generally comprise (A) an organic resin component consisting essentially of at least one water-dispersible or emulsifiable epoxy resin or a mixture of resins containing more than 50% by weight of at least one water-dispersible or emulsifiable epoxy resin, (B) chromium trioxide, and (C) water, said composition further characterized as being substantially free of strontium chromate. The aqueous compositions may also contain other ingredients including zinc and/or ferro alloys.These aqueous compositions are useful as pretreatment coatings on metal surfaces, and in particular, on steel and on galvanized and aluminized metal substrates.

Abstract: A phenylene sulfide/sulfone polymer with relatively good melt stability and a method of producing such a polymer are provided. A previously produced phenylene sulfide/sulfone polymer is redissolved in N-methyl-2-pyrrolidone to form a solution. This solution is combined with an alcohol to precipitate highly melt stable phenylene sulfide/sulfone polymer in a particulate form. The alcohol has one to four carbon atoms, such as methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, and the like and mixtures thereof.

Abstract: A dynamically vulcanized thermoplastic composition is provided which comprises a polymer blend of a polyolefin resin, a halogenated elastomeric copolymer, such as a halogenated butyl rubber, or a halogenated copolymer of a C.sub.4 to C.sub.7 isomonoolefin and a para-alkylstyrene, and a halogenated polyethylene. The composition has improved flame retarding properties. Additional flame retarding additives may be incorporated in the composition. The dynamically vulcanized thermoplastic composition is suitable for use in roofing sheets.

Abstract: A phenylene sulfide/sulfone polymer with relatively good melt stability and a method of producing such a polymer are provided. A previously produced phenylene sulfide/sulfone polymer is redissolved in N-methyl-2-pyrrolidone to form a solution. This solution is combined with an alcohol to precipitate highly melt stable phenylene sulfide/sulfone polymer in a particulate form. The alcohol has one to four carbon atoms, such as methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, and the like and mixtures thereof.