Abstract: A switch and a scheduling method for packet forwarding of the same are provided. The switch includes a plurality of absorb queues, a plurality of egress ports, and an absorb scheduler. Each of the egress ports includes a plurality of egress queues that are respectively connected to one of the absorb queues that are different from one another. The scheduling method includes: generating a priority state for each of the egress queues of each of the egress ports; a packet forwarding priority state of each of the absorb queues is determined according to the priority state of each of the egress queues connected thereto; and the absorb scheduler selecting one of the absorb queues to send a packet stored therein to a target egress queue of a target egress port to be sent to, according to the priority state of each of the egress queues.

Abstract: A chip transferring method includes steps of: providing a plurality of chips on a first load-bearing structure; measuring photoelectric characteristic values of the plurality of chips; categorizing the plurality of chips into a first portion of the plurality of chips and a second portion of the plurality of chips according to the photoelectric characteristic values of the plurality of chips, wherein the second portion of the plurality of chips comprise parts of the plurality of chips which photoelectric characteristic value falls within an unqualified range; removing the second portion of the plurality of chips from the first load-bearing structure; dividing the first portion of the plurality of chips into a plurality of blocks, wherein each of the plurality of blocks comprising multiple chips of the first portion of the plurality of chips; and transferring the first portion of the plurality of chips in one of the plurality of blocks to a second load-bearing structure in single-batch.

Abstract: A semiconductor device includes a first fin protruding upwardly from a substrate, a second fin protruding upwardly from the substrate, a first gate structure having a first portion that at least partially wraps around an upper portion of the first fin and a second portion that at least partially wraps around an upper portion of the second fin, a second gate structure having a portion that at least partially wraps around the upper portion of the first fin, and a dielectric feature having a first portion between the first and second portions of the first gate structure. In a lengthwise direction of the first fin, the dielectric feature has a second portion extending to a sidewall of the second gate structure.

Abstract: A semiconductor device includes an active fin disposed on a substrate, a gate structure, and a pair of gate spacers disposed on sidewalls of the gate structure, in which the gate structure and the gate spacers extend across a first portion of the active fin, and a bottom surface of the gate structure is higher than a bottom surface of the gate spacers.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a circuit assembly. The movable assembly is configured to connect an optical element, the movable assembly is movable relative to the fixed assembly, and the optical element has an optical axis. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The circuit assembly includes a plurality of circuits and is affixed to the fixed assembly.

Abstract: The present disclosure provides one embodiment of a semiconductor structure. The semiconductor structure includes a semiconductor substrate; a first conductive feature and a second conductive feature disposed on the semiconductor substrate; and a staggered dielectric feature interposed between the first and second conductive feature. The staggered dielectric feature includes first dielectric layers and second dielectric layers being interdigitated. The first dielectric layers include a first dielectric material and the second dielectric layers include a second dielectric material being different from the first dielectric material.

Abstract: An optical device includes a first waveguide, ring-shaped waveguides adjacent to the first waveguide, and heaters coupled to the ring-shaped waveguides in one-to-one correspondence. A method includes coupling a first light source with a first wavelength to the first waveguide, increasing electric current through the heaters until a first one of the ring-shaped waveguides resonates, assigning the first one of the ring-shaped waveguides to the first wavelength, resetting the electric current through the heaters to the initial electric current, coupling a second light source with a second wavelength to the first waveguide wherein the second wavelength is different from the first wavelength, increasing the electric current through the heaters until a second one of the ring-shaped waveguides resonates wherein the second one of the ring-shaped waveguides is different from the first one of the ring-shaped waveguides, and assigning the second one of the ring-shaped waveguides to the second wavelength.

Abstract: A harmonic deceleration module, a dynamic power device, an automatic mobile vehicle, a transfer apparatus, a dynamic power supply system, and an electric bicycle are provided. The harmonic deceleration module includes a connecting member, a flexible bearing, a first frame, a first circular spline, a second frame, and a second circular spline. When the connecting member is driven, the connecting member rotates around a central axis. The connecting member has a cam part, and the cam part and the flexible bearing jointly form a wave generator. The wave generator is configured to be driven by the connecting member to drive a flexspline to continually and flexibly deform, and the flexspline drives the second circular spline and the second frame connected to the second circular spline to rotate. The second frame has a hollow channel penetrating through the second frame along the central axis.

Abstract: A semiconductor device according to the present disclosure includes a stack of first channel members, a stack of second channel members disposed directly over the stack of first channel members, a bottom source/drain feature in contact with the stack of the first channel members, a separation layer disposed over the bottom source/drain feature, a top source/drain feature in contact with the stack of second channel members and disposed over the separation layer, and a frontside contact that extends through the top source/drain feature and the separation layer to be electrically coupled to the bottom source/drain feature.

Abstract: A portable electronic device and an operation method are provided. The portable electronic device includes a body, a screen, a camera, an image sensor and a main system. The image sensor continually captures a first image outside the body with a first resolution and a first power consumption. The camera is turned on in the first state of the portable electronic device by the main system to capture a second image outside the body with a second power consumption and a second resolution only when the face image information appeared for over two seconds on the screen is detected by the image sensor from the first image. The second resolution is higher than the first resolution, and the second power consumption is higher than the first power consumption.

Abstract: A semiconductor device includes a semiconductor layer. A gate structure is disposed over the semiconductor layer. A spacer is disposed on a sidewall of the gate structure. A height of the spacer is greater than a height of the gate structure. A liner is disposed on the gate structure and on the spacer. The spacer and the liner have different material compositions.

Abstract: An audio processing system and an audio processing method are provided. The audio processing method includes: capturing a first audio signal and transmitting the first audio signal to a first electronic device by a first terminal device; capturing a second audio signal and transmitting the second audio signal to the first electronic device by a second terminal device; performing signal processing on the first audio signal and the second audio signal to generate a first processed audio signal and transmitting the first processed audio signal to a selected device by the first electronic device, wherein the selected device is one of the first terminal device and the second terminal device; and transmitting the first processed audio signal to a remote system by the selected device.

Abstract: A FinFET is provided including a channel region containing a constituent element and excess atoms, the constituent element belonging to a group of the periodic table of elements, wherein said excess atoms are nitrogen, or belong to said group of the periodic table of elements, and a concentration of said excess atoms in the channel region is in the range between about 1019 cm?3 and about 1020 cm?3.

Abstract: A packet identification system and a packet identification method are provided. The packet identification system receives a target packet, and includes a first packet header analyzer, a host, and a second packet header analyzer. The first packet header analyzer is configured to preset a plurality of first packet header formats, and identifies whether or not the target packet is one of a plurality of first packet types according to the first packet header formats. The host is configured to dynamically set at least one second packet header format. The second packet header analyzer is communicatively connected to the host. The second packet header analyzer is configured to store the at least one second packet header format, and identifies whether or not the target packet is at least one second packet type according to the at least one second packet header format.

Abstract: Various embodiments of the present disclosure are directed towards an optical module comprising an optical modulator device (OMD) for pulse amplitude modulation (PAM) in which the OMD comprises multiple modulator segments. A first modulator segment and a second modulator segment are spaced from each other along a ring-shaped waveguide. Further, a length of the second modulator segment is twice a length of the first modulator segment. As such, a power factor of the second modulator segment is twice a power factor of the first modulator segment. During use of the OMD, the first and second modulator segments are driven by separate non-return-to-zero (NRZ) electrical signals. The NRZ electrical signals are generated by a driver, which generates the NRZ electrical signals so as to coordinate operation of the first and second modulator segments to generate a PAM optical signal.

Abstract: A semiconductor device and a method of fabricating the semiconductor device are disclosed. The method includes forming a polysilicon structure on a substrate, depositing a first spacer layer on the polysilicon structure, depositing a second spacer layer on the first spacer layer, forming a S/D region on the substrate, removing the second spacer layer, depositing a third spacer layer on the first spacer layer and on the S/D region, depositing an ESL on the third spacer layer, depositing an ILD layer on the etch stop layer, and replacing the polysilicon structure with a gate structure surrounding the nanostructured layer.

Abstract: A semiconductor package is provided. The semiconductor package includes a semiconductor die, a stack of polymer layers, redistribution elements and a passive filter. The polymer layers cover a front surface of the semiconductor die. The redistribution elements and the passive filter are disposed in the stack of polymer layers. The passive filter includes a ground plane and conductive patches. The ground plane is overlapped with the conductive patches, and the conductive patches are laterally separated from one another. The ground plane is electrically coupled to a reference voltage. The conductive patches are electrically connected to the ground plane, electrically floated, or electrically coupled to a direct current (DC) voltage.

Abstract: Systems, devices, and methods related to a deep learning accelerator and memory are described. For example, a removable media (e.g., a memory card, or a USB drive) may be configured to execute instructions with matrix operands and configured with: an interface to receive a video stream; and random access memory to buffer a portion of the video stream as an input to an artificial neural network and to store instructions executable by the deep learning accelerator and matrices of the artificial neural network. Such a removable media can be used to replace an existing removable media used in a surveillance camera to record video or images. The deep learning accelerator can execute the instructions to generate analytics of the buffer portion using the artificial neural network, enabling the surveillance camera that is upgraded via the use of the removable media to provide intelligent services based on the analytics.

Abstract: A color adjustment device applied to a display panel includes a first controller and a second controller. The first controller is configured to control light emission of the display panel. The second controller is connected to the first controller, and is configured to receive an input image, and determine whether a blue component proportion of the input image is greater than a preset proportion and whether luminance of the display panel is lower than a luminance threshold value, wherein at least one pulse signal is transmitted from the second controller to the first controller through a first signal line when the blue component proportion is greater than the preset proportion and the luminance of the display panel is lower than the luminance threshold value.

Abstract: The invention provides an easy lock connector with unlock structure applied to a flat wire and a circuit board. The flat wire has a notch and a ground wire on the two sides of a head end respectively. The easy-lock connector includes an upper housing, a lower housing, a rubber core and a terminal. After the notch of the flat wire is buckled by a stopper of the lower housing, by pressing a pressing member of the upper housing, the pressing member applies an external force to an elastic member of the lower housing to deform the elastic member. An extension arm of the lower housing is linked by the elastic member to cause the stopper to act in one direction so as to release the state of the stopper from locking the gap. In another embodiment, the easy-lock connector can also achieve an electromagnetic shielding effect by adding a shielding iron shell.