Abstract: A method of testing a three dimensional (3D) memory cell array includes writing data to each layer of memory cells in the 3D memory cell array, simultaneously performing a read operation of each memory cell in at least a first pillar of the 3D memory cell array, determining whether a memory cell in the 3D memory cell array has failed in response to the read operation, and replacing at least one failed memory cell in the 3D memory cell array with a spare memory cell in response to determining that the memory cell in the 3D memory cell array has failed. The first pillar includes memory cells on each corresponding layer of the 3D memory cell array.

Abstract: Memory devices and methods of forming the same are provided. A memory device includes a substrate, a first conductive layer, a phase change layer, a selector layer and a second conductive layer. The first conductive layer is disposed over the substrate. The phase change layer is disposed over the first conductive layer. The selector layer is disposed between the phase change layer and the first conductive layer. The second conductive layer is disposed over the phase change layer. In some embodiments, at least one of the phase change layer and the selector layer has a narrow-middle profile.

Abstract: A memory device and a programming method of the memory device are provided. The memory device includes a bottom electrode, a heater, a phase change layer and a top electrode. The heater is disposed on the bottom electrode, and includes heat conducting materials different from one another in terms of electrical resistivity. A first one of the heat conducting materials has a periphery wall portion and a bottom plate portion connected to and surrounded by the periphery wall portion. A second one of the heat conducting materials is disposed on the bottom plate portion of the first one of the heat conducting materials, and laterally surrounded by the periphery wall portion of the first one of the heat conducting materials. The phase change layer is disposed on the heater and in contact with the heat conducting materials. The top electrode is disposed on the phase change layer.

Abstract: A ReRAM device is provided. The ReRAM device comprises a bottom electrode, a resistance switching layer disposed on the bottom electrode, a top electrode disposed on the resistance switching layer, a metal layer disposed on the top electrode, and a blocking layer covering the metal layer, wherein the blocking layer surrounds the metal layer and the top electrode.

Abstract: A ReRAM device is provided. The ReRAM device comprises a bottom electrode, a resistance switching layer disposed on the bottom electrode, a top electrode disposed on the resistance switching layer, a metal layer disposed on the top electrode, and a blocking layer covering the metal layer, wherein the blocking layer surrounds the metal layer and the top electrode.

Abstract: A memory operating method and a memory operating device are provided. The memory operating method includes the following steps. A first stepping loop is performed. A second stepping loop is performed. In the first stepping loop, a first control voltage applied to a first control line is increased from a first initial value to a first final value which is larger than the first initial value, and a second control voltage applied to a second control line is fixed at a second initial value. In the second stepping loop, the first control voltage applied to the first control line is fixed at a fixing value, and the second control voltage applied to the second control line is increased from an intermediate value to a second final value which is larger than the second initial value.

Abstract: A semiconductor structure includes a memory structure. The memory structure includes a memory element, a first barrier layer and a second barrier layer. The memory element includes titanium oxynitride. The first barrier layer includes at least one of silicon and silicon oxide. The first barrier layer is disposed on the memory element. The second barrier layer includes at least one of titanium and titanium oxide. The second barrier layer is disposed on the first barrier layer.

Abstract: A memory device and an operating method for a resistive memory cell are provided. The memory device includes the resistive memory cell. The resistive memory cell includes a first electrode, a second electrode and a memory film between the first electrode and the second electrode. The first electrode includes a bottom electrode portion and a sidewall electrode portion extending upwardly from the bottom electrode portion and between the memory film and the bottom electrode portion. A width of the sidewall electrode portion and a width of the memory film are smaller than a width of the bottom electrode portion.

Abstract: A memory device and an operating method for a resistive memory cell are provided. The memory device includes the resistive memory cell. The resistive memory cell includes a first electrode, a second electrode and a memory film between the first electrode and the second electrode. The first electrode includes a bottom electrode portion and a sidewall electrode portion extending upwardly from the bottom electrode portion and between the memory film and the bottom electrode portion. A width of the sidewall electrode portion and a width of the memory film are smaller than a width of the bottom electrode portion.

Abstract: An operating method, an operating system and a resistance random access memory (ReRAM) are provided. The operating method includes the following steps. A write voltage and a write current are set at a first predetermined voltage value and a first predetermined current value respectively. The write voltage and the write current are applied to a memory cell of the ReRAM for writing. Whether the write current reaches a second predetermined current value is verified, if a read current of the memory cell is not within a predetermined current range. The write current is increased, if the write current does not reach the second predetermined current value. Whether the write voltage reaches a second predetermined voltage value is verified, if the write current reaches the second predetermined current value. The write voltage is increased, if the write voltage does not reach the second predetermined voltage value.

Abstract: A memory operating method comprises the following steps: a first read voltage is applied to the memory cell to read a first group of data levels of the memory cell; and if the data of the memory cell can not be read with the first read voltage, a second read voltage is applied to the memory cell to read a second group of data levels of the memory cell.

Abstract: A first memory cell including a phase change material. The first memory cell is programmable to store one data value of a plurality of data values. The plurality of data values are represented by a plurality of non-overlapping ranges of resistance of the first memory cell. At least one testing pulse is applied to the first memory cell to establish a cell resistance of the first memory cell in an intermediate range of resistance, the intermediate range of resistance in between first and second adjacent ranges in the plurality of non-overlapping ranges of resistance representing the plurality of data values. After applying the at least one testing pulse to the first memory cell, it is determined whether to apply at least one healing pulse to repair the first memory cell, depending on relative values of (i) the cell resistance in the intermediate range of resistance and (ii) a reference resistance in the intermediate range of resistance.

Abstract: A memory device having an array area and a periphery area is provided. The memory device includes a substrate, an isolation layer formed in the substrate, a first doped region formed on the isolation layer in the array area, a second doped region formed on the first doped region, a metal silicide layer formed on the second doped region, and a metal silicide oxide layer formed on the metal silicide layer.

Abstract: A memory circuit is described that includes an array of memory cells including a plurality of blocks. The circuit includes a controller including logic to execute program sequences for selected blocks in the plurality of blocks. The program sequences include patterns of program/verify cycles. The circuit includes logic to assign different patterns of program/verify cycles to different blocks in the plurality of blocks. The circuit includes logic to change a particular pattern assigned to a particular block in the plurality of blocks. The circuit includes logic to maintain statistics for blocks in the plurality of blocks, about performance of cells in the blocks in response to the patterns of program/verify cycles assigned to the blocks. The controller includes logic to apply a stress sequence to one of the selected blocks, the stress sequence including stress pulses applied to memory cells in the one of the selected blocks.

Abstract: A method is provided for operating a memory device including an array of memory cells including programmable resistive memory elements. Memory cells in the array are programmed to store data by applying program pulses to the memory cells to establish resistance levels within a number N of specified ranges of resistance, where each of the specified ranges corresponds to a particular data value. A drift recovery process is executed to the memory cells, including applying a recovery pulse having a pulse shape to a set of programmed memory cells, where memory cells in the set have resistance levels within two or more of the specified resistance ranges.

Abstract: A memory device having an array area and a periphery area is provided. The memory device includes a substrate, an isolation layer formed in the substrate, a first doped region formed on the isolation layer in the array area, a second doped region formed on the first doped region, a metal silicide layer formed on the second doped region, and a metal silicide oxide layer formed on the metal silicide layer.

Abstract: An operating method, an operating system and a resistance random access memory (ReRAM) are provided. The operating method includes the following steps. A write voltage and a write current are set at a first predetermined voltage value and a first predetermined current value respectively. The write voltage and the write current are applied to a memory cell of the ReRAM for writing. Whether the write current reaches a second predetermined current value is verified, if a read current of the memory cell is not within a predetermined current range. The write current is increased, if the write current does not reach the second predetermined current value. Whether the write voltage reaches a second predetermined voltage value is verified, if the write current reaches the second predetermined current value. The write voltage is increased, if the write voltage does not reach the second predetermined voltage value.

Abstract: A method for programming a memory device comprises the following steps: performing an interleaving programming, including: programming a first memory cell during a first time interval and correspondingly verifying the first memory cell during a second time interval; programming a second memory cell during a third time interval and correspondingly verifying the second memory cell during a fourth time interval between the first and second time intervals; and inserting at least one dummy cycle between the first and second time intervals to ensure that a resistance change per unit of time of the first memory cell is less than a threshold.

Abstract: A method for programming a memory device comprises the following steps: performing an interleaving programming, including: programming a first memory cell during a first time interval and correspondingly verifying the first memory cell during a second time interval; programming a second memory cell during a third time interval and correspondingly verifying the second memory cell during a fourth time interval between the first and second time intervals; and inserting at least one dummy cycle between the first and second time intervals to ensure that a resistance change per unit of time of the first memory cell is less than a threshold.

Abstract: A writing method and a reading method of a phase change memory (PCM) are provided. The PCM has a plurality of memory cells. The writing method comprises the following steps. At least one stress pulse is applied for aging at least one of the memory cells. A starting pulse is applied to all of the memory cells of the PCM for increasing a resistance of each of the memory cells. A detection pulse is applied to all of the memory cells of the PCM for decreasing the resistance of each of the memory cells and detecting the resistance changing speed of each of the memory cells. A set pulse is applied to the aged memory cells. A reset pulse is applied to the non-aged memory cells.