Abstract: The subject disclosure relates to a reinforcement cage, a jig and a method for making the reinforcement cage. The reinforcement cage includes a plurality of reinforcement units, which are arranged along a first direction, and a plurality of main bars. Each reinforcement unit includes a first stirrup, which is substantially rectangular, at least one second stirrup and at least one third stirrup. The first stirrup includes a first side, a second side, a third side and a fourth side. The first side and the third side are opposite to each other, and the second side and the fourth side are opposite to each other. The at least one second stirrup is connected to the first side and the third side of the first stirrup. The at least one third stirrup is connected to the second side and the fourth side of the first stirrup and substantially perpendicular to and fixed to the at least one second stirrup.

Abstract: Responsive to a request to access heterogeneous repositories, a REST server queries a resource registry to find resources that match mapping information contained in the request. The resource registry returns resource registry tables containing the matching resources. The resource registry tables implement a unified data structure of a resource registry model and are generated at runtime by the resource registry mapping REST service configuration parameters to the fields of the unified data structure. The REST service configuration parameters are added to an extension SDK for REST extension developers to enhance REST service configuration for extension applications. The REST service configuration parameters are configured at implementation time and loaded/scanned into the REST server at runtime. The REST server iteratively evaluates the resource registry tables until all the matching resources have been evaluated.

Abstract: A method of using a polishing pad includes applying a slurry to a first location on the polishing pad. The method further includes rotating the polishing pad. The method further includes spreading the slurry across a first region of the polishing pad at a first rate, wherein the first region includes a plurality of first grooves. The method further includes spreading the slurry across a second region, surrounding the first region of the polishing pad at a second rate different from the first rate, wherein the second region includes a plurality of second grooves. The method further includes spreading the slurry across a third region, surrounding the second region of the polishing pad at a third rate less than the first rate and the second rate, wherein the third region includes a plurality of third grooves.

Abstract: The disclosure relates to the technical field of computers, in particular to information display method and device, terminal and storage medium. The method provided by the embodiments of the disclosure comprises: acquiring a new target message associated with a user account currently logged in a client; displaying a first reminder view associated with a first new target message; displaying a message user interface containing the first new target message in response to an operation of triggering the first reminder view; and associating the first reminder view with a second new target message after the first reminder view is triggered.

Abstract: A semiconductor device and method of manufacture are provided. In embodiments a memory array is formed by manufacturing portions of a word line during different and separate processes, thereby allowing the portions formed first to act as a structural support during later processes that would otherwise cause undesired damage to the structures.

Abstract: Methods, apparatuses, and systems related to a sense line and cell contact for a semiconductor structure are described. An example apparatus includes a first source/drain region and a second source/drain region, where the first source/drain region and the second source/drain region are separated by a channel, a gate opposing the channel, a sense line material coupled to the first source/drain region by a cell contact, where the cell contact is made from a combination of a first polysilicon material and a second polysilicon material, and a storage node coupled to the second source/drain region.

Abstract: In a method for storing index metadata associated with stored data, a storage device provides a first metadata storage unit and a second metadata storage unit, wherein a size of the first metadata storage unit is greater than a size of the second metadata storage unit. When a size of target data reaches a specified threshold, the storage device stores index metadata of the target data based on the first metadata storage unit. When the size of the target data is less than the specified threshold, the storage device stores the index metadata of the target data based on the second metadata storage unit.

Abstract: A gated ferroelectric memory cell includes a dielectric material layer disposed over a substrate, a metallic bottom electrode, a ferroelectric dielectric layer contacting a top surface of the bottom electrode, a pillar semiconductor channel overlying the ferroelectric dielectric layer and capacitively coupled to the metallic bottom electrode through the ferroelectric dielectric layer, a gate dielectric layer including a horizontal gate dielectric portion overlying the ferroelectric dielectric layer and a tubular gate dielectric portion laterally surrounding the pillar semiconductor channel, a gate electrode strip overlying the horizontal gate dielectric portion and laterally surrounding the tubular gate dielectric portion and a metallic top electrode contacting a top surface of the pillar semiconductor channel.

Abstract: An image recognition method includes the steps of: receiving a captured image; acquiring a focusing zone image from a portion of the captured image; processing the captured image and/or the focusing zone image and then making the two images into a batch of image information; and executing an image analysis procedure on the batch of image information to generate an analysis result.

Abstract: The present disclosure, in some embodiments, relates to a memory device. In some embodiments, the memory device has a substrate and a lower interconnect metal line disposed over the substrate. The memory device also has a selector channel disposed over the lower interconnect metal line and a selector gate electrode wrapping around a sidewall of the selector channel and separating from the selector channel by a selector gate dielectric. The memory device also has a memory cell disposed over and electrically connected to the selector channel and an upper interconnect metal line disposed over the memory cell. By placing the selector within the back-end interconnect structure, front-end space is saved, and more integration flexibility is provided.

Abstract: This disclosure describes systems. methods. and devices related to deep learning-based video processing. A system may include a first neural network associated with generating kernel weights for the DL VP. the first neural network using a first hardware device: and a second neural network associated with filtering image pixels for the DLVP. the second neural network using a second hardware device, wherein the first neural network receives image data and generates the kernel weights based on the image data, and wherein the second neural network receives the image data and the kernel weights. and generates filtered image data based on the image data and the kernel weights.

Abstract: Systems and methods disclosed herein are related to a memory system. In one aspect, the memory system includes a first set of memory cells including a first string of memory cells and a second string of memory cells; and a first switch including: a first electrode connected to first electrodes of the first string of memory cells and first electrodes of the second string of memory cells, and a second electrode connected to a first global bit line, wherein gate electrodes of the first string of memory cells are connected to a first word line and gate electrodes of the second string of memory cells are connected to a second word line.

Abstract: A memory array device includes a stack of transistors over a semiconductor substrate, a first transistor of the stack being disposed over a second transistor of the stack. The first transistor includes a first memory film along a first word line and a first channel region along a source line and a bit line, the first memory film being disposed between the first channel region and the first word line. The second transistor includes a second memory film along a second word line and a second channel region along the source line and the bit line, the second memory film being disposed between the second channel region and the second word line. The memory array device includes a first via electrically connected to the first word line and a second via electrically connected to the second word line, the second staircase via and the first staircase via having different widths.

Abstract: A memory device includes a first stacking structure, a second stacking structure, a plurality of first isolation structures, gate dielectric layers, channel layers and channel layers. The first stacking structure includes a plurality of first gate layers, and a second stacking structure includes a plurality of second gate layers, where the first stacking structure and the second stacking structure are located on a substrate and separated from each other through a trench. The first isolation structures are located in the trench, where a plurality of cell regions are respectively confined between two adjacent first isolation structures of the first isolation structures in the trench, where the first isolation structures each includes a first main layer and a first liner surrounding the first main layer, where the first liner separates the first main layer from the first stacking structure and the second stacking structure.

Abstract: A method of forming a ferroelectric random access memory (FeRAM) device includes: forming a first layer stack and a second layer stack successively over a substrate, where the first layer stack and the second layer stack have a same layered structure that includes a layer of a first electrically conductive material over a layer of a first dielectric material, where the first layer stack extends beyond lateral extents of the second layer stack; forming a trench that extends through the first layer stack and the second layer stack; lining sidewalls and a bottom of the trench with a ferroelectric material; conformally forming a channel material in the trench over the ferroelectric material; filling the trench with a second dielectric material; forming a first opening and a second opening in the second dielectric material; and filling the first opening and the second opening with a second electrically conductive material.

Abstract: An embodiment of the present disclosure discloses a memory device. The memory device comprises a memory controller, a buffer and a memory array. The buffer is coupled to the memory controller or embedded in the memory controller. A storage space of the buffer is configured by the memory controller to include a plurality of groups. The memory array is coupled to the memory controller, and comprising a plurality of tiles. The groups are one-to-one corresponding to the tiles. Each of the groups is configured to store data to be written into the corresponding tile. The memory controller performs one or more write operations based on the groups.

Abstract: A device includes a semiconductor substrate; a word line extending over the semiconductor substrate; a memory film extending along the word line, wherein the memory film contacts the word line; a channel layer extending along the memory film, wherein the memory film is between the channel layer and the word line; source lines extending along the memory film, wherein the memory film is between the source lines and the word line; bit lines extending along the memory film, wherein the memory film is between the bit lines and the word line; and isolation regions, wherein each isolation region is between a source line and a bit line, wherein each of the isolation regions includes an air gap and a seal extending over the air gap.

Abstract: The present disclosure relates to hMPV F, PIV3 F and PIV1 F protein mutants, nucleic acids or vectors encoding a hMPV F, PIV3 F and PIV1 F protein mutant, compositions comprising a hMPV F, PIV3 F and PIV1 F protein mutant or nucleic acid, and uses of the hMPV F, PIV3 F and PIV1 F protein mutants, nucleic acids or vectors, and compositions.

Abstract: An in-memory computing method and apparatus, adapted for a processor to perform MAC operations on a memory, are provided. In the method, a format of binary data of weights is transformed from a floating-point format into a quantized format by truncating at least a portion of fraction bits of the binary data and calculating complements of remaining bits, and programming the transformed binary data into cells of the memory. A tuning procedure is performed by iteratively inputting binary data of input signals into the memory, integrating outputs of the memory, and adjusting the weights programmed to the cells based on the integrated outputs. The binary data of the weights is reshaped based on a probability of reducing bits with a value of one in the binary data of each weight. The tuning procedure is repeated until an end condition is met.

Abstract: A memory device includes a first stacking structure, a second stacking structure, a plurality of first isolation structures, gate dielectric layers, channel layers and conductive pillars. The first stacking structure includes a plurality of first gate layers, and a second stacking structure includes a plurality of second gate layers, where the first stacking structure and the second stacking structure are located on a substrate and separated from each other through a trench. The first isolation structures are located in the trench, where a plurality of cell regions are respectively confined between two adjacent first isolation structures of the first isolation structures in the trench, where the first isolation structures each includes a first main layer and a first liner surrounding the first main layer, where the first liner separates the first main layer from the first stacking structure and the second stacking structure.