Patents by Inventor Cheng Han

Cheng Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12277289
    Abstract: The present invention relates to a touch module and a touch screen. The touch module includes a touch panel located on the display module, a main circuit board located outside the casing of the touch screen, a plurality of signal cables connecting the touch panel and the main circuit board, and an equal potential wiring. By setting an equal potential wiring in the touch module to electrically bridge any two signal cables, a short circuit is formed between the shielding layers of the signal cables so that the potentials of different signal cables can be equalized to make the signal cables roughly the same degree of electrostatic or electromagnetic interference from the environment. By making the signals obtained by the signal cables be disturbed to approximately the same degree, the touch module can accurately determine the touch position.
    Type: Grant
    Filed: June 16, 2023
    Date of Patent: April 15, 2025
    Assignee: EGALAX_EMPIA TECHNOLOGY INC.
    Inventors: Chin-Fu Chang, Shang-Tai Yeh, Cheng-Han Lee
  • Publication number: 20250115590
    Abstract: Hydantoin based compounds useful as inhibitors of matrix metalloproteinases (MMPs), particularly macrophage elastase (MMP-12) are described. Also described are related compositions and methods of using the compounds to inhibit MMP-12 and treat diseases mediated by MMP-12, such as asthma, chronic obstructive pulmonary disease (COPD), emphysema, acute lung injury, idiopathic pulmonary fibrosis (IPF), sarcoidosis, systemic sclerosis, liver fibrosis, nonalcoholic steatohepatitis (NASH), arthritis, cancer, heart disease, inflammatory bowel disease (IBD), acute kidney injury (AKI), chronic kidney disease (CKD), Alport syndrome, and nephritis.
    Type: Application
    Filed: December 17, 2024
    Publication date: April 10, 2025
    Inventors: Wenjin Yang, Kai-Wei CHANG, Suying LIU, Cheng-Han TSAI
  • Publication number: 20250119060
    Abstract: A circuit is disclosed. The circuit includes a first pump circuit configured to receive a first reference voltage and provide an output voltage at a first level based on the first reference voltage. The circuit includes a second pump circuit configured to receive a second reference voltage and provide the output voltage at a second level based on the second reference voltage. The first reference voltage is lower than the second reference voltage, and the first level is lower than the second level.
    Type: Application
    Filed: October 10, 2023
    Publication date: April 10, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng Han Lu, Chia-Fu Lee, Yen-An Chang
  • Patent number: 12267986
    Abstract: The present disclosure provides a cooling device, including a cooling plate and a mounting cover. A lower flow channel is provided in the cooling plate, a top of the cooling plate is provided with a water outlet and two openings. The water outlet is located between the two openings. The mounting cover is sealed on the top of the cooling plate. The mounting cover comprises a first mounting cover and a second mounting cover. The first mounting cover and the cooling plate form an intermediate flow channel, the second mounting cover and the cooling plate form a branch flow channel. The intermediate flow channel is in communication with the two branch flow channels, The first mounting cover is provided with a water inlet, and the two branch flow channels are in communication with the lower flow channel through the two openings.
    Type: Grant
    Filed: March 20, 2023
    Date of Patent: April 1, 2025
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Jiang-Jun Wu, Yi-Dong Ji, Cheng Han
  • Patent number: 12264071
    Abstract: A carbon-based material post-modification reactor includes: a feeding port located upstream from the carbon-based material post-modification reactor and adapted to feed a carbon-based raw material into the reactor; a discharging port located downstream from the carbon-based material post-modification reactor and adapted to output a modified carbon-based material; and a screw conveying device disposed in the reactor to simultaneously convey and turn over the carbon-based raw material in the reactor, between the feeding port and the discharging port; and an intake device for inputting ozone gas to the interior of the carbon-based material post-modification reactor. The screw conveying device includes a shaft portion, reverse inner spiral blade group and forward outer spiral blade group.
    Type: Grant
    Filed: April 28, 2022
    Date of Patent: April 1, 2025
    Assignee: Linyuan Advanced Materials Technology Co., Ltd.
    Inventors: Jheng-Guang Li, Cheng-Han Hsieh, Te-Wang Ku
  • Publication number: 20250105928
    Abstract: A system for radio frequency (RF) residual sideband (RSB) calibration includes a complex (in phase/quadrature (I/Q)) signal receiver, a signal generator configured to generate a transmit (Tx) signal, a first phase shifter operably coupled to the real signal transmitter, a first signal combiner configured to combine a receive (Rx) signal with the transmit (Tx) signal to generate a first combined signal, a second phase shifter configured to provide a selected phase shift to the first combined signal, and a complex downconverter configured to generate an in phase Rx signal and a quadrature Rx signal alternatively using an in phase LO signal and a quadrature LO signal to generate one or more signals indicative of relative Tx-Rx LO phase (?), amplitude (A), Tx LO I/Q phase mismatch (?), Rx I/Q amplitude mismatch (?), and Rx I/Q phase mismatch (?) at the output of the complex receiver.
    Type: Application
    Filed: September 21, 2023
    Publication date: March 27, 2025
    Inventors: Cheng-Han WANG, Varun Amar REDDY, Qi ZHOU, Hsin-Hsu CHEN, Liang ZHAO, Koorosh AKHAVAN, Yi ZENG, Chan Hong PARK, Le Nguyen LUONG
  • Patent number: 12258335
    Abstract: Hydantoin based compounds useful as inhibitors of matrix metalloproteinases (MMPs), particularly macrophage elastase (MMP-12) are described. Also described are related compositions and methods of using the compounds to inhibit MMP-12 and treat diseases mediated by MMP-12, such as asthma, chronic obstructive pulmonary disease (COPD), emphysema, acute lung injury, idiopathic pulmonary fibrosis (IPF), sarcoidosis, systemic sclerosis, liver fibrosis, nonalcoholic steatohepatitis (NASH), arthritis, cancer, heart disease, inflammatory bowel disease (IBD), acute kidney injury (AKI), chronic kidney disease (CKD), Alport syndrome, and nephritis.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: March 25, 2025
    Assignee: Foresee Pharmaceuticals USA, Inc.
    Inventors: Wenjin Yang, Kai-Wei Chang, Suying Liu, Cheng-Han Tsai
  • Publication number: 20250096842
    Abstract: An apparatus, including: a clock source configured to generate a local oscillator (LO) clock signal; a radio frequency digital-to-analog converter (RF DAC) configured to generate a radio frequency (RF) signal based on a data signal and the LO clock signal; and an idle data detector configured to: detect a stream of idle data in the data signal; and disable providing the LO clock signal to at least a portion of the RF DAC in response to detecting the stream of idle data.
    Type: Application
    Filed: September 19, 2023
    Publication date: March 20, 2025
    Inventors: Mu LU, Yi ZENG, Cheng-Han WANG, Ming-Tuo CHIN, Chan Hong PARK, Emanuele LOPELLI
  • Patent number: 12255091
    Abstract: Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.
    Type: Grant
    Filed: November 21, 2023
    Date of Patent: March 18, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsai-Hao Hung, Ping-Cheng Ko, Tzu-Yang Lin, Fang-Yu Liu, Cheng-Han Wu
  • Patent number: 12249650
    Abstract: A semiconductor device includes a substrate; a fin protruding above the substrate, the fin including a compound semiconductor material that includes a semiconductor material and a first dopant, the first dopant having a different lattice constant than the semiconductor material, where a concentration of the first dopant in the fin changes along a first direction from an upper surface of the fin toward the substrate; a gate structure over the fin; a channel region in the fin and directly under the gate structure; and source/drain regions on opposing sides of the gate structure, the source/drain regions including a second dopant, where a concentration of the second dopant at a first location within the channel region is higher than that at a second location within the channel region, where the concentration of the first dopant at the first location is lower than that at the second location.
    Type: Grant
    Filed: March 17, 2023
    Date of Patent: March 11, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shahaji B. More, Cheng-Han Lee, Shih-Chieh Chang
  • Patent number: 12249649
    Abstract: A semiconductor device includes a fin-shaped structure on the substrate, a shallow trench isolation (STI) around the fin-shaped structure, a single diffusion break (SDB) structure in the fin-shaped structure for dividing the fin-shaped structure into a first portion and a second portion; a first gate structure on the fin-shaped structure, a second gate structure on the STI, and a third gate structure on the SDB structure. Preferably, a width of the third gate structure is greater than a width of the second gate structure and each of the first gate structure, the second gate structure, and the third gate structure includes a U-shaped high-k dielectric layer, a U-shaped work function metal layer, and a low-resistance metal layer.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: March 11, 2025
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Cheng-Han Wu, Hsin-Yu Chen, Chun-Hao Lin, Shou-Wei Hsieh, Chih-Ming Su, Yi-Ren Chen, Yuan-Ting Chuang
  • Publication number: 20250076934
    Abstract: A laptop computer including a system host, a modular platform, a rail structure, and at least one tool is provided. The rail structure is disposed at the system host and the modular platform, and the modular platform slides relative to the system host via the rail structure to be assembled to or detached from the system host. The tool is plugged into or out of the system host, and the tool is located on a sliding path of the modular platform when the tool is assembled to the system host.
    Type: Application
    Filed: January 31, 2024
    Publication date: March 6, 2025
    Applicant: Acer Incorporated
    Inventors: Hung-Chi Chen, Cheng-Han Lin, Huei-Ting Chuang, Po-Yi Lee, Yen-Chieh Chiu, Chao-Di Shen
  • Publication number: 20250076369
    Abstract: A minimum IC operating voltage searching method includes acquiring a corner type of an IC, acquiring ring oscillator data of the IC, generating a first prediction voltage according to the corner type and the ring oscillator data by using a training model, generating a second prediction voltage according to the ring oscillator data by using a non-linear regression approach under an N-ordered polynomial, and generating a predicted minimum IC operating voltage according to the first prediction voltage and the second prediction voltage. N is a positive integer.
    Type: Application
    Filed: April 16, 2024
    Publication date: March 6, 2025
    Applicant: MEDIATEK INC.
    Inventors: Ronald Kuo-Hua Ho, Kun-Yu Wang, Yen-Chang Shih, Sung-Te Chen, Cheng-Han Wu, Yi-Ying Liao, Chun-Ming Huang, Yen-Feng Lu, Ching-Yu Tsai, Tai-Lai Tung, Kuan-Fu Lin, Bo-Kang Lai, Yao-Syuan Lee, Tsyr-Rou Lin, Ming-Chao Tsai, Li-Hsuan Chiu
  • Publication number: 20250080077
    Abstract: An apparatus including: a transmitter output impedance matching circuit including an inductive element; a low noise amplifier (LNA) including a first field effect transistor (PET); a receiver input impedance matching circuit, including: a transformer including a first winding and a second winding; and a capacitor coupled in series with the first winding between a first end of the inductive element and a gate of the first FET, wherein the second winding is coupled to a second end of the inductive element; and a radio frequency (RF) port coupled between the first end of the inductive element and the capacitor.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 6, 2025
    Inventors: Cheng-Han WANG, Takahide NISHIO, Tu-I TSAI, Mu LU, Chan Hong PARK
  • Publication number: 20250079270
    Abstract: A power management integrated circuit (PMIC) soldered onto a printed circuit board, includes: a first output stage circuit and a second output stage circuit. In a separate power supply configuration, first and second current inflow pins of the first and second output stage circuits are soldered to first and second current inflow printed lines, respectively, wherein the first and second current inflow printed lines are not directly electrically connected to each other; and, first and second current outflow pins of the first and second output stage circuits are soldered to first and second current outflow printed lines respectively, wherein the first and second current outflow printed lines are not directly electrically connected to each other. In a cooperation power supply configuration, the first and second current inflow pins are both soldered to a common current inflow printed line of the PCB, to be electrically connected with each other.
    Type: Application
    Filed: January 11, 2024
    Publication date: March 6, 2025
    Inventors: Cheng-Han Lin, Chan-Chuan Li, Bo-Zhou Ke, Chun-Yao Huang, Cheng-Hao Tseng
  • Patent number: 12241618
    Abstract: Example embodiments described herein involve a system for testing a light-emitting module. The light-emitting module may include a mounting platform configured to hold a light-emitting module for a camera. The mounting platform may also be configured to rotate. The system may further include a housing holding a plurality of photodiodes arranged in an array over at least a 90 degree arc of a hemisphere. The system may also include a controller configured to control the photodiodes and the rotation of the mounting platform.
    Type: Grant
    Filed: January 16, 2024
    Date of Patent: March 4, 2025
    Assignee: Waymo LLC
    Inventors: Choon Ping Chng, Cheng-Han Wu, Lucian Ion, Giulia Guidi
  • Publication number: 20250065395
    Abstract: A mold moving device for a forged product forming machine includes a base unit, a transmission mechanism, a guiding member, a mold seat, and a plurality of pressing molds. The guiding member is driven by the transmission mechanism to rotate, and has an outer peripheral surface formed with a plurality of guiding grooves extending in a serpentine manner. The mold seat includes a rotary shaft, a rotating member, and a carrying member on which the pressing molds are mounted. The rotating member is connected to the rotary shaft, and includes a disk body portion and a plurality of projecting rods protruding toward the guiding member. When the guiding member rotates, the guiding grooves respectively engage selected ones of the projecting rods in a manner where the selected ones of the projecting rods respectively slide along the guiding grooves, thereby driving the disk body portion to rotate.
    Type: Application
    Filed: August 23, 2024
    Publication date: February 27, 2025
    Inventors: Hao-Hsu LIN, Cheng-Han HSU
  • Patent number: 12235998
    Abstract: A computing system includes a BIOS, a BMC coupled to the BIOS, and one or more hardware components. The BMC can receive commands from a user, and transition between a locked state and an unlocked state. When the BMC is in the unlocked state, the BMC responds to commands received from the user. When the BMC is in the locked state, the BMC ignores commands received from the user. The BMC is configured to receive an unlock command from a user that includes an unlock signature. The BMC is further configured to determine whether the unlock signature is authentic. If the unlock signature is authentic and the BMC is in the locked state, the BMC is configured to transition from the locked state to the unlocked state, to allow the user access to the hardware components of the computing system.
    Type: Grant
    Filed: July 28, 2022
    Date of Patent: February 25, 2025
    Assignee: QUANTA COMPUTER INC.
    Inventors: Cheng-Han Chen, Jyun-Jei Huang
  • Publication number: 20250062083
    Abstract: A key structure includes a base, an elastic member disposed on the base, a scissors structure movably disposed on the base, and a keycap module having a carrier and a light source. The carrier is detachably assembled to the scissors structure and abuts the elastic member. The light source is disposed in the carrier. The light source is electrically connected to a bottom portion of the base through a flexible circuit member penetrating the carrier, passing the scissors structure, and penetrating the base. A top portion of the carrier has light transmittance, so that light of the light source can pass through the top portion to be projected from the key structure.
    Type: Application
    Filed: January 22, 2024
    Publication date: February 20, 2025
    Applicant: Acer Incorporated
    Inventors: Hung-Chi Chen, Cheng-Han Lin, Huei-Ting Chuang, Shun-Bin Chen
  • Publication number: 20250050327
    Abstract: The invention relates to a processing device (1) for processing of liquid sample contained in a multiwell carrier (2), wherein the processing device comprises a housing (3) with a bottom part (4) and a lid part (5), wherein the bottom part and the lid part delimit an inner space of the housing, and a connection part (6) for fluidically connecting the processing device to a processing unit (7) wherein the connection part is fluidically connected to the inner space, wherein the housing has several hollow extension tubes (9a, 9b), which extend from the bottom part and which are fluidically connected to the inner space.
    Type: Application
    Filed: December 3, 2022
    Publication date: February 13, 2025
    Inventors: Cheng-Han TSAI, Da-Han KUAN