Abstract: A vision inspection and correction method, which mainly uses an image adjustment software/device to separate the eyes of the inspected person on an independent display screen, and the visual mark seen by the same vision is designed to be misaligned; through the guidance and interaction of the inspector and the inspected person, the inspector can adjust the image operation to zoom in/out/shift/focus/diverge/rotate, etc., so that the inspected person's binocular images can be clearly distinguished and adjusted.

Abstract: Provided is a testing method including: disposing a wafer on a working platform of a testing device; and moving a circuit board of the testing device relative to the working platform by a movement assembly of the testing device so as to allow at least two testing ports of the circuit board to test two chips of the wafer, respectively. Further, the two testing ports have different testing functions. Therefore, during the wafer testing process, a single testing device can perform multiple testing operations.

Abstract: Disclosed are methods, systems, and non-transitory computer-readable medium for analysis of images including wearable items. For example, a method may include obtaining a first set of images, each of the first set of images depicting a product; obtaining a first set of labels associated with the first set of images; training an image segmentation neural network based on the first set of images and the first set of labels; obtaining a second set of images, each of the second set of images depicting a known product; obtaining a second set of labels associated with the second set of images; training an image classification neural network based on the second set of images and the second set of labels; receiving a query image depicting a product that is not yet identified; and performing image segmentation of the query image and identifying the product in the image by performing image analysis.

Abstract: In one example, an electronic device housing may include a substrate, an insulating adhesive layer formed on a surface of the substrate, a patterned electroless plating layer formed on the insulating adhesive layer, and a patterned electrolytic plating layer formed on the patterned electroless plating layer.

Abstract: Examples of body panels with connectors are described herein. In an example, a body panel of a portable electronic device may include a connector affixed thereto, in an assembled state of the body panel on the portable electronic device, the connector may be positioned between a battery and a motherboard of the portable electronic device. The connector may electrically couple the battery with the motherboard, in the assembled state.

Abstract: The present invention provides an electronic device including a first antenna, a second antenna and a wireless communication chip. The wireless communication chip is configured to control the first antenna to broadcast a packet, control the second antenna to receive the packet broadcasted from the first antenna, and determine channel state information according to the packet received by the second antenna.

Abstract: A serial bidirectional communication method is provided. The method includes: performing a downlink transmission and performing an uplink transmission. The downlink transmission includes: receiving first downlink data through a first transmission terminal, wherein the first downlink data comprises at least one control command, and the at least one control command is cascaded and configured to control at least one electronic device; removing one, corresponding to a local device, of the at least one control command from the first downlink data to form second downlink data, wherein the local device is one of the at least one electronic device; and when there is a control command remaining in the second downlink, outputting the second downlink data through a second transmission terminal. The uplink transmission includes outputting first uplink data through the first transmission terminal. The first uplink data includes local information generated by the local device.

Abstract: A memory device includes a first electrode, a first support layer, a dielectric layer and a second electrode. The first electrode is disposed on a substrate and extending upwards. The first support layer laterally supports an upper portion of a sidewall of the first electrode, where the first support layer has a slim portion. The dielectric layer is disposed on the first electrode and the first support layer. The second electrode is disposed on the dielectric layer. In addition, a method of fabricating the memory device is provided.

Abstract: An apparatus can include a calibration circuit to determine a backlight status of a display device based on a detected difference in a noise level corresponding to the display device. The calibration circuit can perform an operation to calibrate a touchscreen coupleable to the display device based on the determined backlight status.

Abstract: A model construction system, apparatus, and method are provided. The model construction system includes at least one first source apparatus, at least one second source apparatus, and a model construction apparatus. The model construction apparatus receives a de-identification data set from each first source apparatus, receives a parameter set of a source model from each second source apparatus, generates at least one aligned data set by aligning the de-identification data set according to a predetermined data format, trains an original model to an assisted training model with the aligned data set(s), generates at least one updated parameter set according to the parameter set(s) and an assisted training parameter set, updates the assisted training model with one of the updated parameter set(s), and transmits the updated parameter set(s) to the second source apparatus(es). Each second source apparatus updates the source model according to the corresponding updated parameter set.

Abstract: A method for assessing driver fatigue is implemented by a processor and includes steps of: based on images of a driver captured by an image capturing device, obtaining an entry of physiological information that indicates a physiological state of the driver; based on one of the images of the driver, obtaining an entry of facial expression information that indicates an emotional state of the driver; based on one of the images of the driver, obtaining an entry of behavioral information that indicates driver behavior of the driver; and based on the entry of physiological information, the entry of facial expression information and the entry of behavioral information, obtaining a fatigue score that indicates a level of fatigue of the driver.

Abstract: A method of forming a semiconductor memory device, the semiconductor memory device includes a plurality of active areas, a shallow trench isolation, a plurality of trenches and a plurality of gates. The active areas are defined on a semiconductor substrate, and surrounded by the shallow trench isolation. The trenches are disposed in the semiconductor substrate, penetrating through the active areas and the shallow trench isolation, wherein each of the trenches includes a bottom surface and a saddle portion protruded therefrom in each active areas. The gates are disposed in the trenches respectively.

Abstract: A vaporizer comprises an absorber, a heating element, and a porous cover layer. The absorber is configured to absorb a material to be vaporized. The heating element is configured to heat and vaporize the material to be vaporized in the absorber, and includes a first electrode portion, a second electrode portion, and an electrically conductive connecting member connected between the first electrode portion and the second electrode portion. The porous cover layer covers at least a portion of the heating element without covering the first and second electrode portions. A ratio of an area of the porous cover layer to an area of the electrically conductive connecting member is defined as a covering ratio, which is at least 50%. A porosity of the porous cover layer ranges from 30% to 75%.

Abstract: The present invention provides an image compensation circuit generating output image data to drive a display panel having pixels. The image compensation circuit includes first/second control circuits and first/second compensation circuits. The first control circuit may receive input image data for the pixels and generate a plurality of first compensation values corresponding to compensation for voltage drop on the display panel according to the input image data. The first compensation circuit may compensate the input image data for the pixels with the first compensation values. The second control circuit may receive the first compensation values from the first control circuit and generate a plurality of second compensation values corresponding to compensation for channel length modulation (CLM) effect of the pixels according to the first compensation values.

Abstract: Disclosed are methods, systems, and non-transitory computer-readable medium for analysis of images including wearable items. For example, a method may include obtaining a first set of images, each of the first set of images depicting a product; obtaining a first set of labels associated with the first set of images; training an image segmentation neural network based on the first set of images and the first set of labels; obtaining a second set of images, each of the second set of images depicting a known product; obtaining a second set of labels associated with the second set of images; training an image classification neural network based on the second set of images and the second set of labels; receiving a query image depicting a product that is not yet identified; and performing image segmentation of the query image and identifying the product in the image by performing image analysis.

Abstract: An optical module and a method of manufacturing an optical module are provided. The optical module includes a carrier, an electronic component, a lid, a diffuser and a bonding layer. The electronic component is disposed on the carrier. The lid is disposed on the carrier. The lid has a first cavity to accommodate the electronic component. The lid defines a first aperture over the first cavity. The diffuser is disposed within the first aperture. The bonding layer is disposed between the diffuser and a sidewall of the first aperture.

Abstract: A drive device of an adjustable desk, which includes a drive shaft and a drive source. The drive shaft is detachably connected to an elevating device of the adjustable desk. The drive source is connected to the drive shaft and is configured to rotate the drive shaft to drive the elevating device, thereby allowing users to drive the adjustable desk manually or electrically.

Abstract: A semiconductor structure includes an active area in a substrate, a device isolation region surrounding the active area, first and second bit line structures on the substrate, a conductive diffusion region in the active area between the first and the second bit line structures, and a contact hole between the first and the second bit line structures. The contact hole partially exposes the conductive diffusion region. A buried plug layer is disposed in the contact hole and in direct contact with the conductive diffusion region. A storage node contact layer is disposed on the buried plug layer within the contact hole. The storage node contact layer has a downwardly protruding portion surrounded by the buried plug layer. The buried plug layer has a U-shaped cross-sectional profile.

Abstract: A semiconductor memory device and a manufacturing method thereof are provided in the present invention. An under-cut structure is formed at an edge of a bit line contact opening in the process of forming the bit line contact opening for avoiding short problems caused by alignment shifting, and the process window of the process of forming the bit line contact opening may be improved accordingly.

Abstract: A computing in memory (CIM) cell includes a memory cell circuit, a first semiconductor element, a second semiconductor element, and a third semiconductor element. A first terminal of the first semiconductor element is coupled to a first computing bit-line. A control terminal of the first semiconductor element is coupled to a computing word-line. A control terminal of the second semiconductor element is coupled to the memory cell circuit. A first terminal of the second semiconductor element is coupled to a second terminal of the first semiconductor element. A first terminal of the third semiconductor element is coupled to a second terminal of the second semiconductor element. A second terminal of the third semiconductor element is coupled to a second computing bit-line. A control terminal of the third semiconductor element receives a bias voltage.