Patents by Inventor Chi Wang

Chi Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240267528
    Abstract: The present invention provides an encoder including a quantization circuit, an encoding circuit, an energy parameter calculation circuit and a quantization parameter determination circuit. The quantization circuit is configured to perform quantization operations on a plurality of CTUs in image data in sequence to generate quantized data respectively corresponding to the plurality of CTUs. The encoding circuit is configured to perform encoding operations on the quantized data of the plurality of CTUs in sequence to generate encoded data. The energy parameter calculation circuit is configured to receive the image data, and calculate a plurality of energy parameters respectively corresponding to the plurality of CTUs in the image data. The quantization parameter determination circuit is configured to determine a plurality of quantization parameters of the plurality of CTUs according to at least a portion of the plurality of energy parameters, for the quantization circuit to perform the quantization operations.
    Type: Application
    Filed: February 8, 2023
    Publication date: August 8, 2024
    Applicant: Realtek Semiconductor Corp.
    Inventors: Weimin Zeng, Chi-Wang Chai, Wei Li, Wujun Chen, Wei Pu
  • Patent number: 12057467
    Abstract: A method includes forming a plurality of openings extending into a substrate from a front surface of the substrate. The substrate includes a first semiconductor material. Each of the plurality of openings has a curve-based bottom surface. The method includes filling the plurality of openings with a second semiconductor material. The second semiconductor material is different from the first semiconductor material. The method includes forming a plurality of pixels that are configured to sense light in the plurality of openings, respectively, using the second semiconductor material.
    Type: Grant
    Filed: August 4, 2023
    Date of Patent: August 6, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yeh-Hsun Fang, Chiao-Chi Wang, Chung-Chuan Tseng, Chia-Ping Lai
  • Publication number: 20240258218
    Abstract: A semiconductor package device is provided. The semiconductor package device includes a circuit substrate having a first terminal end; a chip disposed on the circuit substrate and having a conductive pad; an auxiliary structure disposed between the first terminal end and the conductive pad, wherein the chip is electrically connected to the circuit substrate through the auxiliary structure; and a protective layer disposed on the circuit substrate and surrounding the chip, wherein the width of the first terminal end is greater than or equal to the width of the auxiliary structure.
    Type: Application
    Filed: January 3, 2024
    Publication date: August 1, 2024
    Inventors: Cheng-Chi WANG, Kuan-Hsueh LIN, Shih-Kang LIN
  • Publication number: 20240258241
    Abstract: The present disclosure provides an electronic device and a manufacturing method. The electronic device includes a base layer, a first redistribution structure, a first electronic unit, a second electronic unit, a protecting layer, and a connecting component. The base layer includes at least one via structure. The first redistribution structure is disposed on the base layer, and the first electronic unit and the second electronic unit are disposed on the first redistribution structure. The protecting layer surrounds the first electronic unit and the second electronic unit, and the first electronic unit and the second electronic unit are electrically connected to the connecting component through the first redistribution structure and the at least one via structure.
    Type: Application
    Filed: January 7, 2024
    Publication date: August 1, 2024
    Applicant: InnoLux Corporation
    Inventors: Jui-Jen YUEH, Cheng-Chi Wang, Ju-Li Wang
  • Publication number: 20240259577
    Abstract: The present invention provides a receiver including a decoder, an upscale circuit and a color space conversion circuit. The decoder is configured to decode a video stream to generate a base layer and an enhancement layer. The upscale circuit is configured to perform an upscaling operation on the base layer to generate an upscaled base layer, wherein the upscaled base layer comprises luminance values of a plurality of pixels of a frame, and the enhancement layer comprises residuals of the plurality of pixels of the frame. The color space conversion circuit is configured to use a conversion matrix to combine the upscaled base layer and the enhancement layer to generate output video data.
    Type: Application
    Filed: February 1, 2023
    Publication date: August 1, 2024
    Applicant: Realtek Semiconductor Corp.
    Inventor: Chi-Wang Chai
  • Publication number: 20240255714
    Abstract: The present disclosure provides a semiconductor device, including a substrate structure, a photonic unit, an optical fiber and a chip unit. The substrate structure includes a coupling member. The photonic unit is disposed in a first recess of the coupling member. The optical fiber is disposed in a second recess of the coupling member and optically coupled to the photonic unit. The chip unit is disposed on the substrate structure and electrically connected to the photonic unit through the coupling member. A depth of the second recess is greater than or equal to half a diameter of the optical fiber.
    Type: Application
    Filed: January 10, 2024
    Publication date: August 1, 2024
    Applicant: InnoLux Corporation
    Inventors: Cheng-Chi WANG, Jui-Jen YUEH
  • Patent number: 12044631
    Abstract: A wafer surface defect inspection method and a wafer surface defect inspection apparatus are provided. The method includes the following steps. Scanning information of a wafer is received, and the scanning information includes multiple scanning parameters. At least one reference point of the scanning information is determined, and path information is generated according to the at least one reference point and a reference value. Multiple first scanning parameters corresponding to the path information in the scanning parameters are obtained according to the path information to generate a curve chart. According to the curve chart, it is determined whether the wafer has a defect, and a defect type of the defect is determined.
    Type: Grant
    Filed: January 13, 2022
    Date of Patent: July 23, 2024
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Shang-Chi Wang, Miao-Pei Chen, Han-Zong Wu, Chia-Chi Tsai, I-Ching Li
  • Patent number: 12046640
    Abstract: A semiconductor device includes an epitaxial substrate. The epitaxial substrate includes a substrate. A strain relaxed layer covers and contacts the substrate. A III-V compound stacked layer covers and contacts the strain relaxed layer. The III-V compound stacked layer is a multilayer epitaxial structure formed by aluminum nitride, aluminum gallium nitride or a combination of aluminum nitride and aluminum gallium nitride.
    Type: Grant
    Filed: April 17, 2023
    Date of Patent: July 23, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Yu-Ming Hsu, Yu-Chi Wang, Yen-Hsing Chen, Tsung-Mu Yang, Yu-Ren Wang
  • Patent number: 12046639
    Abstract: A semiconductor device includes an epitaxial substrate. The epitaxial substrate includes a substrate. A strain relaxed layer covers and contacts the substrate. A III-V compound stacked layer covers and contacts the strain relaxed layer. The III-V compound stacked layer is a multilayer epitaxial structure formed by aluminum nitride, aluminum gallium nitride or a combination of aluminum nitride and aluminum gallium nitride.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: July 23, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Yu-Ming Hsu, Yu-Chi Wang, Yen-Hsing Chen, Tsung-Mu Yang, Yu-Ren Wang
  • Patent number: 12047038
    Abstract: A reconfigurable crystal oscillator and a method for reconfiguring a crystal oscillator are provided. The reconfigurable crystal oscillator includes a transconductance circuit, a feedback resistor, a crystal tank, an input-end capacitor and an output-end capacitor. Both of the feedback resistor and the crystal tank are coupled between an input terminal and an output terminal of the transconductance circuit. The input-end capacitor is coupled to the input terminal of the transconductance circuit, and the output-end capacitor is coupled to the output terminal of the transconductance circuit. In particular, the transconductance circuit is configured to provide a transconductance, and when an operation mode of the reconfigurable crystal oscillator is switched, an input-end capacitance of the input-end capacitor and an output-end capacitance of the output-end capacitor are switched, respectively.
    Type: Grant
    Filed: December 25, 2022
    Date of Patent: July 23, 2024
    Assignee: MEDIATEK INC.
    Inventors: Keng-Meng Chang, Sen-You Liu, Yao-Chi Wang
  • Publication number: 20240243108
    Abstract: An electronic device is provided. The electronic device includes a substrate, a plurality of light-emitting elements, and a protective layer. The substrate includes a connecting element. The plurality of light-emitting elements is disposed on the substrate. The protective layer is disposed on the substrate and includes an opaque layer and a transparent layer. The opaque layer has a plurality of openings. At least a portion of the transparent layer is disposed in the openings and covers the respective light-emitting elements. The protective layer surrounds the connecting element.
    Type: Application
    Filed: January 2, 2024
    Publication date: July 18, 2024
    Inventors: Jui-Jen YUEH, Kuan-Feng LEE, Jia-Yuan CHEN, Cheng-Chi WANG
  • Publication number: 20240244179
    Abstract: A three-dimensional data encoding method includes: encoding a first flag indicating whether a node having a parent node different from a parent node of a current node is to be referred to in encoding of the current node included in an n-ary tree structure of three-dimensional points included in three-dimensional data; selecting a coding table from N coding tables according to occupancy states of neighboring nodes of the current node, and performing arithmetic encoding on information of the current node using the coding table selected, when the first flag indicates that the node is to be referred to; and selecting a coding table from M coding tables according to the occupancy states of the neighboring nodes of the current node, and performing arithmetic encoding on information of the current node using the coding table selected, when the first flag indicates that the node is not to be referred to.
    Type: Application
    Filed: February 15, 2024
    Publication date: July 18, 2024
    Inventors: Toshiyasu SUGIO, Chi Wang, Pongsak LASANG, Chung Dean HAN, Noritaka IGUCHI
  • Patent number: 12033363
    Abstract: A three-dimensional data encoding method includes: encoding first information of a first current node or second information of a second current node, the first current node being included in an N-ary tree structure of first three-dimensional points included in a first three-dimensional point cloud, N being 2 or 4, the second current node being included in an octree structure of second three-dimensional points included in a second three-dimensional point cloud The encoding of the first information or the second information includes encoding the first information using a first encoding pattern including a pattern common to a second encoding pattern used in encoding the second information.
    Type: Grant
    Filed: August 11, 2023
    Date of Patent: July 9, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA
    Inventors: Toshiyasu Sugio, Noritaka Iguchi, Chi Wang, Pongsak Lasang, Chung Dean Han
  • Publication number: 20240218294
    Abstract: A cleaning composition for electronics industries is provided. The cleaning composition includes 40% to 90% by weight of an amine solvent having a structure of following formula (1), a quaternary ammonium salt, and water. Wherein, R1, R2, R4, and R5 are each independently hydrogen, a linear alkyl group having 1 to 4 carbon atoms, a branched alkyl group having 3 to 5 carbon atoms, a linear alkylamine having 1 to 4 carbon atoms, or a branched alkylamine having 3 to 5 carbon atoms, and R3 is a linear alkylene group having 1 to 5 carbon atoms or a branched alkylene group having 3 to 5 carbon atoms.
    Type: Application
    Filed: November 6, 2023
    Publication date: July 4, 2024
    Applicant: Daxin materials corporation
    Inventors: Hui-yi TANG, Tzu-chi WANG, Yi-cheng CHEN
  • Publication number: 20240196551
    Abstract: A hot-swappable electronic device and a method for preventing crash of the same are provided. The method includes: detecting, by a controller, whether or not the hot-swappable electronic device is in a power-on state; detecting, by the controller, whether or not a power connection port is connected to an alternating current power source when the hot-swappable electronic device is in the power-on state; detecting, by a first sensor and a second sensor, whether or not a first battery leaves a first battery installation groove and a second battery leaves a second battery installation groove when the power connection port is not connected to the alternating current power source; and lowering, by the controller, a system power consumption of the hot-swappable electronic device when the first battery leaves the first battery installation groove or the second battery leaves the second battery installation groove.
    Type: Application
    Filed: March 8, 2023
    Publication date: June 13, 2024
    Inventor: CHUN-CHI WANG
  • Patent number: 12009462
    Abstract: A light source assembly is provided, including a substrate; a light-emitting element disposed on the substrate; and an optical film at least partially overlapped with the substrate. A diffuser film is at least partially overlapped with the optical film, wherein a haze of the diffuser film is greater than 85%, and a thickness of the diffuser film ranges from 0.04 mm to 0.35 mm. The optical film and the diffuser film are capable of transmitting at least a part of light emitted from the light-emitting element.
    Type: Grant
    Filed: February 16, 2022
    Date of Patent: June 11, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Chia-Lun Chen, Shih-Chang Huang, Ming-Hui Chu, Chih-Chang Chen, Kai-Hsien Hsiung, Hui-Chi Wang, Wun-Yuan Su
  • Patent number: 12008935
    Abstract: An arcuate display device includes a plurality of display units each having has a plurality of pixels, a virtual axis, and a plurality of driving devices. Each pixel includes first, second, and third light-emitting elements respectively disposed at first, second, and third positions. The driving devices corresponding to the display units having the same minimum distance from the virtual axis have the same circuit layout design. The first, second, and third positions are sequentially arranged in a direction away from the virtual axis. Optical properties of the first light-emitting elements and the third light-emitting elements in at least a part of the pixels disposed at a first side of the virtual axis are respectively substantially the same as optical properties of the third light-emitting elements and the first light-emitting elements in at least a part of the pixels disposed at a second side of the virtual axis.
    Type: Grant
    Filed: March 1, 2023
    Date of Patent: June 11, 2024
    Assignee: AUO Corporation
    Inventors: Kai-Yi Lu, Hung-Chi Wang, Chen-Yu Lin, Ya-Fang Chen, Chih-Hsiang Yang
  • Publication number: 20240187572
    Abstract: A coding algorithm encodes consecutive frames of a video sequence and realizes distributed Gradual Decoding Refresh. The consecutive frames include a first frame, a second frame, and a third frame, and each frame is composed of (X+Y+Z) columns of coding tree units. The algorithm includes: coding X columns of the first frame in an intra coding manner and coding the other columns of the first frame in an inter coding manner and/or the intra coding manner; coding X columns of the second frame in the inter coding manner, coding Y columns of the second frame in the intra coding manner, and coding Z columns of the second frame in the inter and/or intra coding manner(s); and coding X and Y columns of the third frame in the inter coding manner, and coding Z columns of the third frame in the intra coding manner. The X/Y/Z columns (intra-coded columns) are inconsecutive.
    Type: Application
    Filed: December 6, 2022
    Publication date: June 6, 2024
    Inventors: WEI-MIN ZENG, CHI-WANG CHAI, WU-JUN CHEN, WEI LI, RONG ZHANG
  • Patent number: 12000193
    Abstract: An electric supporting rod includes a driving unit and an actuating unit. The driving unit has a first outer cylinder and a driver disposed in the first outer cylinder. The first outer cylinder has an opening and elastic latching hooks disposed on an inner wall thereof, and the driver has a transmission slot. The actuating unit has a second outer cylinder and a transmission screw rod sheathed in the second outer cylinder. The second outer cylinder has an insertion part inserted into the opening, the transmission screw rod has a passive end engaged with the transmission slot, the insertion part has connection pieces surrounding the passive end, and the connection pieces are latched with the elastic latching hooks to longitudinally lock driving unit and the actuating unit. Accordingly, the electric supporting rod has a simple structure and is easily assembled.
    Type: Grant
    Filed: March 1, 2022
    Date of Patent: June 4, 2024
    Assignees: HSIN CHONG MACHINERY WORKS CO. LTD., FUZHOU MINGFANG AUTOMOBILE PARTS INDUSTRY CO., LTD.
    Inventors: Chi-Wang Wu, Feng-Lin Yang, Jeffrey Chung-Chiang Hsi
  • Publication number: 20240175771
    Abstract: Embodiments of the disclosure provide a method and device for providing a wire breakage warning. The method includes: obtaining a plurality of process values when a crystal ingot cutting machine uses a cutting wire to cut a crystal ingot; dividing the process values into N groups, and determining a statistical property of each of the groups; identifying outlier values in the process values based on the statistical property of each of the groups, or determining a statistical property variation corresponding to each of the groups based on the statistical property of each of the groups; and in response to determining that the outlier values in the process values meet a first warning condition, or the statistical property variation corresponding to each of the groups meets a second warning condition, providing a wire breakage warning associated with the cutting wire.
    Type: Application
    Filed: November 30, 2022
    Publication date: May 30, 2024
    Applicant: GlobalWafers Co., Ltd.
    Inventors: Chien-Wen YU, Shang-Chi Wang, Bo-Ting Lin