Abstract: An optical imaging lens includes first, second, third, fourth, fifth, and sixth lens elements sequentially along an optical axis from an object side to an image side. Each of the first to the sixth lens elements includes an object-side surface facing the object side and allowing imaging rays to pass through and an image-side surface facing the image side and allowing the imaging rays to pass through. The optical imaging lens satisfies conditions of Gallmax/Fno?3.600 millimeters, EFL/ImgH?3.200, and Gallmax/Tavg?3.300; here, Gallmax represents a largest air gap along the optical axis between the first lens element and an image plane, Fno, EFL, and ImgH respectively represent an F-number, an effective focal length, and an image height of the optical imaging lens, and Tavg represents an average lens element thickness of all of the lens elements along the optical axis from the object side to the image plane.

Abstract: A three-dimensional data encoding method includes: encoding a first flag indicating whether a node having a parent node different from a parent node of a current node is to be referred to in encoding of the current node included in an n-ary tree structure of three-dimensional points included in three-dimensional data; selecting a coding table from N coding tables according to occupancy states of neighboring nodes of the current node, and performing arithmetic encoding on information of the current node using the coding table selected, when the first flag indicates that the node is to be referred to; and selecting a coding table from M coding tables according to the occupancy states of the neighboring nodes of the current node, and performing arithmetic encoding on information of the current node using the coding table selected, when the first flag indicates that the node is not to be referred to.

Abstract: An electronic device includes a chip and a circuit structure layer overlapped with the chip. The circuit structure layer includes a redistribution structure layer and an element structure layer, and the redistribution structure layer and the element structure layer are electrically connected to the chip. At least one of the redistribution structure layer and the element structure layer includes at least one opening, and in a normal direction of the electronic device, the at least one opening is overlapped with aside of the chip.

Abstract: A three-dimensional data encoding method of encoding three-dimensional points obtained by a sensor includes: encoding local coordinate information indicating sets of local coordinates that are coordinates of the three-dimensional points and are dependent on a location of the sensor; and generating an encoded bitstream including the local coordinate information encoded and global coordinate information indicating global coordinates that are coordinates of a reference point or at least one of the three-dimensional points and are independent from the location of the sensor.

Abstract: A processing method of a single crystal material includes the following steps. A single crystal material is provided as an object to be modified. The amorphous phase modification apparatus is used for emitting a femtosecond laser beam to process an internal portion of the object to be modified. The processing includes using a femtosecond laser beam to form a plurality of processing lines in the internal portion of the object to be modified, wherein each of the processing lines include a zigzag pattern processing, and a processing line spacing between the plurality of processing lines is in a range of 200 ?m to 600 ?m, wherein after the object to be modified is processed, a modified layer is formed in the object to be modified. Slicing or separating out a portion in the object to be modified that includes the modified layer.

Abstract: The present disclosure relates to a chimeric influenza virus hemagglutinin (HA) polypeptide, comprising one or more stem domain sequence, each having at least 60% homology with a stem domain consensus sequence of H1 subtype HA (H1 HA) and/or H5 subtype HA (H5 HA), fused with one or more globular head domain sequence, each having at least 60% homology with a globular head domain consensus sequence of H1 subtype HA (H1 HA) or H5 subtype HA (H5 HA).

Abstract: A method for manufacturing an electronic device includes: providing a base layer, wherein the base layer includes a plurality of first dies and a plurality of second dies, and a number of the plurality of first dies is greater than a number of the plurality of second dies; forming a circuit layer on the base layer; and performing an electricity test to confirm whether the circuit layer is electrically connected to one of the plurality of second dies.

Abstract: A method of manufacturing an electronic device, including the following steps, is provided. A first dielectric layer and a second dielectric layer are provided. The first dielectric layer has a first surface and a second surface opposite to each other, and the second dielectric layer has a third surface and a fourth surface opposite to each other. A first unit is formed on the first surface or the second surface of the first dielectric layer. The first dielectric layer and the second dielectric layer are combined to form a substrate structure. The second surface of the first dielectric layer faces the third surface of the second dielectric layer. A dielectric loss of the first unit is less than a dielectric loss of the first dielectric layer. The method of manufacturing the electronic device of the embodiment of the disclosure can reduce the dielectric loss by using the unit.

Abstract: A method for preparing a bifunctional film, including: (a) drying a first polymer solution to form a film to form an anti-adhesion layer, and (b) drying a second polymer solution over the anti-adhesion layer to form a film to form an attachment layer. The first polymer solution includes a first hydrophobic solution and a first hydrophilic solution, and in the first polymer solution, the weight ratio of the solute of the first hydrophobic solution to the solute of the first hydrophilic solution is 1:0.01-1. Moreover, the second polymer solution is composed of a second hydrophilic solution.

Abstract: A three-dimensional data encoding method includes: calculating coefficient values from pieces of attribute information of three-dimensional points included in point cloud data; quantizing the coefficient values individually to generate quantized values; and generating a bitstream including the quantized values. Each of the coefficient values belongs to any one of layers. In the quantizing, each of the coefficient values is quantized using a quantization parameter for a layer to which the coefficient value belongs among the layers, and the bitstream includes first information and pieces of second information, the first information indicating a reference quantization parameter, the pieces of second information being for calculating quantization parameters for the layers from the reference quantization parameter.

Abstract: The present invention provides a method for preparing 2,2-bis(4-hydroxycyclohexyl)propane, comprising: hydrogenating a reactive solution containing 2,2-bis(4-hydroxyphenyl)propane under a hydrogen atmosphere in a reactor with catalyst within a temperature range of 80-165° C. and a pressure range of 85-110 kg/cm2 to prepare the 2,2-bis(4-hydroxycyclohexyl)propane. The method of present invention has an advantage of high yield properties and achieves mass production easily, thereby enhancing the value of the industrial application.

Abstract: Provided are a non-aqueous electrolyte comprising a solvent, an electrolyte salt and a first additive, wherein the first additive is selected from at least one of the compounds as shown in structural formula 1: A-D-B-E-C, structural formula 1, wherein A, B, and C are each independently selected from the group consisting of cyclic carbonate groups, cyclic sulfate groups, cyclic sulfite groups, cyclic sulfonate groups, cyclic sulfone groups, cyclic sulfoxide groups, cyclic carboxylate groups or cyclic anhydride groups; D and E are each independently selected from single bond, or groups containing hydrocarbylene groups, ether bonds, sulfur-oxygen double bonds or carbon-oxygen double bonds; and the content of methanol in the non-aqueous electrolyte is 200 ppm or less. Further disclosed is a battery comprising the non-aqueous electrolyte.

Abstract: A three-dimensional data encoding method includes: obtaining geometry information which includes first three-dimensional positions on a measurement target, and is generated by a measurer that radially emits an electromagnetic wave in different directions and obtains a reflected wave which is the electromagnetic wave that is reflected by the measurement target; generating a two-dimensional image including first pixels corresponding to the directions, based on the geometry information; and encoding the two-dimensional image to generate a bitstream. Each of the first pixels has a pixel value indicating a first three-dimensional position or attribute information of a three-dimensional point which is included in a three-dimensional point cloud and corresponds to a direction to which the first pixel corresponds among the directions.

Abstract: A method includes forming a plurality of openings extending into a substrate from a front surface of the substrate. The substrate includes a first semiconductor material. Each of the plurality of openings has a curve-based bottom surface. The method includes filling the plurality of openings with a second semiconductor material. The second semiconductor material is different from the first semiconductor material. The method includes forming a plurality of pixels that are configured to sense light in the plurality of openings, respectively, using the second semiconductor material.

Abstract: An evaluating method for a useful lifespan of a conductive gel is applied to a non-implantable electrical stimulation device. The non-implantable electrical stimulation device includes an electrical stimulator and an electrode assembly. The electrical stimulator is detachably electrically connected to the electrode assembly. The evaluating method for the useful lifespan of the conductive gel includes the following steps. A first measuring signal is generated, and the first measuring signal flows through a conductive area to generate a first signal to be tested. The first signal to be tested is received. The first total impedance value is obtained according to the first signal to be tested. The impedance value of the conductive gel is obtained according to the first total impedance value, so as to evaluate the useful lifespan of the conductive gel.

Abstract: The present disclosure discloses a manufacturing method of an electronic device. A seed layer is formed on a substrate. After patterning the seed layer to form a plurality of sub-seed layers and a plurality of conductive lines, a metal layer is formed on a plurality of the sub-seed layers. The sub-seed layers include a first sub-seed layer and a second sub-seed layer, and the first sub-seed layer and the second sub-seed layer are separated from each other.

Abstract: An integrated hydrogen-electric includes a hydrogen fuel cell; a hydrogen fuel source; an electric motor assembly disposed in electrical communication with the fuel cell; n air compressor system configured to be driven by the motor assembly, and a cooling system having a heat exchanger radiator in a duct of the cooling system, and configured to direct an air stream including an air stream from the air compressor through the radiator, wherein an exhaust stream from a cathode side of the fuel cell is fed via an flow control nozzle into the air stream in the cooling duct downstream of the radiator.

Abstract: An apparatus and method for efficiently generating clock signals. An integrated circuit includes multiple clock dividers both at its I/O boundaries and across its semiconductor die. A clock divider receives an input clock signal, and an indication of a reduction factor that is a positive, non-zero and a non-integer value less than one. The clock divider generates an output clock signal based on the input clock signal and the reduction factor. The reduction factor can be an M-bit pattern where M is a positive, non-zero integer greater than one. Therefore, the clock divider generates the output clock signal with a reduced clock rate that has a smallest configurable granularity that is 1/M of the input clock frequency. An asserted bit in the M-bit pattern indicates that the output clock signal should have an asserted value during a corresponding clock cycle of the input clock signal.

Abstract: The present disclosure provides a control system, method and device for vehicle redundant power supply. The system comprises: a main power supply circuit comprising a main power supply monitoring module for monitoring the main power supply circuit and generating monitoring information indicating whether a power supply fault exists in the main power supply circuit; and a redundant power supply circuit comprising a redundant power supply monitoring module for monitoring the main power supply circuit and generating monitoring information indicating whether a power supply fault exists in the redundant power supply circuit; and a vehicle control unit connected to the main power supply circuit and the redundant power supply circuit respectively, and configured for determining one of the main power supply circuit and the redundant power supply circuit as a target power supply circuit for vehicle running according to monitoring information.

Abstract: A device, apparatus, and method for semiconductor transfer are provided. A transfer substrate is controlled to be moved to be above the target substrate. An infrared emitting portion emits infrared signals to position a semiconductor on a target substrate. After a second magnetic portion picks up the semiconductor from the target substrate, a controller outputs a first control current to a first electromagnetic portion to cause the first electromagnetic portion to generate an electromagnetic force, to control the second magnetic portion to adjust a position of the picked-up semiconductor relative to the welding position on the target substrate, where adjusting the position of the picked up semiconductor includes horizontal adjustment.