Abstract: The present disclosure provides a semiconductor fabrication apparatus in accordance with one embodiment. The apparatus includes a wafer stage that is operable to secure and rotate a wafer; a polish head configured to polish a backside surface of the wafer; an air bearing module configured to apply an air pressure to a front surface of the wafer; and an edge sealing unit configured to seal edges of the wafer.

Abstract: A semiconductor device includes a first fin structure for a first fin field effect transistor (PET). The first fin structure includes a first base layer protruding from a substrate, a first intermediate layer disposed over the first base layer and a first channel layer disposed over the first intermediate layer. The first fin structure further includes a first protective layer made of a material that prevents an underlying layer from oxidation. The first channel layer is made of SiGe, the first intermediate layer includes a first semiconductor (e.g., SiGe) layer disposed over the first base layer and a second semiconductor layer (e.g., Si) disposed over the first semiconductor layer. The first protective layer covers side walls of the first base layer, side walls of the first semiconductor layer and side walls of the second semiconductor layer.

Abstract: A semiconductor device includes a first fin structure for a first fin field effect transistor (FET). The first fin structure includes a first base layer protruding from a substrate, a first intermediate layer disposed over the first base layer and a first channel layer disposed over the first intermediate layer. The first fin structure further includes a first protective layer made of a material that prevents an underlying layer from oxidation. The first channel layer is made of SiGe, the first intermediate layer includes a first semiconductor (e.g., SiGe) layer disposed over the first base layer and a second semiconductor layer (e.g., Si) disposed over the first semiconductor layer. The first protective layer covers side walls of the first base layer, side walls of the first semiconductor layer and side walls of the second semiconductor layer.

Abstract: A method of performing luminance/brightness adjustment and gamut mapping to high dynamic range images for a display device includes receiving an input image to analyze an image distribution of the input image, generating a scene information of the input image according to the image distribution, and performing luminance/brightness adjustment and gamut mapping to the input image according to the scene information, to generate an output image corresponding to the input image, wherein the scene information is regarded as dynamic metadata of the input image.

Abstract: A semiconductor device includes a fin structure for a fin field effect transistor (FET). The fin structure includes a base layer protruding from a substrate, an intermediate layer disposed over the base layer and an upper layer disposed over the intermediate layer. The fin structure further includes a first protective layer and a second protective layer made of a different material than the first protective layer. The intermediate layer includes a first semiconductor layer disposed over the base layer, the first protective layer covers at least side walls of the first semiconductor layer and the second protective layer covers at least side walls of the first protective layer.

Abstract: The present disclosure provides a semiconductor fabrication apparatus in accordance with one embodiment. The apparatus includes a wafer stage that is operable to secure and rotate a wafer; a polish head configured to polish a backside surface of the wafer; an air bearing module configured to apply an air pressure to a front surface of the wafer; and an edge sealing unit configured to seal edges of the wafer.

Abstract: A semiconductor device includes a fin structure for a fin field effect transistor (FET). The fin structure includes a base layer protruding from a substrate, an intermediate layer disposed over the base layer and an upper layer disposed over the intermediate layer. The fin structure further includes a first protective layer and a second protective layer made of a different material than the first protective layer. The intermediate layer includes a first semiconductor layer disposed over the base layer, the first protective layer covers at least side walls of the first semiconductor layer and the second protective layer covers at least side walls of the first protective layer.

Abstract: A CMP slurry composition which provides for a high Ge- or SiGe-to-dielectric material selectivity a low rate of Ge or SiGe recess formation includes an oxidant and a germanium removal rate enhancer including at least one of a methylpyridine compound and a methylpyridine derivative compound. In some examples, the slurry composition also includes an etching inhibitor. In some cases, the slurry composition may include an abrasive, a surfactant, an organic complexant, a chelating agent, an organic or inorganic acid, an organic or inorganic base, a corrosion inhibitor, or a buffer. The slurry composition may be distributed onto a surface of a polishing pad disposed on a platen that is configured to rotate. Additionally, a workpiece carrier configured to house a substrate may bring the substrate into contact with the rotating polishing pad and thereby polish the substrate utilizing the slurry composition.

Abstract: An image converting method includes calculating a plurality of segment averages of pixel values in a plurality segments of an input image; acquiring the maximum among the segment averages as a first threshold; calculating a plurality of local averages of pixel values in adjacent segments of input image; acquiring the maximum among local averages as a second threshold; counting the number of pixel values exceeding first threshold in the segments as a plurality of first pixel counts and counting the number of pixel values exceeding second threshold in the segments as a plurality of second pixel counts; generating a specular map and a confidence according to the first pixel counts and the second pixel counts; mapping the input image according to the specular map, to generate an intermediate image; and blending the input image and the intermediate image according to the confidence, to generate an output image.

Abstract: A semiconductor device includes a fin structure for a fin field effect transistor (FET). The fin structure includes a base layer protruding from a substrate, an intermediate layer disposed over the base layer and an upper layer disposed over the intermediate layer. The fin structure further includes a first protective layer and a second protective layer made of a different material than the first protective layer. The intermediate layer includes a first semiconductor layer disposed over the base layer, the first protective layer covers at least side walls of the first semiconductor layer and the second protective layer covers at least side walls of the first protective layer.

Abstract: A CMP slurry composition which provides for a high Ge- or SiGe-to-dielectric material selectivity a low rate of Ge or SiGe recess formation includes an oxidant and a germanium removal rate enhancer including at least one of a methylpyridine compound and a methylpyridine derivative compound. In some examples, the slurry composition also includes an etching inhibitor. In some cases, the slurry composition may include an abrasive, a surfactant, an organic complexant, a chelating agent, an organic or inorganic acid, an organic or inorganic base, a corrosion inhibitor, or a buffer. The slurry composition may be distributed onto a surface of a polishing pad disposed on a platen that is configured to rotate. Additionally, a workpiece carrier configured to house a substrate may bring the substrate into contact with the rotating polishing pad and thereby polish the substrate utilizing the slurry composition.

Abstract: A memory storage device and a memory controller and an access method thereof are provided. The memory storage device includes a rewritable non-volatile memory chip having a plurality of physical blocks. The access method includes configuring a plurality of logical blocks to be mapped to a part of the physical blocks and dividing the logical blocks into at least a first partition and a second partition, wherein the first partition records an auto-execute file. The access method also includes determining whether a trigger signal is existent and sending a media ready message to a host system if the trigger signal is existent, so as to allow the host system to automatically run the auto-execute file and receive a first password. The access method further includes determining whether to provide the logical blocks in the second partition to the host system according to the first password received from the host system.

Abstract: The present disclosure relates to a method of performing a chemical mechanical planarization (CMP) process with a high germanium-to-oxide removal selectivity and a low rate of germanium recess formation. The method is performed by providing a semiconductor substrate having a plurality of germanium compound regions including germanium interspersed between a plurality of oxide regions including an oxide. A slurry is then provided onto the semiconductor substrate. The slurry has an oxidant and an etching inhibitor configured to reduce a removal rate of the germanium relative to the oxide. A CMP process is then performed by bringing a chemical mechanical polishing pad in contact with top surfaces of the plurality of germanium compound regions and the plurality of oxide regions.

Abstract: A semiconductor device includes a first fin structure for a first fin field effect transistor (FET). The first fin structure includes a first base layer protruding from a substrate, a first intermediate layer disposed over the first base layer and a first channel layer disposed over the first intermediate layer. The first fin structure further includes a first protective layer made of a material that prevents an underlying layer from oxidation. The first channel layer is made of SiGe, the first intermediate layer includes a first semiconductor (e.g., SiGe) layer disposed over the first base layer and a second semiconductor layer (e.g., Si) disposed over the first semiconductor layer. The first protective layer covers side walls of the first base layer, side walls of the first semiconductor layer and side walls of the second semiconductor layer.

Abstract: A control method of a resistive random-access memory is provided. Firstly, an action is performed on the resistive random-access memory, so that the resistive random-access memory has a specified state. Then, an operation period begins. During a first sub-period of the operation period, a first control signal with a first polarity is provided. During a second sub-period of the operation period, a second control signal with a second polarity is provided. During a third sub-period of the operation period, a third control signal with the first polarity is provided. During a fourth sub-period of the operation period, a read signal is provided, so that the resistive random-access memory generates a read current. According to the read current, a controlling circuit verifies whether the resistive random-access memory is in the specified state.

Abstract: The present disclosure relates to a chemical mechanical polishing (CMP) slurry composition that provides for a high metal to dielectric material selectivity along with a low rate of metal recess formation. In some embodiments, the disclosed slurry composition has an oxidant and an etching inhibitor. The oxidant has a compound with one or more oxygen molecules. The etching inhibitor has a nitrogen-oxide compound. The etching inhibitor reduces the rate of metal and dielectric material (e.g., oxide) removal, but does so in a manner that reduces the rate of dielectric material removal by a larger amount, so as to provide the slurry composition with a high metal (e.g., germanium) to dielectric material removal selectivity and with a low rate of metal recess formation.

Abstract: A control method of a resistive random-access memory is provided. Firstly, an action is performed on the resistive random-access memory, so that the resistive random-access memory has a specified state. Then, an operation period begins. During a first sub-period of the operation period, a first control signal with a first polarity is provided. During a second sub-period of the operation period, a second control signal with a second polarity is provided. During a third sub-period of the operation period, a third control signal with the first polarity is provided. During a fourth sub-period of the operation period, a read signal is provided, so that the resistive random-access memory generates a read current. According to the read current, a controlling circuit verifies whether the resistive random-access memory is in the specified state.

Abstract: Compositions useful for the selective removal of titanium nitride and/or photoresist etch residue materials relative to insulating materials from a microelectronic device having same thereon. The removal compositions contain at least one oxidant, one etchant, and one activator to enhance the etch rate of titanium nitride.

Abstract: The present disclosure provides a data protection method, a memory control circuit unit and a memory storage device. The data protection method includes: establishing a security channel with a electronic device through a wireless communication network; acquiring an identification code through the security channel established on the wireless communication network; acquiring an encryption/decryption key by using the identification code and storing the encryption/decryption key in a buffer memory; decoding the data read from the rewritable non-volatile memory by using the encryption/decryption key, and the data in the rewritable non-volatile memory is encoded by using the encryption/decryption key; detecting whether an acknowledgement signal is received from the security channel established through the wireless communication network; and erasing the encryption/decryption key stored in the buffer memory if the acknowledgement signal is not received from the electronic device within a predetermined period of time.

Abstract: A semiconductor device includes a first fin structure for a first fin field effect transistor (FET). The first fin structure includes a first base layer protruding from a substrate, a first intermediate layer disposed over the first base layer and a first channel layer disposed over the first intermediate layer. The first fin structure further includes a first protective layer made of a material that prevents an underlying layer from oxidation. The first channel layer is made of SiGe, the first intermediate layer includes a first semiconductor (e.g., SiGe) layer disposed over the first base layer and a second semiconductor layer (e.g., Si) disposed over the first semiconductor layer. The first protective layer covers side walls of the first base layer, side walls of the first semiconductor layer and side walls of the second semiconductor layer.