Patents by Inventor Chia-Wei Chang

Chia-Wei Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11268947
    Abstract: Embodiments include a device for testing biological specimen. The device can include a receiving mechanism to receive a carrier. The carrier may include a holding area. The device includes a camera to capture a plurality of images of the holding area. A processor in the device may utilize the camera module to: adaptively select, based on the plurality of images of the holding area, an analytical algorithm suitable for a motion property that is characteristic of the biological specimen being tested; and perform a set of analytic processes that corresponds to the selected analytic algorithm on the captured imagery to generate an analytic result associated with the biological specimen.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: March 8, 2022
    Assignee: Bonraybio Co., Ltd.
    Inventors: Cheng-Teng Hsu, Chih-Pin Chang, Kuang-Li Huang, Yu-Chiao Chi, Chia-Wei Chang, Chiung-Han Wang
  • Patent number: 11271090
    Abstract: A method for fabricating a semiconductor device includes the steps of: providing a substrate having a NMOS region and a PMOS region; forming a first gate structure on the NMOS region and a second gate structure on the PMOS region; forming a seal layer on the first gate structure and the second gate structure; forming a first lightly doped drain (LDD) adjacent to the first gate structure; forming a second LDD adjacent to the second gate structure; and performing a soak anneal process to boost an oxygen concentration of the seal layer for reaching a saturation level.
    Type: Grant
    Filed: May 6, 2020
    Date of Patent: March 8, 2022
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chia-Ming Kuo, Fu-Jung Chuang, Po-Jen Chuang, Chia-Wei Chang, Guan-Wei Huang, Chia-Yuan Chang
  • Publication number: 20220000236
    Abstract: A bag set comprises a first bag unit combined with a second bag unit. The first bag unit includes a main bag body and a strap set. The main bag body has two first fasteners disposed on an outer surface. The strap set includes a first strap component having two ends connected with the main bag body, and a second strap component having a loop structure and one end connected with the main bag body. The second bag unit has two second fasteners to be attached to or disassembled from the two first fasteners selectively. When in use, the first strap component is hung diagonally on a shoulder of a user; and the second strap component is extended forward from the waist of the user to make the loop structure positioned in front side of the user, to pass the first strap component through the loop structure.
    Type: Application
    Filed: December 17, 2020
    Publication date: January 6, 2022
    Applicant: BITPLAY INC.
    Inventor: Chia-Wei CHANG
  • Publication number: 20210388865
    Abstract: A composite crank has a first metal member, a second metal member, a connecting space, an external fiber member, and a reinforcement fiber member. The first metal member and the second metal member are arranged at a spaced interval to form the connecting space in the composite crank and between the first metal member and the second metal member. The external fiber member is wrapped on and around the first metal member, the second metal member, and the connecting space. The reinforcement fiber member is disposed between the first metal member and the second metal member and has two overlaying segments respectively bonding to two opposite inner sides of the external fiber member along a thickness direction of the composite crank and a rib disposed in the connecting space and connecting with the two overlaying segments. The composite crank is light in weight, and structural strength in a thickness direction thereof can be enhanced.
    Type: Application
    Filed: June 9, 2021
    Publication date: December 16, 2021
    Inventors: Wen-Chang KUO, Chun-Yen HUANG, Chia-Wei CHANG, Po-Yueh CHOU
  • Publication number: 20210370955
    Abstract: According to one embodiment, there is provided a computing device and method for evaluating driving risk. The computing device includes an input circuit and a processor. The input circuit is configured to receive data from a vehicle. The data includes at least one of GPS data, acceleration data or image data of views external of the vehicle or inside the cabin. Thereafter, the processor is configured to identify a plurality of risks based on the data received from the vehicle, determine a plurality of weightages which are assigned to the plurality of risks, and generate a score based on the plurality of weightages for the plurality of risks.
    Type: Application
    Filed: March 27, 2019
    Publication date: December 2, 2021
    Inventors: Shih Jon Wong, Chia Wei Chang
  • Publication number: 20210356207
    Abstract: A spray drum system includes a drum drying device and a spray device. The spray device is configured to spray solid particles on the drum drying device. The spray device includes a feeding hopper, a vibrator, a pneumatic conveyor and a high-pressure air source. The feeding hopper is configured to accommodate the solid particles. The vibrator is connected with an output port of the feeding hopper and configured to vibrate the feeding hopper and output the solid particles and control an output rate of the solid particles. The pneumatic conveyor is configured to receive the solid particles output from the vibrator and spray over the drum drying device. The high-pressure air source is connected with the pneumatic conveyor and configured to supply a gas driving force required to transport and spray the solid particles.
    Type: Application
    Filed: December 10, 2020
    Publication date: November 18, 2021
    Inventors: Chao-Bin CHEN, Chia-Wei CHANG
  • Patent number: 11177177
    Abstract: A semiconductor device and method for forming the semiconductor device are provided. A first layer is formed over a semiconductor layer, and a first patterned mask is formed over the first layer. A cyclic etch process is then performed to define a second patterned mask in the first layer. The cyclic etch process includes a first phase to form a polymer layer over the first patterned mask and a second phase to remove the polymer layer and to remove a portion of the first layer. A portion of the semiconductor layer is removed using the second patterned mask to define a fin from the semiconductor layer.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: November 16, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Fo-Ju Lin, Chia-Wei Chang, Chiung Wen Hsu
  • Patent number: 11177092
    Abstract: A keyboard device includes plural key structures. Each key structure includes a plate assembly, a keycap assembly, an elastic element, a connecting member and a signal generator. The plate assembly includes a membrane switch. The keycap assembly is located over the plate assembly. The elastic element is arranged between the plate assembly and the keycap assembly. The connecting member is arranged between the plate assembly and the keycap assembly. The connecting member includes a triggering part. The signal generator is installed on the plate assembly. While the keycap assembly is moved toward the plate assembly through the connecting member, the triggering part is moved downwardly to trigger the signal generator to generate a first signal. After the signal generator is triggered, the keycap assembly is continuously moved downwardly and the membrane switch is triggered to generate a second signal.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: November 16, 2021
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Chien-Hung Liu, Chin-Sung Pan, Lei-Lung Tsai, Chia-Wei Chang
  • Patent number: 11171072
    Abstract: A heat dissipation substrate includes a substrate, a heat conducting element, an insulating filling material, a first circuit layer, and a second circuit layer. The substrate has a first surface, a second surface opposite the first surface, and a through groove communicating the first surface with the second surface. The heat conducting element is disposed in the through groove. The heat conducting element includes an insulating material layer and at least one metal layer. The insulating filling material is filled in the through groove for fixing the heat conducting element into the through groove. The first circuit layer is disposed on the first surface of the substrate and exposes a portion of the heat conducting element. The second circuit layer is disposed on the second surface of the substrate. The first circuit layer and the metal layer are respectively disposed on two opposite sides of the insulating material layer.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: November 9, 2021
    Assignee: Subtron Technology Co., Ltd.
    Inventors: Chien-Hung Wu, Bo-Yu Huang, Chia-Wei Chang, Tzu-Shih Shen
  • Patent number: 11151944
    Abstract: A driving circuit, a display apparatus and a driving method thereof are provided. The display panel is divided into a plurality of regions including a first region having a rectangular form and a second region having a free form. The driving circuit generates a plurality of control clocks having a first duty cycle during a first period and a second duty cycle different from the first duty cycle during a second period, or having a first phase shift during the first period and a second phase shift different from the first phase shift during the second period, or having a first driving capability during the first period and a second driving capability different from the first driving capability during the second period.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: October 19, 2021
    Assignee: Novatek Microelectronics Corp.
    Inventors: Yung-Yu Hsieh, Tse-Yuan Chen, Jen-Hao Liao, Chun-Hsiao Teng, Chia-Wei Chang
  • Publication number: 20210320187
    Abstract: A method for fabricating a semiconductor device includes the steps of: providing a substrate having a NMOS region and a PMOS region; forming a first gate structure on the NMOS region and a second gate structure on the PMOS region; forming a seal layer on the first gate structure and the second gate structure; forming a first lightly doped drain (LDD) adjacent to the first gate structure; forming a second LDD adjacent to the second gate structure; and performing a soak anneal process to boost an oxygen concentration of the seal layer for reaching a saturation level.
    Type: Application
    Filed: May 6, 2020
    Publication date: October 14, 2021
    Inventors: Chia-Ming Kuo, Fu-Jung Chuang, Po-Jen Chuang, Chia-Wei Chang, Guan-Wei Huang, Chia-Yuan Chang
  • Patent number: 11144322
    Abstract: A system includes a memory and multiple processors. The memory further includes a shared section and a non-shared section. The processors further include at least a first processor and a second processor, both of which read-only access to the shared section of the memory. The first processor and the second processor are operable to execute shared code stored in the shared section of the memory, and execute non-shared code stored in a first sub-section and a second sub-section of the non-shared section, respectively. The first processor and the second processor execute the share code according to a first scheduler and a second scheduler, respectively. The first scheduler operates independently of the second scheduler.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: October 12, 2021
    Assignee: MediaTek Inc.
    Inventors: Hsiao Tzu Feng, Chia-Wei Chang, Li-San Yao
  • Patent number: 11120956
    Abstract: A keyboard device includes a key structure and a membrane circuit board. The membrane circuit board includes a membrane switch. The membrane switch is located under the key structure. The key structure includes a pedestal structure, a covering structure, a keycap, a connecting element, a dome-type elastomer and a knocking element. The keycap is installed on the covering structure. The connecting element is connected between the covering structure and the pedestal structure. The dome-type elastomer is arranged between the covering structure and the membrane circuit board. When the keycap is not depressed, the knocking element is supported on the connecting element. While the keycap is depressed, the knocking element knocks on the connecting element to generate an operating sound and provide the operating feedback to the user.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: September 14, 2021
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Chia-Wei Chang, Chin-Sung Pan, Lei-Lung Tsai
  • Publication number: 20210257484
    Abstract: A semiconductor device includes a substrate, a fin structure protruding from the substrate, a gate insulating layer covering a channel region formed of the fin structure, a gate electrode layer covering the gate insulating layer, and isolation layers disposed on opposite sides of the fin structure. The fin structure includes a bottom portion, a neck portion, and a top portion sequentially disposed on the substrate. A width of the neck portion is less than a width of the bottom portion and a width of a portion of the top portion.
    Type: Application
    Filed: May 3, 2021
    Publication date: August 19, 2021
    Inventors: Chia-Wei CHANG, Chiung Wen HSU, Yu-Ting WENG
  • Patent number: 11080104
    Abstract: Activating an extension includes opening a first compose application by a first computing device. A composed document is received, and an extension is activated in response to the document. The extension may be activated as the document is being composed.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: August 3, 2021
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: Andrew Salamatov, Jason Todd Henderson, Oleg Ouliankine, Pretish Abraham, Philip Yue-Leung Chan, Kee Hyuk Park, Shivani Chaturvedi, Sudhakar Pasupuleti, Paul Virag, Angela So, Chia-Wei Chang
  • Publication number: 20210132952
    Abstract: A system includes a memory and multiple processors. The memory further includes a shared section and a non-shared section. The processors further include at least a first processor and a second processor, both of which read-only access to the shared section of the memory. The first processor and the second processor are operable to execute shared code stored in the shared section of the memory, and execute non-shared code stored in a first sub-section and a second sub-section of the non-shared section, respectively. The first processor and the second processor execute the share code according to a first scheduler and a second scheduler, respectively. The first scheduler operates independently of the second scheduler.
    Type: Application
    Filed: November 5, 2019
    Publication date: May 6, 2021
    Inventors: Hsiao Tzu Feng, Chia-Wei Chang, Li-San Yao
  • Patent number: 10998427
    Abstract: A semiconductor device includes a substrate, a fin structure protruding from the substrate, a gate insulating layer covering a channel region formed of the fin structure, a gate electrode layer covering the gate insulating layer, and isolation layers disposed on opposite sides of the fin structure. The fin structure includes a bottom portion, a neck portion, and a top portion sequentially disposed on the substrate. A width of the neck portion is less than a width of the bottom portion and a width of a portion of the top portion.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: May 4, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chia-Wei Chang, Chiung Wen Hsu, Yu-Ting Weng
  • Patent number: 10990140
    Abstract: A touchpad device is fixed to a chassis. The touchpad device includes a base plate. The base plate is fixed to the chassis. The base plate includes a body portion and fixed portions. The body portion has holes. Each of the fixed portions is connected to the body portion and extends into a corresponding one of the holes. Each of the fixed portions includes a fixed segment and at least one connecting arm. The fixed segment is fixed to the chassis. The connecting arm is connected between the fixed segment and the body portion.
    Type: Grant
    Filed: December 25, 2018
    Date of Patent: April 27, 2021
    Assignee: Chicony Electronics Co., Ltd.
    Inventors: Chia-Wei Chang, Yi-Long Hsieh
  • Patent number: 10928378
    Abstract: Embodiments include a device for testing biological specimen. The device can include a receiving mechanism to receive a carrier. The carrier may include a holding area. The device may include a camera arranged to capture a plurality of images, including a first image and a second image, of the holding area. The device may include a positioning mechanism operable to adjust a relative location of the carrier to the camera. A processor in the device may utilize the camera module to: identify an edge of the first image; cause the positioning mechanism to adjust the relative location of the carrier to the camera in a manner such that, when the camera takes the second image, an edge of the second image aligns with the identified edge of the first image; and perform a set of analytic processes on a combined image from the first and second images.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: February 23, 2021
    Assignee: Bonraybio Co., Ltd.
    Inventors: Cheng-Teng Hsu, Chih-Pin Chang, Kuang-Li Huang, Yu-Chiao Chi, Chia-Wei Chang, Chiung-Han Wang
  • Publication number: 20210050276
    Abstract: A heat dissipation substrate includes a substrate, a heat conducting element, an insulating filling material, a first circuit layer, and a second circuit layer. The substrate has a first surface, a second surface opposite the first surface, and a through groove communicating the first surface with the second surface. The heat conducting element is disposed in the through groove. The heat conducting element includes an insulating material layer and at least one metal layer. The insulating filling material is filled in the through groove for fixing the heat conducting element into the through groove. The first circuit layer is disposed on the first surface of the substrate and exposes a portion of the heat conducting element. The second circuit layer is disposed on the second surface of the substrate. The first circuit layer and the metal layer are respectively disposed on two opposite sides of the insulating material layer.
    Type: Application
    Filed: June 10, 2020
    Publication date: February 18, 2021
    Applicant: Subtron Technology Co., Ltd.
    Inventors: Chien-Hung Wu, Bo-Yu Huang, Chia-Wei Chang, Tzu-Shih Shen