Patents by Inventor Chia Ying Lee

Chia Ying Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10553431
    Abstract: The present disclosure relates to a method of performing a semiconductor fabrication process. The method may be performed by forming a spacer material having vertically extending segments along sidewalls of a masking layer and a horizontally extending segment connecting the vertically extending segments. A cut material is formed over a part of the horizontally extending segment, and the horizontally extending segment of the spacer material not covered by the cut material is removed. A layer under the masking layer is patterned according to the masking layer and the spacer material.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: February 4, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kuan-Wei Huang, Chia-Ying Lee, Ming-Chung Liang
  • Patent number: 10522093
    Abstract: A driving circuit including an output circuit, a pull-down module, conductive wires, at least one first signal line, and a buffer layer is provided. The conductive wires are electrically connected between the output circuit and the pull-down module. The output circuit and the pull-down module are electrically coupled to a driving control signal through the first signal line. A first overlapping region is located between the first signal line and a portion of the conductive wires. The buffer layer is disposed between the first signal line and the portion of the conductive wires. The buffer layer includes an overlapping portion and an extending portion. The overlapping portion is at least disposed in the first overlapping region. The extending portion is disposed outside the overlapping portion. A thickness of the overlapping portion is greater than a thickness of the extending portion. A display panel is also provided.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: December 31, 2019
    Assignee: Au Optronics Corporation
    Inventors: Hsiao-Chun Chen, Er-Lang Deng, Wei-Kai Huang, Yi-Fu Chen, Cheng-Hung Ko, Chia-Heng Chen, Shin-Shian Lee, You-Ying Lin
  • Patent number: 10504792
    Abstract: A method includes forming a pattern-reservation layer over a semiconductor substrate. The semiconductor substrate has a major surface. A first self-aligned multi-patterning process is performed to pattern a pattern-reservation layer. The remaining portions of the pattern-reservation layer include pattern-reservation strips extending in a first direction that is parallel to the major surface of the semiconductor substrate. A second self-aligned multi-patterning process is performed to pattern the pattern-reservation layer in a second direction parallel to the major surface of the semiconductor substrate. The remaining portions of the pattern-reservation layer include patterned features. The patterned features are used as an etching mask to form semiconductor nanowires by etching the semiconductor substrate.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: December 10, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ching-Feng Fu, De-Fang Chen, Yu-Chan Yen, Chia-Ying Lee, Chun-Hung Lee, Huan-Just Lin
  • Publication number: 20190244807
    Abstract: A semiconductor device includes a semiconductor substrate, a plurality of isolation structures on the semiconductor substrate, and a plurality of blocking structures disposed directly over the isolation structures. The blocking structures have a lower reflectivity than the isolation structures.
    Type: Application
    Filed: April 15, 2019
    Publication date: August 8, 2019
    Inventors: Yu-Hsuan Yang, Wen Han Hung, Tzy-Kuang Lee, Chia Ying Lin
  • Publication number: 20190164744
    Abstract: A method for fabricating a semiconductor device includes forming a plurality of isolation structures in a semiconductor substrate and forming a plurality of blocking structures over the isolation structures. The blocking structures have a lower reflectivity than the isolation structures. The method further includes forming a photoresist layer on the semiconductor substrate, exposing the photoresist layer to a light source through a mask, and developing the photoresist layer to create a patterned photoresist feature that covers a first region of a portion of the semiconductor substrate between two of the isolation structures. The portion of the semiconductor substrate having a second region that is exposed.
    Type: Application
    Filed: December 13, 2017
    Publication date: May 30, 2019
    Inventors: Yu-Hsuan Yang, Wen Han Hung, Tzy-Kuang Lee, Chia Ying Lin
  • Publication number: 20190157334
    Abstract: The present disclosure is directed to anchor structures and methods for forming anchor structures such that planarization and wafer bonding can be uniform. Anchor structures can include anchor layers formed on a dielectric layer surface and anchor pads formed in the anchor layer and on the dielectric layer surface. The anchor layer material can be selected such that the planarization selectivity of the anchor layer, anchor pads, and the interconnection material can be substantially the same as one another. Anchor pads can provide uniform density of structures that have the same or similar material.
    Type: Application
    Filed: August 6, 2018
    Publication date: May 23, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chia-Yu WEI, Cheng-Yuan LI, Hsin-Chi CHEN, Kuo-Cheng LEE, Hsun-Ying HUANG, Yen-Liang LIN
  • Patent number: D849193
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: May 21, 2019
    Assignee: KOHLER CHINA INVESTMENT CO. LTD.
    Inventors: Tsung-Yu Lu, Chia-Ying Lee, Lun Cheak Tan
  • Patent number: D853525
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: July 9, 2019
    Assignee: KOHLER CHINA INVESTMENT CO., LTD.
    Inventors: Tsung-Yu Lu, Chia-Ying Lee, Lun Cheak Tan
  • Patent number: D862649
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: October 8, 2019
    Assignee: BEIJING KOHLER LTD.
    Inventors: Jordan Meyers, Chia Ying Lee, Sophie Su
  • Patent number: D862650
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: October 8, 2019
    Assignee: BEIJING KOHLER LTD.
    Inventors: Jordan Meyers, Chia Ying Lee, Sophie Su
  • Patent number: D862658
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: October 8, 2019
    Assignee: BEIJING KOHLER LTD.
    Inventors: Jordan Meyers, Chia Ying Lee, Sophie Su
  • Patent number: D863510
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: October 15, 2019
    Assignee: BEIJING KOHLER LTD.
    Inventors: Jordan Meyers, Chia Ying Lee, Sophie Su
  • Patent number: D863511
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: October 15, 2019
    Assignee: BEIJING KOHLER LTD.
    Inventors: Jordan Meyers, Chia Ying Lee, Sophie Su
  • Patent number: D863512
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: October 15, 2019
    Assignee: BEIJING KOHLER LTD.
    Inventors: Jordan Meyers, Chia Ying Lee, Sophie Su
  • Patent number: D863513
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: October 15, 2019
    Assignee: BEIJING KOHLER LTD.
    Inventors: Jordan Meyers, Chia Ying Lee, Sophie Su
  • Patent number: D865916
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: November 5, 2019
    Assignee: BEIJING KOHLER LTD.
    Inventors: Jordan Meyers, Chia Ying Lee, Sophie Su
  • Patent number: D866711
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: November 12, 2019
    Assignee: BEIJING KOHLER LTD.
    Inventors: Jordan Meyers, Chia Ying Lee, Sophie Su
  • Patent number: D866716
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: November 12, 2019
    Assignee: BEIJING KOHLER LTD.
    Inventors: Jordan Meyers, Chia Ying Lee, Sophie Su
  • Patent number: D872238
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: January 7, 2020
    Assignee: BEIJING KOHLER LTD.
    Inventors: Jordan Meyers, Chia Ying Lee, Sophie Su
  • Patent number: D872840
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: January 14, 2020
    Assignee: BEIJING KOHLER LTD.
    Inventors: Jordan Meyers, Chia Ying Lee, Sophie Su