Abstract: Extreme ultraviolet (EUV) lithography systems are provided. A EUV scanner is configured to perform a lithography exposure process in response to EUV radiation. A light source is configured to provide the EUV radiation to the EUV scanner. A measuring device is configured to measure concentration of debris caused by unstable target droplets in the chamber. A controller is configured to adjust a first gas flow rate and a second gas flow rate in response to the measured concentration of the debris and a control signal from the EUV scanner. A exhaust device is configured to extract the debris out of the chamber according to the first gas flow rate. A gas supply device is configured to provide a gas into the chamber according to the second gas flow rate. The control signal indicates the lithography exposure process is completed.

Abstract: A chip is capable of executing an exception handling method. The chip includes a processor. The processor includes a control circuit, a voltage detection circuit, a neural network circuit, and a processing circuit. The control circuit is configured to read and execute an instruction. The voltage detection circuit is configured to detect a voltage of the processor to output a voltage value. The neural network circuit outputs an output signal according to the voltage value and the instruction. The processing circuit executes an exception process when the output signal is abnormal. Therefore, the chip can predict whether the processor may operate at a voltage less than a rated voltage and take a corresponding measure, to ensure normal operation of the chip.

Abstract: A device and method of manufacture is provided that utilize a dummy pad feature adjacent contact pads. The contact pads may be contact pads in an integrated fan-out package in which a molding compound is placed along sidewalls of a die and the contact pads extend over the die and the molding compound. The contact pads are electrically coupled to the die using one or more redistribution layers. The dummy pad features are electrically isolated from the contact pads. In some embodiments, the dummy pad features partially encircle the contact pads and are located in a corner region of the molding compound, a corner region of the die, and/or an interface region between an edge of the die and the molding compound.

Abstract: In one embodiment, a flow cytometer is disclosed having a compact light detection module. The compact light detection module includes an image array with a transparent block, a plurality of micro-mirrors in a row coupled to a first side of the transparent block, and a plurality of filters in a row coupled to a second side of the transparent block opposite the first side. Each of the plurality of filters reflects light to one of the plurality of micro-mirrors and passes light of a differing wavelength range and each of the plurality of micro-mirrors reflects light to one of the plurality of filters, such that incident light into the image array zigzags back and forth between consecutive filters of the plurality of filters and consecutive micro-mirrors of the plurality of micro-mirrors. A radius of curvature of each of the plurality of micro-mirrors images the fiber aperture onto the odd filters and collimates the light beam on the even filters.

Abstract: The present invention relates to a manicure device including at least one sensor to make it easier for a user to know the working mode and operating conditions of the manicure device. Moreover, the manicure device of the invention can operate under automatic control in order to have its working mode and operating conditions adjusted or set, or to issue a notification signal, after the working mode and operating conditions of the manicure device are sensed; therefore, it is convenient for a user to use the manicure device.

Abstract: An integrated circuit package and a method of forming the same are provided. The integrated circuit package includes a photonic integrated circuit die. The photonic integrated circuit die includes an optical coupler. The integrated circuit package further includes an encapsulant encapsulating the photonic integrated circuit die, a first redistribution structure over the photonic integrated circuit die and the encapsulant, and an opening extending through the first redistribution structure and exposing the optical coupler.

Abstract: A semiconductor device includes an interposer disposed on a substrate. A first major surface of the interposer faces the substrate. A system on a chip is disposed on a second major surface of the interposer. The second major surface of the interposer opposes the first major surface of the interposer. A plurality of first passive devices is disposed in the first major surface of the interposer. A plurality of second passive devices is disposed on the second major surface of the interposer. The second passive devices are different devices than the first passive devices.

Abstract: The present invention provides a photocuring device, comprising a housing and an ultraviolet (UV) light module, wherein the housing comprises an electroluminescent layer and/or a touch layer and a control module connected to the electroluminescent layer and/or the touch layer by an electrical means. The photocuring device of the invention not only features a low material cost and low production cost, but also allows its display interface and/or operation interface to be provided at any position of the housing of the photocuring device, without limitations in size, shape, or angle. Furthermore, the photocuring device of the invention allows its display interface and/or operation interface to be simplified as needed to facilitate operation and viewing by a manicurist or one who is receiving a manicure.

Abstract: A rectangular probe includes two broad side surfaces and two narrow side surfaces each parallel to a longitudinal direction of the rectangular probe. The rectangular probe includes a middle segment, a first connecting segment and a second connecting segment respectively extending from two opposite ends of the middle segment, a first contacting segment and a second contacting segment respectively extending from the first and second connecting segments, and a stroke structure arranged on the middle segment, the first contacting segment, or the second contacting segment. A longitudinal thru-hole of the stroke structure is formed by penetrating through the two broad side surfaces. Two transverse grooves of the stroke structure are respectively recessed in the two broad side surfaces. The two transverse grooves are configured to move in two directions away from each other so as to reduce a length of the rectangular probe.

Abstract: A three-dimensional (3D) signal transfer structure of a probe card device includes a transfer plate, a supporting frame, and a guiding plate. The transfer plate has a first surface and a second surface that is opposite to the first surface. The transfer plate includes a plurality of signal circuits each having a signal contact arranged on the first surface. The supporting frame is abutted against and fixed onto the first surface of the transfer plate. A portion of the first surface abutted against the supporting frame is arranged outside the signal contacts. The guiding plate has a plurality of thru-holes and is disposed on the supporting frame. The guiding plate, the supporting frame, and the transfer plate jointly and surroundingly define a receiving space, and the signal contacts of the transfer plate are arranged in the receiving space.

Abstract: The present invention discloses an AVS scanning method, wherein the AVS scanning method includes the steps of: mounting a system on chip (SoC) on a printed circuit board (PCB), and connecting the SoC to a storage unit; enabling the SoC to read a boot code from the storage unit, and executing the boot code to perform an AVS scanning operation on the SoC to determine a plurality of target supply voltages respectively corresponding to a plurality of operating frequencies of the SoC to establish an AVS look-up table; and storing the AVS look-up table into the SoC or the storage unit.

Abstract: A frequency adjusting apparatus used in a processing chip operated at an operation frequency according to a power is provided that includes a clock supplying circuit, a frequency division circuit and a control circuit. The clock supplying circuit outputs one of clock signals as a supplied clock signal. The frequency division circuit performs frequency division on the supplied clock signal according to a parameter to generate an output clock signal. The control circuit determines a combination of a selected clock signal and a value of the parameter for gradually increasing the frequency of the output clock signal during the increasing of the voltage value that passes through voltage value sections, wherein when the voltage value is determined to be larger than a second threshold value and when the voltage value sections correspond to higher voltage values, the selected clock signal has a higher frequency.

Abstract: A method for monitoring gas in a wafer processing system is provided. The method includes producing an exhaust flow in an exhausting conduit from a processing chamber. The method further includes placing a gas sensor in fluid communication with a detection point located in the exhausting conduit via a sampling tube that passes through a through hole formed on the exhausting conduit. The detection point is located away from the through hole. The method also includes detecting a gas condition at the detection point with the gas sensor. In addition, the method also includes analyzing the gas condition detected by the gas sensor to determine if the gas condition in the exhausting conduit is in a range of values.

Abstract: Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices are disclosed. In some embodiments, a cooling device for a semiconductor device includes a reservoir having a first plate and a second plate coupled to the first plate. A cavity is between the first plate and the second plate. A phase change material (PCM) is in the cavity. The cooling device is adapted to dissipate heat from a packaged semiconductor device.

Abstract: A method for generating light is provided. The method further includes measuring a period of time during which one of targets from a fuel target generator passes through two detection positions. The method also includes exciting the targets with a laser generator so as to generate plasma that emits light. In addition, the method includes adjusting at least one parameter of the laser generator according to the measured period of time, when the measured period of time is different from a predetermined value, wherein the parameter of the laser generator which is adjusted according to the measured period of time includes a frequency for generating a laser for illuminating the targets.

Abstract: A staggered probe card and a conductive probe are provided. The staggered probe card includes an upper guide board, a lower guide board spaced apart from the upper guide board, and a plurality of conductive probes arranged in rows and passing through the upper and lower guide boards. Each of the conductive probes has an elongated structure defining a longitudinal direction, and includes a bottom surface and two long side surfaces respectively connected to two edges of the bottom surface. A distance between the two long side surfaces gradually decreases in a tapering direction that extends away from the bottom surface. In two of the rows of the conductive probes adjacent to each other, any two long side surfaces respectively belonging to the two adjacent rows and arranged adjacent to each other have a lateral interval along a direction that is non-parallel to the arrangement direction.

Abstract: The present invention relates to a nail filing machine, an ultraviolet (UV) light sterilization container, and a nail filing system including the nail filing machine. The nail filing machine of the present invention comprises a pen-shaped nail filing device, a master device and a rotation speed-adjustable motor. The nail filing machine of the present invention is convenient for a user (i.e., a manicurist) to use for a long time, is easy to carry in use, has a UV light sterilization function, and can record the working mode of the user, thereby effectively improving the operability of the nail filing machine.

Abstract: A method of controlling a droplet illumination module/droplet detection module system of an extreme ultraviolet (EUV) radiation source includes irradiating a target droplet with light from a droplet illumination module and detecting light reflected and/or scattered by the target droplet. The method includes determining whether an intensity of the detected light is within an acceptable range. In response to determining that the intensity of the detected light is not within the acceptable range, a parameter of the droplet illumination module is automatically adjusted to set the intensity of the detected light within the acceptable range.

Abstract: A package structure includes a first semiconductor die, an insulating encapsulant, a plurality of first through insulator vias, a plurality of second through insulator vias, and a redistribution layer. The insulating encapsulant is encapsulating the first semiconductor die. The first through insulator vias are located in a central area of the insulating encapsulant surrounding the first semiconductor die. The second through insulator vias are located in a peripheral area of the insulating encapsulant surrounding the plurality of first through insulator vias located in the central area, wherein an aspect ratio of the plurality of second through insulator vias is greater than an aspect ratio of the plurality of first through insulator vias. The redistribution layer is disposed on the insulating encapsulant and electrically connected to the first semiconductor die, the plurality of first through insulator vias and the plurality of second through insulator vias.

Abstract: The present invention provides an exchangeable-battery photocuring device, comprising a supporting frame, having a plurality of walls, wherein the plurality of walls constitutes a chamber having at least one opening; a UV LED module, disposed on the supporting frame; a outer housing, having an external opening corresponding to the opening of the supporting frame; a control module; an exchangeable battery module, disposed on the supporting frame, wherein the exchangeable battery module comprises a battery holder and a battery, and the exchangeable battery module is electrically connected to the control module, and a handle. The present invention applying an exchangeable battery module achieves that the photocuring device is used without being constrained by location and space. Furthermore, the present invention also provides an exchangeable-battery photocuring device with a slidable lid and a portable battery photocuring device with a slidable lid.