Abstract: The present invention provides a slow-start photocuring device, comprising: a housing, an ultraviolet (UV) light-emitting diode (LED) module, and a switch control module. The housing has an inner side provided with an internal cavity, wherein the inner side of the housing is further provided with one or a plurality of openings on one or two sides of the internal cavity. The UV LED module is provided around the internal cavity, wherein the UV LED module has a light-emitting side facing the internal cavity. The switch control module is connected to the UV LED module, wherein the switch control module includes a signal modulator, the signal modulator activates a buffer mode when receiving a trigger signal, and the UV LED module in the buffer mode outputs light of a plurality of brightness levels sequentially according to an output signal of the signal modulator.

Abstract: A multi-terminal inductor and method for forming the multi-terminal inductor are provided. In some embodiments, an interconnect structure is arranged over a semiconductor substrate. A passivation layer is arranged over the interconnect structure. A first magnetic layer is arranged over the passivation layer, and a conductive wire laterally extends from a first input/output (I/O) bond structure at a first location to a second I/O bond structure at a second location. A third I/O bond structure branches off of the conductive wire at a third location between the first location and the second location. A connection between the third I/O bond structure and the first I/O bond structure has a first inductance. Alternatively, a connection between the first I/O bond structure and the second I/O bond structure has a second inductance different than the first inductance.

Abstract: A probe carrier of a probe card device includes an upper die unit, a lower die unit, a spacer sandwiched between the upper and lower die units, and an impedance adjusting member. The upper die unit includes a first die, a second die spaced apart from the first die, and a flexible board disposed on the second die and arranged away from the first die. The flexible board includes a plurality of penetrating holes and a circuit layer. The impedance adjusting member is disposed on the flexible board and is electrically coupled to the circuit layer. The circuit layer includes at least one plated wall arranged in at least one of the penetrating holes, a part of the flexible board having the at least one plated wall is separable from the second die by receiving an internal force.

Abstract: A probe card device includes an upper die unit, a lower die unit, a spacer sandwiched between the upper and lower die units, an impedance adjusting member, and conductive probes. The upper die unit includes a first die and a second die spaced apart from the first die. The first die has a penetrating hole, and the second die has a circuit layer. The impedance adjusting member is disposed on the second die and is electrically coupled to the circuit layer. Each of the conductive probes passes through the upper die unit, the spacer, and the lower die unit. At least one of the conductive probes includes an upper contacting segment protruding from the upper die unit and an extending arm connected to the upper contacting segment. The extending arm is abutted against the circuit layer by passing through the penetrating hole.

Abstract: Disclosed are a device conducive to reduction of parasitic inductance and a method for circuit design and assembly; the device and method cause less parasitic inductance and are good for circuit performance. The device includes an integrated circuit of ball grid array packaging (BGA IC), a printed circuit board (PCB), and an electronic component. The BGA IC includes solder balls including at least one target ball. The PCB is electrically connected to the BGA IC via the solder balls. The electronic component is set between the BGA IC and the PCB and electrically connected to the at least one target ball, in which the height of the electronic component is lower than the stand-off height of each of the solder balls.

Abstract: A method for operating a semiconductor apparatus includes generating a plurality of target droplets, deforming the target droplets into a plurality of target plumes respectively, changing an orientation of at least one of the target plumes, and generating a plurality of EUV radiations from the target plumes respectively. At least one of the EUV radiations irradiates an area on the light collector different from other EUV radiations in response to the orientation of the at least one of the target plumes.

Abstract: A method of assembly calibration for a multi-camera system is disclosed. The method comprises receiving at least two images respectively captured by at least two cameras in different angle of views, performing image transformation for aligning the received images which is optional, performing image motion estimation on an overlapping region of the images, for obtaining correspondence between the images with a plurality of motion vectors, wherein the plurality of motion vectors is used for indicating geometry relations between the images, performing dominant vector calculation according to the plurality of motion vectors, to obtain a dominant motion vector in region of interest (ROI) of the overlapping region, and calculating calibration parameters according to the obtained dominant motion vector, performing image correction according to the calibration parameters, to obtain a correct panoramic image covering the whole interested areas.

Abstract: The present invention provides an exchangeable-battery photocuring device, comprising a supporting frame, having a plurality of walls, wherein the plurality of walls constitutes a chamber having at least one opening; a UV LED module, disposed on the supporting frame; a outer housing, having an external opening corresponding to the opening of the supporting frame; a control module; an exchangeable battery module, disposed on the supporting frame, wherein the exchangeable battery module comprises a battery holder and a battery, and the exchangeable battery module is electrically connected to the control module, and a handle. The present invention applying an exchangeable battery module achieves that the photocuring device is used without being constrained by location and space. Furthermore, the present invention also provides an exchangeable-battery photocuring device with a slidable lid and a portable battery photocuring device with a slidable lid.

Abstract: A method of adaptive image stitching for an image stitching device is disclosed. The method comprises receiving at least two images respectively captured by at least two cameras in different angle of views, from the at least two cameras, performing image motion estimation on an overlapping region of the two images, to obtain correspondence between two images with a plurality of motion vectors, wherein the plurality of motion vectors is used for indicating a geometry relation between the two images, performing dominant vector calculation according to the plurality of motion vectors of the image motion estimation, for obtaining a dominant motion vector in region of interest (ROI) of the overlapping region, and stitching the two images into a single seamless image with a stitching radius calculated according to the dominant motion vector.

Abstract: A semiconductor device includes a substrate, a shallow trench isolation (STI) structure, a first source/drain, a second source/drain, and an isolation dielectric. The substrate has a semiconductor fin. The STI structure surrounds the semiconductor fin. The first source/drain is embedded in the semiconductor fin. The second source/drain is embedded in the semiconductor fin. The isolation dielectric is between the first and second source/drains and extending into the semiconductor fin. An upper surface of the STI structure is free from coverage of the isolation dielectric.

Abstract: A method and a system for diagnosing remaining lifetime of storages in a data center are disclosed. The method includes the steps of: a) sequentially and periodically collecting operating attributes of failed storages along with time-to-fail records of the failed storages in a data center; b) grouping the operating attributes collected at the same time or fallen in a continuous period of time so that each group has the same number of operating attributes; c) sequentially marking a time tag for the groups of operating attributes; d) generating a trend model of remaining lifetime of the storages from the operating attributes and time-to-fail records by ML and/or DL algorithm(s) with the groups of operating attributes and time-to-fail records fed according to the order of the time tags; and e) inputting a set of operating attributes of a currently operating storage into the trend model to calculate a remaining lifetime therefor.

Abstract: A probe card testing device includes a testing circuit board, a signal transmission board, an electrical connecting module, and a probe head. The testing circuit board has metal pads spaced apart from each other. The signal transmission board has internal pads arranged on a bottom surface thereof and spaced apart from each other. The electrical connecting module includes a spacer having thru-holes and elastic arms positioned on the spacer. The spacer is sandwiched between the testing circuit board and the signal transmission board. The metal pads respectively face the internal pads through the thru-holes. A part of each elastic arm is arranged in one of the thru-holes, and is detachably compressed by one of the metal pads and the corresponding internal pad so as to be elastically deformed to establish an electrical transmission path. The probe head is disposed on a top surface of the signal transmission board.

Abstract: A reinforced tubing comprising a shaft, a tubular body, and two or more reinforcing members is provided. The shaft has a lumen extending from a proximal port to a distal port having an inner and outer polymer layer. At least a portion of the shaft includes a tubular body and a tubular body reinforced by two or more reinforcing members. A chemical and heat treatment is performed to the two or more reinforcing members, forming an antibacterial surface thereon. A method of making a tubular body for a reinforced tubing shaft is provided. The method comprises providing two or more reinforcing members, providing a reinforced tubing mold and an extruder operatively associated therewith, attaching the two or more reinforcing members to the reinforced tubing mold, and extruding a polymer material into the reinforced tubing mold, wherein the polymer material surrounds the two or more reinforcing members forming the reinforced tubing.

Abstract: A radiation source apparatus is provided. The radiation source apparatus includes a chamber, a target droplet generator, an exhaust module, a measuring device, and a controller. The target droplet generator is configured to provide a plurality of target droplets to the chamber. The exhaust module is configured to extract debris corresponding to the target droplets out of the chamber according to a first gas flow rate. The measuring device is configured to measure concentration of the debris in the chamber. The controller is configured to adjust the first gas flow rate according to the measured concentration of the debris.

Abstract: A multi-terminal inductor and method for forming the multi-terminal inductor are provided. In some embodiments, an interconnect structure is arranged over a semiconductor substrate. A passivation layer is arranged over the interconnect structure. A first magnetic layer is arranged over the passivation layer, and a conductive wire laterally extends from a first input/output (I/O) bond structure at a first location to a second I/O bond structure at a second location. A third I/O bond structure branches off of the conductive wire at a third location between the first location and the second location. A connection between the third I/O bond structure and the first I/O bond structure has a first inductance. Alternatively, a connection between the first I/O bond structure and the second I/O bond structure has a second inductance different than the first inductance.

Abstract: A method for generating light is provided. The method further includes measuring a period of time during which one of targets from a fuel target generator passes through two detection positions. The method also includes exciting the targets with a laser generator so as to generate plasma that emits light. In addition, the method includes adjusting at least one parameter of the laser generator according to the measured period of time, when the measured period of time is different from a predetermined value, wherein the parameter of the laser generator which is adjusted according to the measured period of time includes a frequency for generating a laser for illuminating the targets.

Abstract: An apparatus for generating extreme ultraviolet (EUV) radiation comprises a droplet generator, an excitation laser source, an energy detector, and a feedback controller. The droplet generator is configured to generate target droplets. The excitation laser is configured to generate a pre-pulse and a main pulse to convert the target droplets to plasma by heating. The energy detector is configured to measure a variation in EUV energy generated when the target droplets are converted to plasma. The feedback controller is configured to adjust a time delay between a subsequent pre-pulse and main pulse generated by the excitation laser based on the variation in EUV energy generated by a given main pulse.

Abstract: An apparatus for generating extreme ultraviolet (EUV) radiation includes a droplet generator configured to generate target droplets. An excitation laser is configured to heat the target droplets using excitation pulses to convert the target droplets to plasma. An energy detector is configured to measure a variation in EUV energy generated when the target droplets are converted to plasma. A feedback controller is configured to adjust parameters of the droplet generator and/or the excitation laser based on the variation in EUV energy.

Abstract: A device and method of manufacture is provided that utilize a dummy pad feature adjacent contact pads. The contact pads may be contact pads in an integrated fan-out package in which a molding compound is placed along sidewalls of a die and the contact pads extend over the die and the molding compound. The contact pads are electrically coupled to the die using one or more redistribution layers. The dummy pad features are electrically isolated from the contact pads. In some embodiments, the dummy pad features partially encircle the contact pads and are located in a corner region of the molding compound, a corner region of the die, and/or an interface region between an edge of the die and the molding compound.