Patents by Inventor Chieh Hsieh

Chieh Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11227851
    Abstract: A control device and a circuit board are provided. The control device can cooperate with the circuit board, and includes a ball grid array. The ball grid array includes a plurality of power balls and a plurality of ground balls, which are jointly arranged in a ball region. The power balls and the ground balls are respectively divided into a plurality of power ball groups and a plurality of ground ball groups. One of the ground ball groups includes two ground balls and is adjacent to a power ball group. A ball pitch between the two ground balls is greater than that between one of the power balls and one of the ground balls adjacent to each other. The circuit board includes a contact pad array corresponding to the ball grid array of the control device so that the control device can be disposed on the circuit board.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: January 18, 2022
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Chao-Min Lai, Ping-Chia Wang, Han-Chieh Hsieh, Tang-Hung Chang
  • Publication number: 20220011346
    Abstract: A probe card device and a fan-out probe thereof are provided. The fan-out probe includes a stroke segment, a fan-out segment, and a testing segment. The stroke segment is in a straight shape defining a longitudinal direction, and the stroke segment has two end portions. The stroke segment is bendable when the two end portions are respectively applied with forces along two opposite directions. The fan-out segment and the testing segment are respectively connected to the two end portions of the stroke segment. The fan-out segment has a fixing point arranged away from the stroke segment, and the testing segment has an abutting point arranged away from the stroke segment. Along a fan-out direction perpendicular to the longitudinal direction, the fixing point is spaced apart from the abutting point by a fan-out distance.
    Type: Application
    Filed: September 14, 2020
    Publication date: January 13, 2022
    Inventors: WEN-TSUNG LEE, Hsun-Tai Wei, KAI-CHIEH HSIEH, WEI-JHIH SU
  • Patent number: 11224115
    Abstract: A method for extreme ultraviolet (EUV) lithography includes loading an EUV mask to a lithography system; loading a wafer to the lithography system, wherein the wafer includes a resist layer sensitive to EUV radiation; producing EUV radiation by heating target plumes using a radiation source; and exposing the resist layer to the EUV radiation while monitoring a speed of the target plumes.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: January 11, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chun-Chia Hsu, Chieh Hsieh, Shang-Chieh Chien, Li-Jui Chen, Po-Chung Cheng, Tzung-Chi Fu, Bo-Tsun Liu
  • Publication number: 20220003659
    Abstract: A system, an apparatus, and a method are provided for a modular flow cytometer with a compact size. In one embodiment, the modular flow cytometry system includes the following: a laser system for emitting laser beams; a flow cell assembly positioned to receive the laser beams at an interrogation region of a fluidics stream where fluoresced cells scatter the laser beams into fluorescent light; a fiber assembly positioned to collect the fluorescent light; and a compact light detection module including a first image array having a transparent block, a plurality of micro-mirrors in a row coupled to a first side of the transparent block, and a plurality of filters in a row coupled to a second side of the transparent block opposite the first side.
    Type: Application
    Filed: July 14, 2021
    Publication date: January 6, 2022
    Applicant: CYTEK BIOSCIENCES, INC.
    Inventors: Ming Yan, Yung-Chieh Hsieh, David Vrane, Eric Chase, Wenbin Jiang
  • Patent number: 11209461
    Abstract: A probe card device and a neck-like probe thereof are provided. The neck-like probe includes a conductive pin and a ring-shaped insulator. The conductive pin includes a stroke segment and two end segments extending from the stroke segment. The stroke segment has two broad side surfaces and two narrow side surfaces, and each of the broad side surfaces has a long slot extending from one of the narrow side surfaces to the other one. The two long slots have a minimum distance therebetween that is 75%-95% of a maximum distance between the two broad side surfaces. The ring-shaped insulator surrounds a portion of the conductive pin having the two long slots, and a portion of the neck-like probe corresponding in position to a part of the ring-shaped insulator on the two broad side surfaces has a thickness that is 85%-115% of the maximum distance.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: December 28, 2021
    Assignee: CHUNGHWA PRECISION TEST TECH. CO., LTD.
    Inventors: Wen-Tsung Lee, Hsun-Tai Wei, Kai-Chieh Hsieh, Wei-Jhih Su
  • Patent number: 11204371
    Abstract: A probe card device and a directivity probe thereof are provided. The directivity probe having an elongated shape includes a conductive pin and a ring-shaped insulator. The conductive pin includes a stroke segment and two end segments respectively extending from the stroke segment. The stroke segment has two broad side surfaces and two narrow side surfaces, and has only one transverse slot that is recessed in one of the two broad side surfaces and that extends from one of the two narrow side surfaces to the other narrow side surface. The transverse groove has a maximum depth that is 1%-10% of a maximum distance between the two broad side surfaces. The stroke segment of the directivity probe can be bent by applying a force to the two end segments, and an inflection point of the bent stroke segment is located in the transverse slot.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: December 21, 2021
    Assignee: CHUNGHWA PRECISION TEST TECH. CO., LTD.
    Inventors: Wen-Tsung Lee, Hsun-Tai Wei, Kai-Chieh Hsieh, Wei-Jhih Su
  • Publication number: 20210375840
    Abstract: A package includes a first package and a second package over and bonded to the first package. The first package includes a first device die, and a first encapsulant encapsulating the first device die therein. The second package includes an Independent Passive Device (IPD) die, and a second encapsulant encapsulating the IPD die therein. The package further includes a power module over and bonded to the second package.
    Type: Application
    Filed: August 9, 2021
    Publication date: December 2, 2021
    Inventors: Yu-Chia Lai, Cheng-Chieh Hsieh, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu
  • Publication number: 20210366833
    Abstract: A package structure including a first semiconductor die, a second semiconductor die, first conductive pillars and a first insulating encapsulation is provided. The first semiconductor die includes a semiconductor substrate, an interconnect structure and a first redistribution circuit structure. The semiconductor substrate includes a first portion and a second portion disposed on the first portion. The interconnect structure is disposed on the second portion, the first redistribution circuit structure is disposed on the interconnect structure, and the lateral dimension of the first portion is greater than the lateral dimension of the second portion. The second semiconductor die is disposed on the first semiconductor die. The first conductive pillars are disposed on the first redistribution circuit structure of the first semiconductor die. The first insulating encapsulation is disposed on the first portion.
    Type: Application
    Filed: May 22, 2020
    Publication date: November 25, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo, Hao-Yi Tsai, Ming-Hung Tseng, Yen-Liang Lin, Chun-Ti Lu, Chung-Ming Weng
  • Patent number: 11175312
    Abstract: A staggered probe card and a conductive probe are provided. The staggered probe card includes an upper guide board, a lower guide board spaced apart from the upper guide board, and a plurality of conductive probes arranged in rows and passing through the upper and lower guide boards. Each of the conductive probes has an elongated structure defining a longitudinal direction, and includes a bottom surface and two long side surfaces respectively connected to two edges of the bottom surface. A distance between the two long side surfaces gradually decreases in a tapering direction that extends away from the bottom surface. In two of the rows of the conductive probes adjacent to each other, any two long side surfaces respectively belonging to the two adjacent rows and arranged adjacent to each other have a lateral interval along a direction that is non-parallel to the arrangement direction.
    Type: Grant
    Filed: January 7, 2020
    Date of Patent: November 16, 2021
    Assignee: CHUNGHWA PRECISION TEST TECH. CO., LTD.
    Inventors: Kai-Chieh Hsieh, Hsiao-Kang Li, Ying-Ming Tiao, Wei-Jhih Su
  • Patent number: 11175313
    Abstract: A thin-film probe card and a test module thereof are provided. The test module includes a carrying unit, a plurality of vertical probes fixed in position by the carrying unit, an elastic cushion disposed on the carrying unit, and a thin sheet. The thin sheet includes a carrier partially disposed on the elastic cushion, a plurality of signal circuits disposed on the carrier, and a plurality of electrically conductive protrusions that are respectively formed on the signal circuits. An end of the vertical probes is arranged at an inner side of the electrically conductive protrusions and is coplanar with free ends of the electrically conductive protrusions.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: November 16, 2021
    Assignee: CHUNGHWA PRECISION TEST TECH. CO., LTD.
    Inventors: Wen-Tsung Lee, Hsun-Tai Wei, Kai-Chieh Hsieh, Chao-Chiang Liu
  • Publication number: 20210349396
    Abstract: A photolithography system utilizes tin droplets to generate extreme ultraviolet radiation for photolithography. The photolithography system irradiates the droplets with a laser. The droplets become a plasma and emit extreme ultraviolet radiation. The photolithography system senses contamination of a collector mirror by the tin droplets and adjusts the flow of a buffer fluid to reduce the contamination.
    Type: Application
    Filed: March 5, 2021
    Publication date: November 11, 2021
    Inventors: Tai-Yu CHEN, Sagar Deepak KHIVSARA, Kuo-An LIU, Chieh HSIEH, Shang-Chieh CHIEN, Gwan-Sin CHANG, Kai Tak LAM, Li-Jui CHEN, Heng-Hsin LIU, Chung-Wei WU, Zhiqiang WU
  • Publication number: 20210349129
    Abstract: A thin-film probe card and a test module thereof are provided. The test module includes a carrying unit, a plurality of vertical probes fixed in position by the carrying unit, an elastic cushion disposed on the carrying unit, and a thin sheet. The thin sheet includes a carrier partially disposed on the elastic cushion, a plurality of signal circuits disposed on the carrier, and a plurality of electrically conductive protrusions that are respectively formed on the signal circuits. An end of the vertical probes is arranged at an inner side of the electrically conductive protrusions and is coplanar with free ends of the electrically conductive protrusions.
    Type: Application
    Filed: September 15, 2020
    Publication date: November 11, 2021
    Inventors: WEN-TSUNG LEE, Hsun-Tai Wei, KAI-CHIEH HSIEH, CHAO-CHIANG LIU
  • Patent number: 11169076
    Abstract: In one embodiment, a flow cytometer is disclosed having a compact light detection module. The compact light detection module includes an image array with a transparent block, a plurality of micro-mirrors in a row coupled to a first side of the transparent block, and a plurality of filters in a row coupled to a second side of the transparent block opposite the first side. Each of the plurality of filters reflects light to one of the plurality of micro-mirrors and passes light of a differing wavelength range and each of the plurality of micro-mirrors reflects light to one of the plurality of filters, such that incident light into the image array zigzags back and forth between consecutive filters of the plurality of filters and consecutive micro-mirrors of the plurality of micro-mirrors. A radius of curvature of each of the plurality of micro-mirrors images the fiber aperture onto the odd filters and collimates the light beam on the even filters.
    Type: Grant
    Filed: July 25, 2017
    Date of Patent: November 9, 2021
    Assignee: Cytek Biosciences, Inc.
    Inventors: Ming Yan, Yung-Chieh Hsieh, David Vrane, Eric Chase
  • Publication number: 20210325430
    Abstract: A split thin-film probe card and an elastic module thereof are provided. The elastic module includes an elastic cushion and a thin-film sheet. The elastic cushion has a plurality of partition slots so as to define a plurality of independent elastic segments. The thin-film sheet includes a carrier, a plurality of signal circuits disposed on the carrier, and a plurality of conductive protrusions that are respectively formed on the signal circuits. The carrier has a plurality of grooves so as to divide the carrier into a plurality of action segments respectively disposed on the independent elastic segments. The signal circuits are respectively disposed on the action segments. When any one of the conductive protrusions is pressed, only the corresponding independent elastic segment is deformed through the corresponding signal circuit and the corresponding action segment.
    Type: Application
    Filed: September 16, 2020
    Publication date: October 21, 2021
    Inventors: WEN-TSUNG LEE, Hsun-Tai Wei, KAI-CHIEH HSIEH, CHAO-CHIANG LIU
  • Patent number: 11153959
    Abstract: An apparatus for generating extreme ultraviolet (EUV) radiation comprises a droplet generator, an excitation laser source, an energy detector, and a feedback controller. The droplet generator is configured to generate target droplets. The excitation laser is configured to generate a pre-pulse and a main pulse to convert the target droplets to plasma by heating. The energy detector is configured to measure a variation in EUV energy generated when the target droplets are converted to plasma. The feedback controller is configured to adjust a time delay between a subsequent pre-pulse and main pulse generated by the excitation laser based on the variation in EUV energy generated by a given main pulse.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: October 19, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chun-Chia Hsu, Po-Chung Cheng, Li-Jui Chen, Shang-Chieh Chien, Yen-Shuo Su, Chieh Hsieh, Chi Yang
  • Patent number: 11139249
    Abstract: A packaged semiconductor device including a first die attached to a redistribution structure, a second die attached to the first die, and a molding compound surrounding the first die and the second die and a method of forming the same are disclosed. In an embodiment, a method includes forming first conductive pillars over and electrically coupled to a first redistribution structure; attaching a first die to the first redistribution structure, the first die including second conductive pillars; attaching a second die to the first die adjacent the second conductive pillars; encapsulating the first conductive pillars, the first die, and the second die with an encapsulant; forming a second redistribution structure over the encapsulant, the first conductive pillars, the first die, and the second die; and bonding a third die to the first redistribution structure.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: October 5, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Hung-Yi Kuo, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Yuan Yu
  • Publication number: 20210305164
    Abstract: A semiconductor device includes a stacked structure, first conductive terminals and second conductive terminals. The stacked structure includes a first semiconductor component having a first area and a second semiconductor component stacked on the first semiconductor component and having a second area smaller than the first area, wherein an extending direction of the first area and an extending direction of the second area are perpendicular to a stacking direction of the first semiconductor component and the second semiconductor component. The first conductive terminals are located on the stacked structure, electrically coupled to the first semiconductor component and aside of the second semiconductor component. The second conductive terminals are located on the stacked structure and electrically coupled to the second semiconductor component.
    Type: Application
    Filed: March 30, 2020
    Publication date: September 30, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ming-Hung Tseng, Cheng-Chieh Hsieh, Hao-Yi Tsai
  • Publication number: 20210292187
    Abstract: A method for making iridium oxide nanoparticles includes dissolving an iridium salt to obtain a salt-containing solution, mixing a complexing agent with the salt-containing solution to obtain a blend solution, and adding an oxidating agent to the blend solution to obtain a product mixture. A molar ratio of a complexing compound of the complexing agent to the iridium salt is controlled in a predetermined range so as to permit the product mixture to include iridium oxide nanoparticles.
    Type: Application
    Filed: July 27, 2020
    Publication date: September 23, 2021
    Inventors: Pu-Wei Wu, Yi-Chieh Hsieh, Han-Yi Wang, Kuang-Chih Tso, Tzu-Ying Chan
  • Publication number: 20210289912
    Abstract: The present invention provides a wirelessly connected manicure machine, which includes a housing, a control module, an input interface and a wireless communication module. The housing has an internal cavity, an opening corresponding to one side of the internal cavity, and one or more ultraviolet light emitting diode (UV LED) modules provided in the internal cavity. The input interface is connected to the control module to input a corresponding trigger instruction to the control module. The control module is connected to the UV LED module. The control module is also connected to the wireless communication module to send and receive signals through the wireless communication module.
    Type: Application
    Filed: March 12, 2021
    Publication date: September 23, 2021
    Inventors: WAN-CHIEH HSIEH, HAO-HONG CIOU, LIN-YU SIA, CHUN-CHING LIU
  • Publication number: 20210288040
    Abstract: A method includes bonding a first device die to a second device die, encapsulating the first device die in a first encapsulant, performing a backside grinding process on the second device die to reveal through-vias in the second device die, and forming first electrical connectors on the second device die to form a package. The package includes the first device die and the second device die. The method further includes encapsulating the first package in a second encapsulant, and forming an interconnect structure overlapping the first package and the second encapsulant. The interconnect structure comprises second electrical connectors.
    Type: Application
    Filed: July 9, 2020
    Publication date: September 16, 2021
    Inventors: Chen-Hua Yu, Hung-Yi Kuo, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Yuan Yu, Ming Hung Tseng