Abstract: A board-like connector, a single-arm bridge of a board-like connector, and a wafer testing assembly are provided. The board-like connector includes a plurality of single-arm bridges spaced apart from each other and an insulating layer. Each of the single-arm bridges includes a carrier, a cantilever extending from and being coplanar with the carrier, an abutting column, and an abutting end portion, the latter two of which extend from the cantilever and are respectively arranged at two opposite sides of the cantilever. The insulating layer connects the carriers of the single-arm bridges, and the abutting column of each of the single-arm bridges protrudes from the insulating layer. The abutting column and the abutting end portion of each of the single-arm bridges are configured to abut against two boards, respectively.

Abstract: A board-like connector, a dual-arm bridge of a board-like connector, and a wafer testing assembly are provided. The board-like connector includes a plurality of dual-arm bridges spaced apart from each other and an insulating layer. Each of the dual-arm bridges includes a carrier, a first cantilever, a second cantilever, a first abutting column, and a second abutting column, the latter two of which extend from the first and second cantilevers along two opposite directions. The first cantilever and the second cantilever extend from and are coplanar with the carrier. The insulating layer connects the carriers of the dual-arm bridges. The first abutting column and second abutting column of each of the dual-arm bridges respectively protrude from two opposite sides of the insulating layer, and are configured to abut against two boards, respectively.

Abstract: A board-like connector, a dual-ring bridge of a board-like connector, and a wafer testing assembly are provided. The board-like connector includes a plurality of dual-ring bridges spaced apart from each other and an insulating layer. Each of the dual-ring bridges includes two carrying rings, two cantilevers respectively extending from and being coplanar with the two carrying rings, two abutting columns respectively extending from the two cantilevers along two opposite directions, and a bridging segment that connects the two carrying rings. The insulating layer connects the two carrying rings of the dual-ring bridges, and the two abutting columns of the dual-ring bridges respectively protrude from two opposite sides of the insulating layer. The two abutting columns of each of the dual-ring bridges are configured to be respectively abutted against two boards.

Abstract: A resistance system for a rowing machine has a mounting bracket, a housing assembly, a paddle wheel, a driving assembly and a restoring assembly. The housing assembly is mounted on the mounting bracket and includes a liquid tank for storing liquid. The driving assembly is connected to the paddle wheel and drives the paddle wheel to rotate in a direction only. The restoring assembly is connected to a strip hub of the driving assembly and is able to drive the strip hub to rotate in a reverse direction. The resistance system for the rowing machine has simplified structure. Therefore, it is easy to assemble to the resistance system, and manufacturing cost of the resistance system can be decreased. In addition, a service life of the resistance system as well as the rowing machine can be increased.

Abstract: A system, an apparatus, and a method are provided for a modular flow cytometer with a compact size. In one embodiment, the modular flow cytometry system includes the following: a laser system for emitting laser beams; a flow cell assembly positioned to receive the laser beams at an interrogation region of a fluidics stream where fluoresced cells scatter the laser beams into fluorescent light; a fiber assembly positioned to collect the fluorescent light; and a compact light detection module including a first image array having a transparent block, a plurality of micro-mirrors in a row coupled to a first side of the transparent block, and a plurality of filters in a row coupled to a second side of the transparent block opposite the first side.

Abstract: A split thin-film probe card and an elastic module thereof are provided. The elastic module includes an elastic cushion and a thin-film sheet. The elastic cushion has a plurality of partition slots so as to define a plurality of independent elastic segments. The thin-film sheet includes a carrier, a plurality of signal circuits disposed on the carrier, and a plurality of conductive protrusions that are respectively formed on the signal circuits. The carrier has a plurality of grooves so as to divide the carrier into a plurality of action segments respectively disposed on the independent elastic segments. The signal circuits are respectively disposed on the action segments. When any one of the conductive protrusions is pressed, only the corresponding independent elastic segment is deformed through the corresponding signal circuit and the corresponding action segment.

Abstract: An apparatus for generating extreme ultraviolet (EUV) radiation includes a droplet generator configured to generate target droplets. An excitation laser is configured to heat the target droplets using excitation pulses to convert the target droplets to plasma. An energy detector is configured to measure a variation in EUV energy generated when the target droplets are converted to plasma. A feedback controller is configured to adjust parameters of the droplet generator and/or the excitation laser based on the variation in EUV energy.

Abstract: A frequency adjusting apparatus used in a processing chip operated at an operation frequency according to a power is provided that includes a clock supplying circuit, a frequency division circuit and a control circuit. The clock supplying circuit outputs one of clock signals as a supplied clock signal. The frequency division circuit performs frequency division on the supplied clock signal according to a parameter to generate an output clock signal. The control circuit determines a combination of a selected clock signal and a value of the parameter for gradually increasing the frequency of the output clock signal during the increasing of the voltage value that passes through voltage value sections, wherein when the voltage value is determined to be larger than a second threshold value and when the voltage value sections correspond to higher voltage values, the selected clock signal has a higher frequency.

Abstract: A package structure includes a first semiconductor die, an insulating encapsulant, a plurality of first through insulator vias, a plurality of second through insulator vias, and a redistribution layer. The insulating encapsulant is encapsulating the first semiconductor die. The first through insulator vias are located in a central area of the insulating encapsulant surrounding the first semiconductor die. The second through insulator vias are located in a peripheral area of the insulating encapsulant surrounding the plurality of first through insulator vias located in the central area, wherein an aspect ratio of the plurality of second through insulator vias is greater than an aspect ratio of the plurality of first through insulator vias. The redistribution layer is disposed on the insulating encapsulant and electrically connected to the first semiconductor die, the plurality of first through insulator vias and the plurality of second through insulator vias.

Abstract: A package structure including a first semiconductor die, a second semiconductor die, first conductive pillars and a first insulating encapsulation is provided. The first semiconductor die includes a semiconductor substrate, an interconnect structure and a first redistribution circuit structure. The semiconductor substrate includes a first portion and a second portion disposed on the first portion. The interconnect structure is disposed on the second portion, the first redistribution circuit structure is disposed on the interconnect structure, and the lateral dimension of the first portion is greater than the lateral dimension of the second portion. The second semiconductor die is disposed on the first semiconductor die. The first conductive pillars are disposed on the first redistribution circuit structure of the first semiconductor die. The first insulating encapsulation is disposed on the first portion.

Abstract: A probe card device and a fence-like probe thereof are provided. The fence-like probe includes a stroke segment, a fan-out segment, and a testing segment. The stroke segment is in an elongated shape defining a longitudinal direction, and the stroke segment has two end portions and a plurality of penetrating slots that are arranged along a fan-out direction perpendicular to the longitudinal direction, so that the stroke segment is deformable to store an elastic force by being applied with a force. The fan-out segment and the testing segment are respectively connected to the two end portions of the stroke segment. The fan-out segment has a fixing point arranged away from the stroke segment, and the testing segment has an abutting point arranged away from the stroke segment. Along the fan-out direction, the fixing point is spaced apart from the abutting point by a fan-out distance.

Abstract: A control device and a circuit board are provided. The control device can cooperate with the circuit board, and includes a ball grid array. The ball grid array includes a plurality of power balls and a plurality of ground balls, which are jointly arranged in a ball region. The power balls and the ground balls are respectively divided into a plurality of power ball groups and a plurality of ground ball groups. One of the ground ball groups includes two ground balls and is adjacent to a power ball group. A ball pitch between the two ground balls is greater than that between one of the power balls and one of the ground balls adjacent to each other. The circuit board includes a contact pad array corresponding to the ball grid array of the control device so that the control device can be disposed on the circuit board.

Abstract: A probe card device and a fence-like probe thereof are provided. The fence-like probe includes a stroke segment, a fan-out segment, and a testing segment. The stroke segment is in an elongated shape defining a longitudinal direction, and the stroke segment has two end portions and a plurality of penetrating slots that are arranged along a fan-out direction perpendicular to the longitudinal direction, so that the stroke segment is deformable to store an elastic force by being applied with a force. The fan-out segment and the testing segment are respectively connected to the two end portions of the stroke segment. The fan-out segment has a fixing point arranged away from the stroke segment, and the testing segment has an abutting point arranged away from the stroke segment. Along the fan-out direction, the fixing point is spaced apart from the abutting point by a fan-out distance.

Abstract: A probe card device and a fan-out probe thereof are provided. The fan-out probe includes a stroke segment, a fan-out segment, and a testing segment. The stroke segment is in a straight shape defining a longitudinal direction, and the stroke segment has two end portions. The stroke segment is bendable when the two end portions are respectively applied with forces along two opposite directions. The fan-out segment and the testing segment are respectively connected to the two end portions of the stroke segment. The fan-out segment has a fixing point arranged away from the stroke segment, and the testing segment has an abutting point arranged away from the stroke segment. Along a fan-out direction perpendicular to the longitudinal direction, the fixing point is spaced apart from the abutting point by a fan-out distance.

Abstract: A method for extreme ultraviolet (EUV) lithography includes loading an EUV mask to a lithography system; loading a wafer to the lithography system, wherein the wafer includes a resist layer sensitive to EUV radiation; producing EUV radiation by heating target plumes using a radiation source; and exposing the resist layer to the EUV radiation while monitoring a speed of the target plumes.

Abstract: A system, an apparatus, and a method are provided for a modular flow cytometer with a compact size. In one embodiment, the modular flow cytometry system includes the following: a laser system for emitting laser beams; a flow cell assembly positioned to receive the laser beams at an interrogation region of a fluidics stream where fluoresced cells scatter the laser beams into fluorescent light; a fiber assembly positioned to collect the fluorescent light; and a compact light detection module including a first image array having a transparent block, a plurality of micro-mirrors in a row coupled to a first side of the transparent block, and a plurality of filters in a row coupled to a second side of the transparent block opposite the first side.

Abstract: A probe card device and a neck-like probe thereof are provided. The neck-like probe includes a conductive pin and a ring-shaped insulator. The conductive pin includes a stroke segment and two end segments extending from the stroke segment. The stroke segment has two broad side surfaces and two narrow side surfaces, and each of the broad side surfaces has a long slot extending from one of the narrow side surfaces to the other one. The two long slots have a minimum distance therebetween that is 75%-95% of a maximum distance between the two broad side surfaces. The ring-shaped insulator surrounds a portion of the conductive pin having the two long slots, and a portion of the neck-like probe corresponding in position to a part of the ring-shaped insulator on the two broad side surfaces has a thickness that is 85%-115% of the maximum distance.

Abstract: A probe card device and a directivity probe thereof are provided. The directivity probe having an elongated shape includes a conductive pin and a ring-shaped insulator. The conductive pin includes a stroke segment and two end segments respectively extending from the stroke segment. The stroke segment has two broad side surfaces and two narrow side surfaces, and has only one transverse slot that is recessed in one of the two broad side surfaces and that extends from one of the two narrow side surfaces to the other narrow side surface. The transverse groove has a maximum depth that is 1%-10% of a maximum distance between the two broad side surfaces. The stroke segment of the directivity probe can be bent by applying a force to the two end segments, and an inflection point of the bent stroke segment is located in the transverse slot.

Abstract: A package includes a first package and a second package over and bonded to the first package. The first package includes a first device die, and a first encapsulant encapsulating the first device die therein. The second package includes an Independent Passive Device (IPD) die, and a second encapsulant encapsulating the IPD die therein. The package further includes a power module over and bonded to the second package.

Abstract: A package structure including a first semiconductor die, a second semiconductor die, first conductive pillars and a first insulating encapsulation is provided. The first semiconductor die includes a semiconductor substrate, an interconnect structure and a first redistribution circuit structure. The semiconductor substrate includes a first portion and a second portion disposed on the first portion. The interconnect structure is disposed on the second portion, the first redistribution circuit structure is disposed on the interconnect structure, and the lateral dimension of the first portion is greater than the lateral dimension of the second portion. The second semiconductor die is disposed on the first semiconductor die. The first conductive pillars are disposed on the first redistribution circuit structure of the first semiconductor die. The first insulating encapsulation is disposed on the first portion.