Patents by Inventor Chieh Hsieh

Chieh Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Board-like connector, dual-ring bridge of board-like connector, and wafer testing assembly
    Patent number: 11561244
    Abstract: A board-like connector, a dual-ring bridge of a board-like connector, and a wafer testing assembly are provided. The board-like connector includes a plurality of dual-ring bridges spaced apart from each other and an insulating layer. Each of the dual-ring bridges includes two carrying rings, two cantilevers respectively extending from and being coplanar with the two carrying rings, two abutting columns respectively extending from the two cantilevers along two opposite directions, and a bridging segment that connects the two carrying rings. The insulating layer connects the two carrying rings of the dual-ring bridges, and the two abutting columns of the dual-ring bridges respectively protrude from two opposite sides of the insulating layer. The two abutting columns of each of the dual-ring bridges are configured to be respectively abutted against two boards.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: January 24, 2023
    Assignee: CHUNGHWA PRECISION TEST TECH. CO., LTD.
    Inventors: Kai-Chieh Hsieh, Chao-Chiang Liu, Meng-Chieh Cheng, Wei-Jhih Su
  • SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
    Publication number: 20230018511
    Abstract: A semiconductor package includes a redistribution structure, a supporting layer, a semiconductor device, and a transition waveguide structure. The redistribution structure includes a plurality of connectors. The supporting layer is formed over the redistribution structure and disposed beside and between the plurality of connectors. The semiconductor device is disposed on the supporting layer and bonded to the plurality of connectors, wherein the semiconductor device includes a device waveguide. The transition waveguide structure is disposed on the supporting layer adjacent to the semiconductor device, wherein the transition waveguide structure is optically coupled to the device waveguide.
    Type: Application
    Filed: July 16, 2021
    Publication date: January 19, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Hsiu-Jen Lin, Ming-Che Ho, Yu-Hsiang Hu, Chewn-Pu Jou, Cheng-Tse Tang
  • SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
    Publication number: 20220413399
    Abstract: A coating is included on one or more components of a lithography system. The coating reduces surface roughness of the one or more surfaces, increases flatness of the one or more surfaces, and/or increases uniformity of the one or more surfaces. The coating may be formed on the one or more surfaces using one or more of the techniques described herein. The coating is configured to reduce adhesion of target material particles to the one or more surfaces, is configured to resist buildup of target material particles on the one or more surfaces, is configured to provide resistance against oxidation of the one or more surfaces, is configured to resist thermal damage of the one or more surfaces, and/or is configured to enable the lithography system to operate at higher operating temperatures, among other examples.
    Type: Application
    Filed: April 14, 2022
    Publication date: December 29, 2022
    Inventors: Shih-Yu TU, Chieh HSIEH, Shang-Chieh CHIEN, Sheng-Kang YU, Li-Jui CHEN, Heng-Hsin LIU
  • PROCESSOR WITH ADJUSTABLE OPERATING FREQUENCY
    Publication number: 20220416789
    Abstract: The present invention provides a processor including a core circuit, a plurality of clock signal generation circuits, a multiplexer and a detection circuit is disclosed. The core circuit is supplied by a supply voltage. The plurality of clock signal generation circuits are configured to generate a plurality of clock signals with different frequencies, respectively, wherein a number of the plurality of clock signals is equal to or greater than three. The multiplexer is configured to receive the plurality of clock signals, and to select one of the plurality of clock signals to serve as an output clock signal according to a control signal, wherein the core circuit uses the output clock signal to serve as an operating clock. The detection circuit is configured to detect a level of the supply voltage received by the core circuit in a real-time manner, to generate the control signal.
    Type: Application
    Filed: March 15, 2022
    Publication date: December 29, 2022
    Applicant: Realtek Semiconductor Corp.
    Inventors: Chao-Min Lai, Han-Chieh Hsieh, Tang-Hung Chang, Hung-Wei Wang, Chun-Yi Kuo
  • Probe card device and dual-arm probe
    Patent number: 11536744
    Abstract: A probe card device and a dual-arm probe are provided. The dual-arm probe has a probe length, and includes a bifurcation end portion and a testing end portion. The dual-arm probe has two broad side surfaces respectively arranged on two opposite sides thereof. The dual-arm probe has a separation slot that is recessed from a bifurcation opening of the bifurcation end portion toward the testing end portion and that penetrates from one of the two broad side surfaces to the other one, so that two branch arms of the dual-arm probe are defined by the separation slot and are spaced apart from each other. The separation slot has a slot length being 50% to 90% of the probe length. In a cross section of the two branch arms, an area of any one of the two branch arms is 90% to 110% of that of the other one.
    Type: Grant
    Filed: October 1, 2021
    Date of Patent: December 27, 2022
    Assignee: CHUNGHWA PRECISION TEST TECH. CO., LTD.
    Inventors: Kai-Chieh Hsieh, Wei-Jhih Su, Hong-Ming Chen, Vel Sankar Ramachandran
  • Package structure and method of forming the same
    Patent number: 11532596
    Abstract: A package structure and method of forming the same are provided. The package structure includes a semiconductor unit, a package component and an underfill layer. The semiconductor structure unit includes a first semiconductor structure and a second semiconductor structure disposed as side by side, and an isolation region laterally between the first semiconductor structure and the second semiconductor structure. The isolation region vertically extends from a top surface to a bottom surface of the semiconductor structure unit. The semiconductor structure unit is disposed on and electrically connected to the package component. The underfill layer is disposed to fill a space between the semiconductor structure unit and the package component.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: December 20, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Yuan Yu, Hung-Yi Kuo, Cheng-Chieh Hsieh, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu
  • EUV lithography system and method for decreasing debris in EUV lithography system
    Patent number: 11531278
    Abstract: Extreme ultraviolet (EUV) lithography systems are provided. A EUV scanner is configured to perform a lithography exposure process in response to EUV radiation. A light source is configured to provide the EUV radiation to the EUV scanner. A measuring device is configured to measure concentration of debris caused by unstable target droplets in the chamber. A controller is configured to adjust a first gas flow rate and a second gas flow rate in response to the measured concentration of the debris and a control signal from the EUV scanner. A exhaust device is configured to extract the debris out of the chamber according to the first gas flow rate. A gas supply device is configured to provide a gas into the chamber according to the second gas flow rate. The control signal indicates the lithography exposure process is completed.
    Type: Grant
    Filed: March 18, 2021
    Date of Patent: December 20, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chi Yang, Ssu-Yu Chen, Shang-Chieh Chien, Chieh Hsieh, Tzung-Chi Fu, Bo-Tsun Liu, Li-Jui Chen, Po-Chung Cheng
  • Contact pad for semiconductor device
    Patent number: 11527502
    Abstract: A device and method of manufacture is provided that utilize a dummy pad feature adjacent contact pads. The contact pads may be contact pads in an integrated fan-out package in which a molding compound is placed along sidewalls of a die and the contact pads extend over the die and the molding compound. The contact pads are electrically coupled to the die using one or more redistribution layers. The dummy pad features are electrically isolated from the contact pads. In some embodiments, the dummy pad features partially encircle the contact pads and are located in a corner region of the molding compound, a corner region of the die, and/or an interface region between an edge of the die and the molding compound.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: December 13, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chang-Chia Huang, Tsung-Shu Lin, Cheng-Chieh Hsieh, Wei-Cheng Wu
  • DRINK CONTAINER AND LID ASSEMBLY THEREOF
    Publication number: 20220386796
    Abstract: A drink container and a lid assembly thereof are provided. The drink container includes a container body and the lid assembly, the lid assembly includes a first lid and a second lid, the first lid is screwed at an opening end of the container body through screw threads, the first lid has a top portion, and the top portion of the first lid has an opening portion. The second lid is disposed above the first lid, the second lid includes a plunger component, and a bottom portion of the plunger can be engaged with the opening portion and sealed with the opening portion. The plunger component is connected to a connection arm, and one side of the connection arm corresponding to the plunger component is pivotally connected to a pivot portion of the first lid. The plunger component has a second accommodating space configured to accommodate a straw.
    Type: Application
    Filed: January 18, 2022
    Publication date: December 8, 2022
    Inventors: Han-Chun Hsieh, Han-Chieh Hsieh
  • Die stacking structure and method forming same
    Patent number: 11521959
    Abstract: A method includes bonding a first device die to a second device die, encapsulating the first device die in a first encapsulant, performing a backside grinding process on the second device die to reveal through-vias in the second device die, and forming first electrical connectors on the second device die to form a package. The package includes the first device die and the second device die. The method further includes encapsulating the first package in a second encapsulant, and forming an interconnect structure overlapping the first package and the second encapsulant. The interconnect structure comprises second electrical connectors.
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: December 6, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chen-Hua Yu, Hung-Yi Kuo, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Yuan Yu, Ming Hung Tseng
  • OPTICAL INTERCONNECT STRUCTURE, PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
    Publication number: 20220382004
    Abstract: An optical interconnect structure including a base substrate, an optical waveguide, a first reflector, a second reflector, a dielectric layer, a first lens, and a second lens is provided. The optical waveguide is embedded in the base substrate. The optical waveguide includes a first end portion and a second end portion opposite to the first end portion. The first reflector is disposed between the base substrate and the first end portion of the optical waveguide. The second reflector is disposed between the base substrate and the second end portion of the optical waveguide. The dielectric layer covers the base substrate and the optical waveguide. The first lens is disposed on the dielectric layer and located above the first end portion of the optical waveguide. The second lens is disposed on the dielectric layer and located above the second end portion of the optical waveguide.
    Type: Application
    Filed: May 27, 2021
    Publication date: December 1, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Yu-Hsiang Hu, Chewn-Pu Jou, Feng-Wei Kuo
  • Crystal for flow cytometry with dual laser beams
    Patent number: 11513055
    Abstract: A crystal for flow cytometry with dual laser beams is disclosed. The crystal is a birefringent crystal comprising a material composition including a quartz mineral having a face side including a face angle of ninety degrees plus or minus one tenth of a degree; a wedge side that is substantially perpendicular to the face side, wherein the wedge side includes a wedge angle of two degrees plus or minus one tenth of a degree; and a major side that is substantially perpendicular to the face side and the wedge side. The major side includes a thickness of one and one-half millimeter plus or minus one tenth of a millimeter. A polarized light beam entering the birefringent crystal at an incident angle is separated into an ordinary light beam and an extraordinary light beam.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: November 29, 2022
    Assignee: Cytek Biosciences, Inc.
    Inventors: Ming Yan, Eric Chase, Yung-Chieh Hsieh
  • Probe card device and disposable adjustment film thereof
    Patent number: 11506685
    Abstract: A probe card device and a disposable adjustment film thereof are provided. The disposable adjustment film is integrally formed as a single one-piece structure, and includes a probe hole and a plurality of first slots that are parallel to each other. The disposable adjustment film defines two predetermined lines respectively extending from two opposite lateral edges thereof to the probe hole. The two predetermined lines respectively extend across the first slots. In a plane that the disposable adjustment film is located thereon, when the disposable adjustment film is applied with forces that act in opposite directions and that are parallel to any one of the first slots, the disposable adjustment film is broken into two abandoned films along the two predetermined lines.
    Type: Grant
    Filed: October 1, 2021
    Date of Patent: November 22, 2022
    Assignee: CHUNGHWA PRECISION TEST TECH. CO., LTD.
    Inventors: Kai-Chieh Hsieh, Wei-Jhih Su, Chao-Hui Tseng, Hsien-Yu Wang, Vel Sankar Ramachandran
  • Semiconductor device having photonic and electronic dies and an optical fiber assembly creating an air gap
    Patent number: 11506843
    Abstract: A semiconductor device including a singulated structure and an optical fiber assembly is provided. The singulated structure includes a photonic die, an electronic die connected to the photonic die and an optical element over the photonic die. The optical fiber assembly is disposed on a top of the singulated structure and includes a holder and an optical fiber structure. The holder keeps an air gap from the optical element. The optical fiber structure is carried by the holder and configured to be optically communicated with the photonic die through the optical element.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: November 22, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Che-Hsiang Hsu, Chewn-Pu Jou, Feng-Wei Kuo, Min-Hsiang Hsu
  • PROBE CARD DEVICE AND DISPOSABLE ADJUSTMENT FILM THEREOF
    Publication number: 20220365110
    Abstract: A probe card device and a disposable adjustment film thereof are provided. The disposable adjustment film is integrally formed as a single one-piece structure, and includes a probe hole and a plurality of first slots that are parallel to each other. The disposable adjustment film defines two predetermined lines respectively extending from two opposite lateral edges thereof to the probe hole. The two predetermined lines respectively extend across the first slots. In a plane that the disposable adjustment film is located thereon, when the disposable adjustment film is applied with forces that act in opposite directions and that are parallel to any one of the first slots, the disposable adjustment film is broken into two abandoned films along the two predetermined lines.
    Type: Application
    Filed: October 1, 2021
    Publication date: November 17, 2022
    Inventors: KAI-CHIEH HSIEH, WEI-JHIH SU, CHAO-HUI TSENG, HSIEN-YU WANG, VEL SANKAR RAMACHANDRAN
  • SEMICONDUCTOR DEVICE HAVING PHOTONIC AND ELECTRONIC DIES AND AN OPTICAL FIBER ASSEMBLY CREATING AN AIR GAP
    Publication number: 20220365286
    Abstract: A semiconductor device including a singulated structure and an optical fiber assembly is provided. The singulated structure includes a photonic die, an electronic die connected to the photonic die and an optical element over the photonic die. The optical fiber assembly is disposed on a top of the singulated structure and includes a holder and an optical fiber structure. The holder keeps an air gap from the optical element. The optical fiber structure is carried by the holder and configured to be optically communicated with the photonic die through the optical element.
    Type: Application
    Filed: May 13, 2021
    Publication date: November 17, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Che-Hsiang Hsu, Chewn-Pu Jou, Feng-Wei Kuo, Min-Hsiang Hsu
  • STRAW STRUCTURE
    Publication number: 20220361697
    Abstract: A straw structure is provided. The straw structure includes a straw body, and the straw body has a first beveled edge at an opening of a bottom end of the straw body and a second beveled edge connected to a rear side of the first beveled edge. A puncturing end opening is formed at the first beveled edge and a side edge of the straw body, and the bottom end of the straw body has a beveled opening formed at the second beveled edge. The puncturing end opening is an acute angle that is less than 90 degrees, and a slope of the second beveled edge is greater than a slope of the first beveled edge.
    Type: Application
    Filed: November 30, 2021
    Publication date: November 17, 2022
    Inventors: Han-Chun Hsieh, Han-Chieh Hsieh
  • SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
    Publication number: 20220365273
    Abstract: Disclosed are semiconductor packages and manufacturing method of the semiconductor packages. In one embodiment, a semiconductor package includes a substrate, a first waveguide, a semiconductor die, and an adhesive layer. The first waveguide is disposed on the substrate. The semiconductor die is disposed on the substrate and includes a second waveguide aligned with the first waveguide. The adhesive layer is disposed between the first waveguide and the second waveguide.
    Type: Application
    Filed: May 13, 2021
    Publication date: November 17, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Hua-Kuei Lin, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Che-Hsiang Hsu, Chewn-Pu Jou, Cheng-Tse Tang
  • PACKAGE STRUCTURE
    Publication number: 20220365297
    Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.
    Type: Application
    Filed: May 14, 2021
    Publication date: November 17, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Hua-Kuei Lin, Che-Hsiang Hsu
  • CONTAINER PROTECTIVE SLEEVE
    Publication number: 20220355975
    Abstract: A container protective sleeve is provided. The container protective sleeve is configured to be sleeved around a container bottom portion of a container. The container protective sleeve includes a protective sleeve body. The protective sleeve body is made of rubber or a silicone elastic material. The protective sleeve body includes a bottom board portion and a side wall portion surrounding an outer periphery of the bottom board portion. The side wall portion has at least one concave portion at one side of the side wall portion corresponding to the bottom board portion and at least one extension fin relatively protruding from the at least one concave portion. The at least one extension fin extends away from the bottom board portion.
    Type: Application
    Filed: November 30, 2021
    Publication date: November 10, 2022
    Inventors: Han-Chun Hsieh, Han-Chieh Hsieh