Abstract: A manufacturing method of a semiconductor package includes the following steps. A supporting layer is formed over a redistribution structure. A first planarization process is performed over the supporting layer. A lower dielectric layer is formed over the supporting layer, wherein the lower dielectric layer includes a concave exposing a device mounting region of the supporting layer. A first sacrificial layer is formed over the supporting layer, wherein the sacrificial layer filling the concave. A second planarization process is performed over the lower dielectric layer and the first sacrificial layer. A transition waveguide provided over the lower dielectric layer. The first sacrificial layer is removed. A semiconductor device is mounted over the device mounting region, wherein the semiconductor device includes a device waveguide is optically coupled to the transition waveguide.

Abstract: A straw structure is provided. The straw structure includes a straw body, and the straw body has a first beveled edge at an opening of a bottom end of the straw body and a second beveled edge connected to a rear side of the first beveled edge. A puncturing end opening is formed at the first beveled edge and a side edge of the straw body, and the bottom end of the straw body has a beveled opening formed at the second beveled edge. The puncturing end opening is an acute angle that is less than 90 degrees, and a slope of the second beveled edge is greater than a slope of the first beveled edge.

Abstract: A drink container and a lid assembly thereof are provided. The drink container includes a container body and the lid assembly, the lid assembly includes a first lid and a second lid, the first lid is screwed at an opening end of the container body through screw threads, the first lid has a top portion, and the top portion of the first lid has an opening portion. The second lid is disposed above the first lid, the second lid includes a plunger component, and a bottom portion of the plunger can be engaged with the opening portion and sealed with the opening portion. The plunger component is connected to a connection arm, and one side of the connection arm corresponding to the plunger component is pivotally connected to a pivot portion of the first lid. The plunger component has a second accommodating space configured to accommodate a straw.

Abstract: A package includes an electronic die, a photonic die underlying and electronically communicating with the electronic die, a lens disposed on the electronic die, and a prism structure disposed on the lens and optically coupled to the photonic die. The prism structure includes first and second polymer layers, the first polymer layer includes a first curved surface concaving toward the photonic die, the second polymer layer embedded in the first polymer layer includes a second curved surface substantially conforming to the first curved surface, and an outer sidewall of the second polymer layer substantially aligned with an outer sidewall of the first polymer layer.

Abstract: An anti-stick titanium cookware and a method of manufacturing the same are provided. The anti-stick titanium cookware includes a titanium cookware body, a titanium cladding element, a heat-conducting element and an anti-stick layer. The titanium cookware body and the titanium cladding element are made of plate bodies, the titanium cladding element is welded on the lower surface of the titanium cookware body, and an interlayer space is formed between the titanium cladding element and the titanium cookware body. The heat-conducting element is accommodated in the interlayer space and contacts the lower surface of the titanium cookware body. The anti-stick layer is formed on the upper surface of the titanium cookware body. The heat-conducting element is fixed on the lower surface of the titanium cookware body through the titanium cladding element. The anti-stick layer is a titanium oxide film formed on the upper surface of the titanium cookware body.

Abstract: A package includes a first package and a second package over and bonded to the first package. The first package includes a first device die, and a first encapsulant encapsulating the first device die therein. The second package includes an Independent Passive Device (IPD) die, and a second encapsulant encapsulating the IPD die therein. The package further includes a power module over and bonded to the second package.

Abstract: A semiconductor package includes a first semiconductor die, a second semiconductor die, an insulating encapsulation, and a plurality of conductive pillars. The second semiconductor die is located on and electrically communicates to the first semiconductor die through joints therebetween. The insulating encapsulation encapsulates the first semiconductor die and the second semiconductor die and covers the joints. The plurality of conductive pillars is next to and electrically connected to the first semiconductor die and the second semiconductor die, and is covered by the insulating encapsulation.

Abstract: An integrated circuit package and a method of forming the same are provided. The integrated circuit package includes a photonic integrated circuit die. The photonic integrated circuit die includes an optical coupler. The integrated circuit package further includes an encapsulant encapsulating the photonic integrated circuit die, a first redistribution structure over the photonic integrated circuit die and the encapsulant, and an opening extending through the first redistribution structure and exposing the optical coupler.

Abstract: A light source is provided capable of maintaining the temperature of a collector surface at or below a predetermined temperature. The light source in accordance with various embodiments of the present disclosure includes a processor, a droplet generator for generating a droplet to create extreme ultraviolet light, a collector for reflecting the extreme ultraviolet light into an intermediate focus point, a light generator for generating pre-pulse light and main pulse light, and a thermal image capture device for capturing a thermal image from a reflective surface of the collector.

Abstract: An extreme ultraviolet (EUV) photolithography system detects debris travelling from an EUV generation chamber to a scanner. The photolithography system includes a detection light source and a sensor. The detection light source outputs a detection light across a path of travel of debris particles from the EUV generation chamber. The sensor senses debris particles by detecting interaction of the debris particles with the detection light.

Abstract: An immersion cooling system includes a cooling tank, a busbar and two busbar protection modules. The busbar is disposed in the cooling tank. The two busbar protection modules are disposed at opposite sides of the busbar. Each of the two busbar protection modules includes a base, a driving member and a cover. The driving member is pivotally connected to the base. The cover is pivotally connected to the driving member. Two covers of the two busbar protection modules extend toward each other to cover the busbar. When two driving members of the two busbar protection modules are pushed, the two driving members rotate to drive the two covers to move away from each other, such that the busbar is exposed between the two covers.

Abstract: An electronic apparatus includes at least one heat generating component and an immersion cooling system. The immersion cooling system includes a main tank and a liquid amount adjusting module. The main tank is adapted to contain a heat dissipation medium, and the heat generating component is disposed in the main tank to be immersed in the heat dissipation medium. The liquid adjusting module includes an auxiliary tank and a pump. The auxiliary tank is adjacent to the main tank, and the heat dissipation medium in the main tank is adapted to be overflowed into the auxiliary tank. The pump is disposed in the auxiliary tank and adapted to drive the heat dissipation medium in the auxiliary tank to flow into the main tank.

Abstract: Disclosed are semiconductor packages and manufacturing method of the semiconductor packages. In one embodiment, a semiconductor package includes a substrate, a first waveguide, a semiconductor die, and an adhesive layer. The first waveguide is disposed on the substrate. The semiconductor die is disposed on the substrate and includes a second waveguide aligned with the first waveguide. The adhesive layer is disposed between the first waveguide and the second waveguide.

Abstract: A semiconductor device includes an interposer disposed on a substrate. A first major surface of the interposer faces the substrate. A system on a chip is disposed on a second major surface of the interposer. The second major surface of the interposer opposes the first major surface of the interposer. A plurality of first passive devices is disposed in the first major surface of the interposer. A plurality of second passive devices is disposed on the second major surface of the interposer. The second passive devices are different devices than the first passive devices.

Abstract: An extreme ultra violet (EUV) lithography method includes receiving an EUV light by a scanner from an EUV light source, the EUV light passing through an intermediate focus disposed in the scanner and at a junction of the EUV light source and the scanner; directing the EUV light by the scanner to a reticle in the scanner; and deflecting nanoparticles from the EUV light source away from the reticle by generating a gas flow using a gas jet disposed entirely in the scanner and proximate to an interface of the scanner and the intermediate focus such that the gas jet does not block the EUV light.

Abstract: A lithography system is provided capable of deterring contaminants, such as tin debris from entering into the scanner. The lithography system in accordance with various embodiments of the present disclosure includes a processor, an extreme ultraviolet light source, a scanner, and a hollow connection member. The light source includes a droplet generator for generating a droplet, a collector for reflecting extreme ultraviolet light into an intermediate focus point, and a light generator for generating pre-pulse light and main pulse light. The droplet generates the extreme ultraviolet light in response to the droplet being illuminated with the pre-pulse light and the main pulse light. The scanner includes a wafer stage. The hollow connection member includes an inlet that is in fluid communication with an exhaust pump. The hollow connection member provides a hollow space in which the intermediate focus point is disposed.

Abstract: An extreme ultra violet (EUV) lithography method includes receiving an EUV light by a scanner from an EUV light source, the EUV light passing through an intermediate focus disposed in the scanner and at a junction of the EUV light source and the scanner; directing the EUV light by the scanner to a reticle in the scanner; and deflecting nanoparticles from the EUV light source away from the reticle by generating a gas flow using a gas jet disposed entirely in the scanner and proximate to an interface of the scanner and the intermediate focus such that the gas jet does not block the EUV light.

Abstract: A semiconductor package includes a first semiconductor die, a second semiconductor die, an insulating encapsulation, and a plurality of conductive pillars. The second semiconductor die is located on and electrically communicates to the first semiconductor die through joints therebetween. The insulating encapsulation encapsulates the first semiconductor die and the second semiconductor die and covers the joints. The plurality of conductive pillars is next to and electrically connected to the first semiconductor die and the second semiconductor die, and is covered by the insulating encapsulation.

Abstract: An electronic apparatus includes at least one heat generating component and an immersion cooling system. The immersion cooling system includes a main tank and a liquid amount adjusting module. The main tank is adapted to contain a heat dissipation medium, and the heat generating component is disposed in the main tank to be immersed in the heat dissipation medium. The liquid adjusting module includes an auxiliary tank and a pump. The auxiliary tank is adjacent to the main tank, and the heat dissipation medium in the main tank is adapted to be overflowed into the auxiliary tank. The pump is disposed in the auxiliary tank and adapted to drive the heat dissipation medium in the auxiliary tank to flow into the main tank.

Abstract: The present invention relates to a nail filing machine, an ultraviolet (UV) light sterilization container, and a nail filing system including the nail filing machine. The nail filing machine of the present invention comprises a pen-shaped nail filing device, a master device and a rotation speed-adjustable motor. The nail filing machine of the present invention is convenient for a user (i.e., a manicurist) to use for a long time, is easy to carry in use, has a UV light sterilization function, and can record the working mode of the user, thereby effectively improving the operability of the nail filing machine.