Abstract: A method for improving uneven brightness of display and the display thereof. The method is to coat a layer of silicon glue on the bonding surface of the liquid crystal display module and the front frame of the display. The silicon glue has the characteristic of being stretchable, and can reduce the pulling of the liquid crystal display module to reduce the problem of uneven brightness of the display, and can reduce the interference of the cumulative tolerance of the assembly parts of other displays on the liquid crystal display module.

Abstract: A semiconductor device includes an interposer disposed on a substrate. A first major surface of the interposer faces the substrate. A system on a chip is disposed on a second major surface of the interposer. The second major surface of the interposer opposes the first major surface of the interposer. A plurality of first passive devices is disposed in the first major surface of the interposer. A plurality of second passive devices is disposed on the second major surface of the interposer. The second passive devices are different devices than the first passive devices.

Abstract: A beverage container assembly and a cover component thereof are provided. The beverage container assembly includes a beverage container, the cover component, and a straw. The cover component includes a first cover and a second cover pivotally connected thereto. The first cover has a top portion that includes an opening portion and a pivot portion, and has a sleeve portion that is connected to a lower end of the top portion. The second cover has a connecting arm and a main body portion that has a straw accommodating portion. A pivot end of the connecting arm has two first pivots that protrude outward and an expansion joint located at a center of the pivot end, so that a distance between terminal ends of the two first pivots can be shortened for easy engagement with or separation from two first pivot holes on the pivot portion.

Abstract: Disclosed are semiconductor packages and manufacturing method of the semiconductor packages. In one embodiment, a semiconductor package includes a substrate, a first waveguide, a semiconductor die, and an adhesive layer. The first waveguide is disposed on the substrate. The semiconductor die is disposed on the substrate and includes a second waveguide aligned with the first waveguide. The adhesive layer is disposed between the first waveguide and the second waveguide.

Abstract: A package structure including a first semiconductor die, a second semiconductor die, first conductive pillars and a first insulating encapsulation is provided. The first semiconductor die includes a semiconductor substrate, an interconnect structure and a first redistribution circuit structure. The semiconductor substrate includes a first portion and a second portion disposed on the first portion. The interconnect structure is disposed on the second portion, the first redistribution circuit structure is disposed on the interconnect structure, and the lateral dimension of the first portion is greater than the lateral dimension of the second portion. The second semiconductor die is disposed on the first semiconductor die. The first conductive pillars are disposed on the first redistribution circuit structure of the first semiconductor die. The first insulating encapsulation is disposed on the first portion.

Abstract: A light source is provided capable of maintaining the temperature of a collector surface at or below a predetermined temperature. The light source in accordance with various embodiments of the present disclosure includes a processor, a droplet generator for generating a droplet to create extreme ultraviolet light, a collector for reflecting the extreme ultraviolet light into an intermediate focus point, a light generator for generating pre-pulse light and main pulse light, and a thermal image capture device for capturing a thermal image from a reflective surface of the collector.

Abstract: A method includes: removing debris on a collector of a lithography equipment by changing physical structure of the debris with a cleaner; forming a cleaned collector by exhausting the removable debris from the collector; and forming openings in a mask layer on a substrate by removing regions of the mask layer exposed to radiation from the cleaned collector.

Abstract: An extreme ultraviolet (EUV) photolithography system detects debris travelling from an EUV generation chamber to a scanner. The photolithography system includes a detection light source and a sensor. The detection light source outputs a detection light across a path of travel of debris particles from the EUV generation chamber. The sensor senses debris particles by detecting interaction of the debris particles with the detection light.

Abstract: An electronic apparatus includes at least one heat generating component and an immersion cooling system. The immersion cooling system includes a main tank and a liquid amount adjusting module. The main tank is adapted to contain a heat dissipation medium, and the heat generating component is disposed in the main tank to be immersed in the heat dissipation medium. The liquid adjusting module includes an auxiliary tank and a pump. The auxiliary tank is adjacent to the main tank, and the heat dissipation medium in the main tank is adapted to be overflowed into the auxiliary tank. The pump is disposed in the auxiliary tank and adapted to drive the heat dissipation medium in the auxiliary tank to flow into the main tank.

Abstract: A method includes bonding a first device die to a second device die, encapsulating the first device die in a first encapsulant, performing a backside grinding process on the second device die to reveal through-vias in the second device die, and forming first electrical connectors on the second device die to form a package. The package includes the first device die and the second device die. The method further includes encapsulating the first package in a second encapsulant, and forming an interconnect structure overlapping the first package and the second encapsulant. The interconnect structure comprises second electrical connectors.

Abstract: A lithography system is provided capable of deterring contaminants, such as tin debris from entering into the scanner. The lithography system in accordance with various embodiments of the present disclosure includes a processor, an extreme ultraviolet light source, a scanner, and a hollow connection member. The light source includes a droplet generator for generating a droplet, a collector for reflecting extreme ultraviolet light into an intermediate focus point, and a light generator for generating pre-pulse light and main pulse light. The droplet generates the extreme ultraviolet light in response to the droplet being illuminated with the pre-pulse light and the main pulse light. The scanner includes a wafer stage. The hollow connection member includes an inlet that is in fluid communication with an exhaust pump. The hollow connection member provides a hollow space in which the intermediate focus point is disposed.

Abstract: A manufacturing method of an antimicrobial and adhesion-proof titanium tableware having a contact portion for contacting foods, food ingredients, drinking water, beverages, or body parts of a user. The manufacturing method includes a preparation step implemented by using a titanium substrate to produce a tableware preform; a preparation step implemented by using a titanium substrate to produce a tableware preform; a surface treatment step implemented by washing a surface of the tableware preform and removing a primary oxidation layer on the surface of the tableware preform; and an oxidation step which includes: placing the tableware preform in a vacuum calcination furnace, heating the tableware preform to reach a temperature ranging from 700° C. to 850° C., and introducing oxygen for allowing one part of the surface of the tableware preform corresponding to the contact portion to be exposed to the oxygen for 3 hours to 12 hours.

Abstract: A package substrate and a chip package structure using the same are provided. The package substrate includes a laminated board including first to third wiring layers, a pad array, a plurality of ground conductive structures, and a plurality of power conductive structures. At least one of the ground (or power) conductive structures includes two first ground (or power) conductive posts and a second ground (or power) conductive post. The two first ground (or power) conductive posts and the second ground (or power) conductive post are arranged along a first direction, and the second ground (or power) conductive post is located between two orthographic projections of the two first ground (or power) conductive posts. Each of the ground conductive structures in a first column and each of the power conductive structures in a second column are offset from each other in a second direction.

Abstract: A method of controlling a droplet illumination module/droplet detection module system of an extreme ultraviolet (EUV) radiation source includes irradiating a target droplet with light from a droplet illumination module and detecting light reflected and/or scattered by the target droplet. The method includes determining whether an intensity of the detected light is within an acceptable range. In response to determining that the intensity of the detected light is not within the acceptable range, a parameter of the droplet illumination module is automatically adjusted to set the intensity of the detected light within the acceptable range.

Abstract: An immersion cooling system includes a work tank, a pump, a first pipeline, a condensation dehumidification device, a second pipeline, and a control system. The work tank includes a vapor section and a humidity sensor for sensing a humidity of the vapor section. The first pipeline includes a first valve. The vapor section and the pump are selectively in communication with each other or not when the first valve is actuated. The condensation dehumidification device has a first end and a second end, where the first end is in communication with the pump. The second pipeline includes a second valve. The condensation dehumidification device and the tank are selectively in communication with each other or not when the second valve is actuated. When the humidity is greater than a preset humidity, the control system controls the first valve to communicate the vapor section and the pump and activates the pump.

Abstract: A beverage container assembly and a cover component thereof are provided. The beverage container assembly includes a beverage container, the cover component, and a straw. The cover component includes a first cover and a second cover pivotally connected thereto. The first cover has a top portion that includes an opening portion and a pivot portion, and has a sleeve portion that is connected to a lower end of the top portion. The second cover has a connecting arm and a main body portion that has a straw accommodating portion. A pivot end of the connecting arm has two first pivots that protrude outward and an expansion joint located at a center of the pivot end, so that a distance between terminal ends of the two first pivots can be shortened for easy engagement with or separation from two first pivot holes on the pivot portion.

Abstract: A package structure including a first semiconductor die, a second semiconductor die, first conductive pillars and a first insulating encapsulation is provided. The first semiconductor die includes a semiconductor substrate, an interconnect structure and a first redistribution circuit structure. The semiconductor substrate includes a first portion and a second portion disposed on the first portion. The interconnect structure is disposed on the second portion, the first redistribution circuit structure is disposed on the interconnect structure, and the lateral dimension of the first portion is greater than the lateral dimension of the second portion. The second semiconductor die is disposed on the first semiconductor die. The first conductive pillars are disposed on the first redistribution circuit structure of the first semiconductor die. The first insulating encapsulation is disposed on the first portion.

Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through substrate via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through substrate via.

Abstract: A delivery device includes a first base, two first check valves, a carrier, a first deformable container and a driving mechanism. The first base has a first inlet and a first outlet. The two first check valves are disposed at the first inlet and the first outlet. The first deformable container is connected to the first base and the carrier. The first deformable container communicates with the first inlet and the first outlet. The driving mechanism is connected to the carrier. The driving mechanism drives the carrier to reciprocate, such that the carrier drives the first deformable container to expand or contract.

Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.