Abstract: Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be provided as a powder, thin sheet, or sheet of amorphous alloy. A template having a plurality of apertures arranged in a predetermined pattern may be used to place the superabrasive particles on a given substrate or matrix support material.

Abstract: Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be provided as a powder, thin sheet, or sheet of amorphous alloy. A template having a plurality of apertures arranged in a predetermined pattern may be used to place the superabrasive particles on a given substrate or matrix support material.

Abstract: CMP pad dressers having leveled tips and associated methods are provided. In one aspect, for example, a CMP pad dresser can include a matrix layer and a monolayer of a plurality of superabrasive particles embedded in the matrix layer, where each superabrasive particle in the monolayer protrudes from the matrix layer. The difference in the protrusion distance between the highest protruding tip and the next highest protruding tip of the monolayer of superabrasive particles is less than or equal to about 20 microns, and the difference in protrusion distance between the highest 1% of the protruding tips of the monolayer of superabrasive particles are within about 80 microns or less.

Abstract: CMP pad dressers having leveled tips and associated methods are provided. In one aspect, for example, a method can include pressing a CMP pad dresser against a CMP pad, where the dresser includes a monolayer of a plurality of superabrasive particles protruding from a matrix layer. The difference in protrusion distance between the highest protruding tip and the second highest protruding tip of the monolayer of superabrasive particles is less than or equal to about 10 microns and the difference in protrusion distance between the highest 10 protruding tips of the monolayer of superabrasive particles are within about 20 microns or less. The method can further include rotating the dresser against the CMP pad such that asperities are cut into the CMP pad having a maximum cutting depth of about 60 microns.

Abstract: A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also provided. Each of the plurality of abrasive segments is permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another.

Abstract: CMP pad dressers having leveled tips and associated methods are provided. In one aspect, for example, a CMP pad dresser can include a support substrate and a plurality of superabrasive particles secured to the support substrate with each superabrasive particle extending away from the support substrate to a protrusion distance, where a highest protruding tip of each of the plurality of superabrasive particles align along a designated profile with a tip variation of from about 5 microns to about 100 microns.

Abstract: Methods of making a superabrasive tool precursor are disclosed, along with such precursors and associated tools. Particularly, methods are disclosed for orienting superabrasive particles in a viscous binding material in order to provide tools based thereupon and having desired performance characteristics.

Abstract: Stress regulated semiconductor devices and associated methods are provided. In one aspect, for example, a stress regulated semiconductor device can include a semiconductor layer, a stress regulating interface layer including a carbon layer formed on the semiconductor layer, and a heat spreader coupled to the carbon layer opposite the semiconductor layer. The stress regulating interface layer is operable to reduce the coefficient of thermal expansion difference between the semiconductor layer and the heat spreader to less than or equal to about 10 ppm/° C.

Abstract: A light emitting diode having a diamond-like carbon layer is disclosed, which includes: a substrate; a semiconductor epitaxial multilayer structure deposited over the substrate and including a first semiconductor epitaxial layer and a second semiconductor epitaxial layer, wherein the first and second semiconductor epitaxial layers are stacked with each other; an insulating diamond-like carbon covering partial surface of the semiconductor epitaxial multilayer structure; a first electrode provided with an electrical connection to the first semiconductor epitaxial layer; and a second electrode provided with an electrical connection to the second semiconductor epitaxial layer. A manufacturing method and application of the light-emitting diode are also disclosed.

Abstract: Graphene layers made of primarily sp2 bonded atoms and associated methods are disclosed. In one aspect, for example, a method of forming a graphite film can include heating a solid substrate under vacuum to a solubilizing temperature that is less than a melting point of the solid substrate, solubilizing carbon atoms from a graphite source into the heated solid substrate, and cooling the heated solid substrate at a rate sufficient to form a graphite film from the solubilized carbon atoms on at least one surface of the solid substrate. The graphite film is formed to be substantially free of lattice defects.

Abstract: Superabrasive tools and methods for making and using the same are provided. In one aspect, for example, a CMP pad dresser includes a first monolayer of superabrasive particles disposed on and coupled to one side of a metal support layer and a second monolayer of superabrasive particles disposed on and coupled to the metal support layer on an opposite side from the first monolayer. The superabrasive particles of the second monolayer are positioned to have substantially the same distribution as the superabrasive particles of the first monolayer.

Abstract: Methods and systems for evaluating and/or increasing CMP pad dresser performance are provided. In one aspect, for example, a method of identifying overly-aggressive superabrasive particles in a CMP pad dresser can include positioning a CMP pad dresser having a plurality of superabrasive particles on an indicator substrate such that at least a portion of the plurality of superabrasive particles of the CMP pad dresser contact the indicator substrate, and moving the CMP pad dresser across the indicator substrate in a first direction such that the portion of the plurality of superabrasive particles create a first marking pattern on the substrate, wherein the first marking pattern identifies a plurality of working superabrasive particles from among the plurality of superabrasive particles.

Abstract: CMP pad dressers having leveled tips and associated methods are provided. In one aspect, for example, a CMP pad dresser can include a matrix layer and a monolayer of a plurality of superabrasive particles embedded in the matrix layer, where each superabrasive particle in the monolayer protrudes from the matrix layer. The difference in the protrusion distance between the highest protruding tip and the next highest protruding tip of the monolayer of superabrasive particles is less than or equal to about 20 microns, and the difference in protrusion distance between the highest 1% of the protruding tips of the monolayer of superabrasive particles are within about 80 microns or less.

Abstract: The present invention provides CMP pad dressers and methods for dressing or conditioning CMP pads. In one aspect, a method for conditioning a CMP pad can include cutting the CMP pad with superabrasive cutting elements and controlling a degree of contact between the CMP pad and the cutting elements using control elements. The degree of contact is established through placement of the control elements relative to the cutting elements.

Abstract: Dual dressing systems for conditioning CMP pads, including associated methods, are provided. In one aspect, for example, a method of dressing a CMP pad can include applying a deglazing dresser to a working surface of a CMP pad, deglazing the working surface of the CMP pad with the deglazing dresser, applying an asperity-forming dresser to the working surface of the CMP pad, and forming asperities in the working surface of the CMP pad with the asperity-forming dresser.

Abstract: Graphene layers, hexagonal boron nitride layers, as well as other materials made of primarily sp2 bonded atoms and associated methods are disclosed. In one aspect, for example, a method of forming a graphene layer is provided. Such a method may include mixing a carbon source with a horizontally oriented molten solvent, precipitating the carbon source from the molten solvent to form a graphite layer across the molten solvent, and separating the graphite layer into a plurality of graphene layers.

Abstract: The present invention relates to a method of mass production of graphene. In one embodiment, such a method may include providing a high temperature furnace for storing a molten solvent, wherein the high temperature furnace comprises an outlet disposed on the top of the high temperature furnace, and an inlet, providing a carbon source to mix with the molten solvent, precipitating the carbon to form a graphene layer on the surface of the molten solvent under a supersaturated state, and collecting the graphene layer from the outlet.

Abstract: The present invention relates to a chemical mechanical polishing conditioner which comprises: a substrate; a bonding layer, disposed on the substrate; and an abrasive layer, having a thin metal sheet and a first layer of abrasive particles, wherein the first layer of abrasive particles is disposed on the thin metal sheet, and the abrasive layer is coupled to the substrate with the bonding layer; wherein the first layer of abrasive particles comprises a plurality of abrasive particles, of which protruding tips has a planar leveling surface, so that the plurality of abrasive particles do not have one or more protruding tips of the plurality of abrasive particles having particular significant difference in protrusion distance, and the plurality of abrasive particles have a patterning arrangement.

Abstract: The present invention (utility model application in Taiwan) relates to a chemical mechanical polishing pad dresser, comprising: a substrate; a bonding layer disposed on the substrate; an electroplating layer disposed on the bonding layer; a fixed template disposed on the electroplating layer having a plurality of apertures; and a plurality of abrasive particles corresponding to and set in the apertures, wherein the plurality of abrasive particle fixed in the bonding layer and the substrate by means of the electroplating layer.

Abstract: The instant disclosure relates to a manufacturing method of cathode catalyst, comprising the following steps. Initially, mix an organic medium with an iron-based starting material and a nitrogen-based starting material to form a mixture. Followed by adding a carbon material to the mixture and subsequently executing a heating process to form a solid-state precursor. Then mill the solid-state precursor to form a precursory powder. Successively, calcinate the precursory powder in the presence of NH3 to form a cathode catalyst. The cathode catalyst can reduce the activation energy of hydrogen ion reacting with oxygen to make water. The instant disclosure further provides an ozone-generating device.