Patents by Inventor Chien-Wen Chen

Chien-Wen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8726220
    Abstract: A method for generating a layout for a device having FinFETs from a first layout for a device having planar transistors is disclosed. The planar layout is analyzed and corresponding FinFET structures are generated in a matching fashion. The resulting FinFET structures are then optimized. Dummy patterns and a new metal layer may be generated before the FinFET layout is verified and outputted.
    Type: Grant
    Filed: March 9, 2012
    Date of Patent: May 13, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Tang Lin, Cheok-Kei Lei, Shu-Yu Chen, Yu-Ning Chang, Hsiao-Hui Chen, Chih-Sheng Chang, Chien-Wen Chen, Clement Hsingjen Wann
  • Patent number: 8726207
    Abstract: A design system includes a layout module and a user interface. The layout module includes a computing unit, which is configured to extract layout parameters of an integrated circuit device in a circuit during a layout stage of the circuit, and calculate circuit parameters of the device using the layout parameters. The user interface is configured to display the circuit parameters of the device in response to a user selection of the device.
    Type: Grant
    Filed: May 25, 2011
    Date of Patent: May 13, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Sian Jiang, Ya-Li Tai, Mu-Jen Huang, Chien-Wen Chen, Chauchin Su
  • Publication number: 20140115667
    Abstract: An online service providing system, a method, a server, and a mobile device thereof, and a computer program product are provided. The method includes sending a verification link corresponding to a user account that is not verified; after receiving a verification request corresponding to the verification link, determining whether a device identification sent by the mobile device that has logged in the user account is received; when receiving the device identification, confirming whether the user account is verified according to the device identification; after confirming that the user account is verified, when receiving a service request sent by a terminal device logging the user account into a service website, determining a homepage of the service website according to the device identification, and providing the online service corresponding to the mobile device to the terminal device through the service website.
    Type: Application
    Filed: December 30, 2013
    Publication date: April 24, 2014
    Applicant: HTC Corporation
    Inventors: Po-Yen Lee, Chien-Wen Chen, Pai-Chang Yeh, Li-Wen Lian
  • Publication number: 20140068540
    Abstract: A design system for designing an integrated circuit that includes a processor, a memory coupled to the processor, and instructions to generate and edit a schematic of the integrated circuit, generate at least one recommended layout parameter of an integrated circuit device within the integrated circuit, extract the at least one recommended layout parameter during a layout stage of the integrated circuit, and calculate a circuit performance parameter of the integrated circuit using the at least one recommended layout parameter, and a user interface configured to display at least one of the circuit performance parameter and layout constraints of the integrated circuit device of the integrated circuit.
    Type: Application
    Filed: August 31, 2012
    Publication date: March 6, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Mu-Jen HUANG, Yu-Sian JIANG, Chien-Wen CHEN
  • Patent number: 8666377
    Abstract: A method, a system, and a computer-readable medium for synchronizing spot information, adapted to synchronize a plurality of spot information displayed on a mobile device and a terminal device, are provided. In the present method, when the mobile device logs in to a service end device, the spot information in a spot database of the mobile device is synchronized to the service end device. When the terminal device logs in to the service end device, the spot information synchronized from the mobile device to the service end device is downloaded to the terminal device and displayed in a spot information browsing webpage. When the mobile device receives spot information edited by a user, the mobile device synchronizes the edited spot information to the service end device, and the service end device updates the spot information displayed in the spot information browsing webpage of the terminal device.
    Type: Grant
    Filed: March 2, 2011
    Date of Patent: March 4, 2014
    Assignee: HTC Corporation
    Inventors: Po-Yen Lee, Chien-Wen Chen, Pai-Chang Yeh, Li-Wen Lian
  • Publication number: 20140025291
    Abstract: A method, a system, an apparatus, and a computer-readable medium for browsing spot information, adapted to an electronic device, are provided. In the present method, a plurality of spot information are retrieved, in which each of the spot information at least comprises a picture and a location of a spot. Next, an electronic map is displayed and a spot marker is marked at the spot location of each spot information on the electronic map. Meanwhile, a spot browsing bar is displayed on a side of the electronic map and the spot pictures of the spot information are sequentially displayed in the spot browsing bar. When a select operation of a certain spot marker on the electronic map is received, the spot browsing bar is scrolled to show the spot picture corresponding to the selected spot marker.
    Type: Application
    Filed: September 23, 2013
    Publication date: January 23, 2014
    Applicant: HTC Corporation
    Inventors: Po-Yen Lee, Chien-Wen Chen, Pai-Chang Yeh, Li-Wen Lian
  • Publication number: 20140007031
    Abstract: In a semiconductor device design method performed by at least one processor, location data of at least one electrical component in a layout of a semiconductor device is extracted by the at least one processor. Voltage data associated with the at least one electrical component and based on a simulation of an operation of the semiconductor device is extracted by the at least one processor. Based on the extracted location data, the extracted voltage data is incorporated, by the at least one processor, in the layout to generate a modified layout of the semiconductor device.
    Type: Application
    Filed: June 29, 2012
    Publication date: January 2, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Mu-Jen HUANG, Chih Chi HSIAO, Wei-Ting LIN, Tsung-Hsin YU, Chien-Wen CHEN, Yung-Chow PENG
  • Patent number: 8621406
    Abstract: A method for generating a layout for a device having FinFETs from a first layout for a device having planar transistors is disclosed. The planar layout is analyzed and corresponding FinFET structures are generated.
    Type: Grant
    Filed: March 9, 2012
    Date of Patent: December 31, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheok-Kei Lei, Yi-Tang Lin, Hsiao-Hui Chen, Yu-Ning Chang, Shu-Yu Chen, Chien-Wen Chen, Chih-Sheng Chang, Clement Hsingjen Wann
  • Patent number: 8621571
    Abstract: An online service providing system, a method, a server, and a mobile device thereof, and a computer program product are provided. The method includes sending a verification link corresponding to a user account that is not verified; after receiving a verification request corresponding to the verification link, determining whether a device identification sent by the mobile device that has logged in the user account is received; when receiving the device identification, confirming whether the user account is verified according to the device identification; after confirming that the user account is verified, when receiving a service request sent by a terminal device logging the user account into a service website, determining a homepage of the service website according to the device identification, and providing the online service corresponding to the mobile device to the terminal device through the service website.
    Type: Grant
    Filed: March 2, 2011
    Date of Patent: December 31, 2013
    Assignee: HTC Corporation
    Inventors: Po-Yen Lee, Chien-Wen Chen, Pai-Chang Yeh, Li-Wen Lian
  • Publication number: 20130320555
    Abstract: A method comprises: accessing data representing a layout of a layer of an integrated circuit (IC) comprising a plurality of polygons defining circuit patterns to be divided among a number (N) of photomasks for multi-patterning a single layer of a semiconductor substrate, where N is greater than one. For each set of N parallel polygons in the layout closer to each other than a minimum separation for patterning with a single photomask, at least N?1 stitches are inserted in each polygon within that set to divide each polygon into at least N parts, such that adjacent parts of different polygons are assigned to different photomasks from each other. Data representing assignment of each of the parts in each set to respective photomasks are stored in a non-transitory, computer readable storage medium that is accessible for use in a process to fabricate the N photomasks.
    Type: Application
    Filed: May 31, 2012
    Publication date: December 5, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsien YU-TSENG, Shih-Kai LIN, Chin-Shen LIN, Yu-Sian JIANG, Heng-Kai LIU, Mu-Jen HUANG, Chien-Wen CHEN
  • Publication number: 20130326447
    Abstract: A system comprises an electronic design automation (EDA) tool, for generating a schematic design of an integrated circuit (IC), generating a layout from the schematic design, editing the layout, and verifying the schematic design and layout. At least one non-transitory, computer readable storage medium, is provided for storing data representing the schematic design and the layout, the layout having a network of routing paths connecting at least two active layer devices of the IC design. An RC tool is provided for computing estimated parasitic capacitances of the routing paths of the network before verifying the schematic design and layout, and for inserting a capacitor corresponding to the estimated parasitic capacitance into the data representing the schematic design of the IC. A first device level simulation tool for simulating performance of the network based on the at least two active layer devices and the estimated parasitic capacitances.
    Type: Application
    Filed: May 31, 2012
    Publication date: December 5, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Mu-Jen HUANG, Yu-Sian JIANG, Yi-Ting LIN, Hsien-Yu TSENG, Heng Kai LIU, Chien-Wen CHEN, Chauchin SU
  • Patent number: 8572537
    Abstract: A system and method for extracting the parasitic contact/via capacitance in an integrated circuit are provided. Parasitic extraction using this system can lead to an improved accuracy on contact/via parasitic capacitance extraction by taking into account of the actual contact/via shape and size variation. The common feature of the various embodiments includes the step of generating a technology file, in which the contact/via capacitance in the capacitance table is derived from an effective contact/via width table. Each element of the effective contact/via width table is calibrated to have a parasitic capacitance matching to that of an actual contact/via configuration occurring in an IC.
    Type: Grant
    Filed: June 19, 2012
    Date of Patent: October 29, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ke-Ying Su, Chia-Ming Ho, Gwan-Sin Chang, Chien-Wen Chen
  • Patent number: 8543333
    Abstract: A method, a system, an apparatus, and a computer-readable medium for browsing spot information, adapted to an electronic device, are provided. In the present method, a plurality of spot information are retrieved, in which each of the spot information at least comprises a picture and a location of a spot. Next, an electronic map is displayed and a spot marker is marked at the spot location of each spot information on the electronic map. Meanwhile, a spot browsing bar is displayed on a side of the electronic map and the spot pictures of the spot information are sequentially displayed in the spot browsing bar. When a select operation of a certain spot marker on the electronic map is received, the spot browsing bar is scrolled to show the spot picture corresponding to the selected spot marker.
    Type: Grant
    Filed: March 3, 2011
    Date of Patent: September 24, 2013
    Assignee: HTC Corporation
    Inventors: Po-Yen Lee, Chien-Wen Chen, Pai-Chang Yeh, Li-Wen Lian
  • Patent number: 8518722
    Abstract: A method for detecting the under-fill void of the flip chip ball grid array package structure is provided, which includes providing a substrate having an interconnect structure and a plurality of interposers therein; providing a chip having an active surface and a back side, and a plurality of first connecting elements on the active surface of the chip; mounting and electrically connecting the active surface of the chip on the substrate; performing at least once IR reflow to fix the plurality of first connecting elements on the substrate; filling an encapsulate material to cover the active surface of the chip and the plurality of first connecting elements; performing a detecting process to detect that void is not formed between the active surface of the chip and the plurality of first elements; and forming a plurality of second connecting elements on the back side of the substrate to obtain a flip chip ball grid array package structure.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: August 27, 2013
    Assignee: Global Unichip Corporation
    Inventors: Chien-Wen Chen, Chia-Jen Kao, Jui-Cheng Chuang
  • Patent number: 8492883
    Abstract: A semiconductor package and related methods are described. In one embodiment, the package includes a die pad, a plurality of leads, a chip, and a package body. The die pad includes: (1) a peripheral edge region defining, a cavity with a cavity bottom including a central portion; (2) an upper sloped portion; and (3) a lower sloped portion. Each lead includes an upper sloped portion and a lower sloped portion. The chip is disposed on the central portion of the cavity bottom and is coupled to the leads. The package body is formed over the chip and the leads, substantially fills the cavity, and substantially covers the upper sloped portions of the die pad and the leads. The lower sloped portions of the die pad and the leads at least partially extend outwardly from a lower surface of the package body.
    Type: Grant
    Filed: August 15, 2008
    Date of Patent: July 23, 2013
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Pao-Huei Chang Chien, Ping-Cheng Hu, Chien-Wen Chen, Hsu-Yang Lee
  • Publication number: 20130173021
    Abstract: A knee joint includes a knee member, an upper connecting member that is disposed on top of the knee member for connection with a prosthetic upper leg, a resilient member disposed between the knee member and the upper connecting member, and a connection seat that has an upper portion pivotally connected to the knee member and that has a lower portion for connecting with a prosthetic lower leg.
    Type: Application
    Filed: September 12, 2012
    Publication date: July 4, 2013
    Inventors: Chien-Wen CHEN, Chien-Cheng Chen
  • Patent number: 8444705
    Abstract: A knee joint prosthesis is adapted for interconnecting a prosthetic lower leg and a prosthetic thigh. The knee joint prosthesis includes a knee seat disposed under and connected to the prosthetic thigh, a connecting seat disposed above and connected to the prosthetic lower leg, a link assembly, and an adjusting unit. The link assembly includes a plurality of links each connected pivotally to the knee seat and the connecting seat in such a manner to allow the knee joint prosthesis to change between an elevated position and a flexed position. The adjusting unit is disposed in the knee seat, and is operable to cooperate with the link assembly to adjust difficulty level of changing the knee joint prosthesis between the elevated and flexed positions.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: May 21, 2013
    Inventors: Chien-Wen Chen, Chien-Cheng Chen
  • Publication number: 20130123942
    Abstract: A prosthesis foot includes: a connecting unit including a flexible first plate and a leg-connecting member that is connected to the first plate; a buffer unit including a flexible second plate that has a front portion connected to and disposed under a front portion of the first plate, and an elastic wedge member that is clamped between the first and second plates to form an acute angle between the first and second plates; and a support unit including a flexible third plate that has a rear portion connected to and disposed under a rear portion of the second plate, and an elastic support member that is interposed between the second and third plates to form an acute angle between the second and third plates.
    Type: Application
    Filed: September 12, 2012
    Publication date: May 16, 2013
    Inventors: Chien-Wen CHEN, Chien-Cheng CHEN
  • Publication number: 20130104956
    Abstract: A solar cell module includes multiple solar cells connected in series through wiring units. Each solar cell comprises an electrode unit disposed on a photoelectric conversion unit converting solar energy into electrical energy, and including multiple finger electrodes. At least one finger electrode has a first conducting section connected to a bus bar electrode, and a second conducting section disposed on one side of the first conducting section, extending away from the bus bar electrode and having a thickness greater than that of each of the first conducting section and the bus bar electrode.
    Type: Application
    Filed: June 11, 2012
    Publication date: May 2, 2013
    Applicant: MOTECH INDUSTRIES INC.
    Inventors: Ming-Tzu Chou, Chien-Wen Chen, Ching-Hao Tu, Chih-Chiang Huang, Kang-Cheng Lin
  • Publication number: 20130103167
    Abstract: A knee joint includes a knee member including a movable plate connected to and pressable toward a fixed seat, and an interspace formed between the fixed seat and the movable plate. An upper connecting unit disposed atop the knee member abuts against the movable plate. A pivot shaft is inserted threadedly into the knee member and is rotatable relative thereto. Pressing the upper connection unit against the movable plate constricts the interspace so that the pivot shaft is clamped tightly between the fixed seat and the movable plate, thereby restricting a relative rotation between the knee member and the pivot shaft. The movable plate is restored to its original position when unpressed.
    Type: Application
    Filed: October 24, 2012
    Publication date: April 25, 2013
    Inventors: Chien-Wen Chen, Chien-Cheng Chen