Abstract: A compound having the formula (LA)mIr(LB)3-m, where LA is and LB is selected from is disclosed. In the formula (LA)mIr(LB)3-m, LA and LB are different; each of X1 to X5 is C—RF or nitrogen; X is selected from O, S, and Se; each R1, R2, RB, RD, RE, and RF is hydrogen or a substituent; R3 is alkyl, cycloalkyl, or a combination thereof; and m is 1 or 2. OLEDs, consumer products, and formulations including the compound are also disclosed.

Abstract: Provided are methods and systems for aligning multiple parts using simultaneous scanning of features of different parts and using feature-based coordinate systems for determining relative positions of these. Specifically, a feature-based coordinate system may be constructed using one or more critical dimensions between features of different parts. The scanner may be specifically positioned to capture each of these critical dimensions precisely. The feature-based coordinate system is used to compare the critical dimensions to specified ranges. The position of at least one part may be adjusted based on results of this comparison using, for example, a robotic manipulator. The process may be repeated until all critical dimensions are within their specified ranges. In some embodiments, multiple sets of features from different parts are used such that each set uses its own feature-based coordinate system. The part adjustment may be performed based on the collective output from these multiple sets.

Abstract: An embedded packaging structure includes a die, a sintered metal layer, an encapsulation layer and a conductive via. The die includes a metallic bonding layer. Sintered metal layer is bonded to the metallic bonding layer. The encapsulation layer covers the die. The conductive via is provided in a blind hole of the encapsulation layer, and the conductive via is electrically connected with the metallic bonding layer through the sintered metal layer.

Abstract: This document describes methods and systems for an antenna system integrated with side-keys of an electronic device. The antenna system enables antenna integration in a metal frame using a metal support structure and fastener(s) to route antenna signals around side-key modules embedded in the frame without encountering or causing interference with the side-key modules. By using these techniques to integrate antennas on areas around the side-key modules, more antennas can be implemented on the electronic device, leading to improved capabilities supporting additional wireless standards and a better user experience in terms of improved communication quality.

Abstract: A method for fabricating an OLED using a mixture that is an evaporation source for a vacuum deposition process includes providing a container that contains the mixture, providing a substrate having a first electrode disposed thereon, depositing an organic layer over the first electrode by evaporating the mixture in the container in a high vacuum deposition tool, and depositing a second electrode over the organic layer.

Abstract: A composition of materials including a first compound having a structure according to Formula I

Abstract: A mixture of carbazole and triazine derivatives that can be thermally evaporated from one crucible to fabricate thin films for electroluminescent devices is disclosed.

Abstract: The present invention provides a method for fabricating patterned cellulose nanocrystal (CNC) composite nanofibers and thin films for optical and electromagnetic sensor and actuator application, comprising the following steps of: selecting materials for fabricating patterned cellulose nanocrystal (CNC) composite nanofibers; and fabricating patterned CNCs composite nanofibers by incorporating secondary phases either during electrospinning or post-processing, wherein the secondary phases may include dielectrics, electrically or magnetically activated nanoparticles or polymers and biological cells mechanically reinforced by CNCs.

Abstract: A graft polymer is provided, which includes a polymer backbone with a plurality of hydroxy groups, protection group modified histidine grafted onto the side of the polymer backbone, and hydrophilic polymer having terminal reactive group grafted onto the side of the polymer backbone. The graft polymer coating can be applied to metal material to form a composite material, which can be implanted into an organism to reduce adhesion problems.

Abstract: A method for measuring an element concentration of a material includes: a material sample is irradiated with first electromagnetic waves; second electromagnetic waves radiated by the material sample are obtained under the action of the first electromagnetic waves; material property parameters of the material sample are determined by detecting the second electromagnetic waves; and an element concentration of the material sample is determined according to the material property parameters.

Abstract: A detection circuit for detecting a clock signal includes a multiplexer, a digital-to-analog converter, a comparator, and a counter. The multiplexer outputs either a first signal or a second signal as a selection signal. The digital-to-analog converter outputs a reference voltage according to the selection signal. The comparator compares the clock signal to the reference voltage to generate a comparison signal. The counter counts a reference clock signal to generate an overflow signal, and resets the overflow signal according to the comparison signal. The overflow signal indicates the amplitude of the clock signal.

Abstract: A novel compound selected from is disclosed.

Abstract: An electronic device may have a display with pixels configured to display an image. An image transport layer may be formed from a coherent fiber bundle or Anderson localization material. The image transport layer may overlap the pixels and may have an input surface that receives the image from the pixels and a corresponding output surface on which the received image is viewable. The image transport layer may form an exterior surface of the electronic device or may be overlapped by a transparent cover layer. Various methods such as swelling, piping, and slumping may be used to process fibers and form image transport layers. A fiber bundle that is used to form an image transport layer may include fibers that have varying properties.

Abstract: A programmable serial input-output controller is provided. A timer circuit performs a timing operation. An input pin is configured to receive an input signal from an external circuit. An output pin is configured to provide an output signal to the external circuit. In an output mode, the sequence controller provides an initial level to the output pin and controls the timer circuit to perform the timing operation. In response to a duration of the timer circuit performing the timing operation reaching first transmission time, the sequence controller inverts the level of the output pin and controls the timer circuit to re-perform the timing operation. In response to the duration of the timer circuit re-performing the timing operation reaching second transmission time, the sequence controller inverts the level of the output pin.

Abstract: An electronic device for controlling an LRA (Linear Resonant Actuator) includes a signal generator, a driver, a delay unit, a sensor, and a DSP (Digital Signal Processor). The signal generator generates a digital signal. The driver drives the LRA according to the digital signal. The delay unit delays the digital signal for a predetermined time, so as to generate an estimated voltage signal. The sensor detects the current flowing through the LRA, so as to generate a sensing current signal. The DSP controls the resonant frequency or the gain value of the signal generator according to the estimated voltage signal and the sensing current signal.

Abstract: A chip is provided. The chip includes a flexible substrate, a plurality of thin-film transistors, a redistribution layer, a first power rail layer, and a second power rail layer. The plurality of thin-film transistors are disposed on the flexible substrate. The redistribution layer is disposed above the plurality of thin-film transistors. The first power rail layer is disposed above the redistribution layer. The first power rail layer provides a first voltage to the plurality of thin-film transistors. The second power rail layer is disposed above the first power rail layer. The second power rail layer provides a second voltage to the plurality of thin-film transistors, wherein the second power rail layer is disposed in a grid shape.

Abstract: A composition formed of a mixture of two compounds having similar thermal evaporation properties that are pre-mixed into an evaporation source that can be used to co-evaporate the two compounds into an emission layer in OLEDs via vacuum thermal evaporation process is disclosed.

Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface of the evaporator, and the heat source is thermally contacted with the recess to transfer a heat generated from the heat source to the recess of the evaporator. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passing through a portion of the inner space of the evaporator corresponding to the recess absorbs the heat and is transformed into vapor.

Abstract: A wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.

Abstract: A light emitting diode (LED) package structure includes a first insulating layer, a first conductive pattern, a second insulating layer, a second conductive pattern, an LED element, and a solder material. The first conductive pattern has a first portion and a second portion, the first portion fills a through hole of the first insulating layer, and the second portion is disposed on the first insulating layer. The second insulating layer is disposed on the first insulating layer and covers the first conductive pattern. The second portion of the first conductive pattern is sandwiched between the first insulating layer and the second insulating layer. The second conductive pattern is disposed on the second insulating layer and is electrically connected to the first conductive pattern. The LED element is bonded to the second conductive pattern. The solder material is disposed on the first portion of the first conductive pattern.