Abstract: A dual sensor imaging system and an imaging method thereof are provided. The method includes: identifying an imaging scene; controlling a color sensor and an IR sensor to respectively capture color images and IR images by adopting capturing conditions suitable for the imaging scene; calculating a signal-to-noise ratio (SNR) difference between each color image and the IR images, and a luminance mean value of each color image; selecting the color image and IR image captured under capturing conditions of having the SNR difference less than an SNR threshold and the luminance mean value greater than a luminance threshold to execute a feature domain transformation to extract partial details of the imaging scene; and fusing the selected color image and IR image to adjust the partial details of the color image according to a guidance of the partial details of the IR image to obtain a scene image with full details.

Abstract: A dual sensor imaging system and a calibration method thereof are provided. The dual sensor imaging system includes at least one color sensor, at least one infrared ray (IR) sensor, a storage device, and a processor. The processor is configured to load and execute a computer program stored in the storage device to: control the color sensor and the IR sensor to respectively capture multiple color images and multiple IR images of an imaging scene by adopting multiple capturing conditions; calculate multiple color image parameters of the color image captured under each capturing condition and multiple IR image parameters of the IR image captured under each capturing condition to be used to calculate a difference between a brightness of the color image and a brightness of the IR image; and determine an exposure setting suitable for the color sensor and the IR sensor according to the calculated difference.

Abstract: A dual sensor imaging system and an imaging method thereof are provided. The dual sensor imaging system includes at least one color sensor, at least one infrared ray (IR) sensor, a storage device, and a processor. The processor is configured to load and execute a computer program stored in the storage device to: identify an imaging scene of the dual sensor imaging system; control the color sensor and the IR sensor to respectively capture multiple color images and multiple IR images by adopting multiple exposure conditions suitable for the imaging scene; adaptively select a combination of the color image and the IR image that can reveal details of the imaging scene; and fuse the selected color image and IR image to generate a scene image with details of the imaging scene.

Abstract: A lead frame includes a die paddle, a plurality of leads, at least one connector and a bonding layer. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle and an outer lead portion opposite to the inner lead portion. The connector is connected to the die paddle and the inner lead portions of the leads. The bonding layer is disposed on a lower surface of the die paddle and a lower surface of each of the outer lead portions.

Abstract: The present disclosure provides a semiconductor package structure having a semiconductor die having an active surface, a conductive bump on the active surface, configured to electrically couple the semiconductor die to an external circuit, the conductive bump having a bump height, a dielectric encapsulating the semiconductor die and the conductive bump, and a plurality of fillers in the dielectric, each of the fillers comprising a diameter, wherein a maximum diameter of the fillers is smaller than the bump height.

Abstract: Coatings and compositions are provided for coating particulates that can be used as, for example, as proppants. The proppants can be used, for example, to extract oil and gas from subterranean formations.

Abstract: A semiconductor package structure includes a semiconductor die surface having a narrower pitch region and a wider pitch region adjacent to the narrower pitch region, a plurality of first type conductive pillars in the narrower pith region, each of the first type conductive pillars having a copper-copper interface, and a plurality of second type conductive pillars in the wider pitch region, each of the second type conductive pillars having a copper-solder interface. A method for manufacturing the semiconductor package structure described herein is also disclosed.

Abstract: The present disclosure provides a semiconductor package structure having a semiconductor die having an active surface, a conductive bump on the active surface, configured to electrically couple the semiconductor die to an external circuit, the conductive bump having a bump height, a dielectric encapsulating the semiconductor die and the conductive bump, and a plurality of fillers in the dielectric, each of the fillers comprising a diameter, wherein a maximum diameter of the fillers is smaller than the bump height.

Abstract: Embodiments disclosed herein provide coated particles that can be used, for example, in the extraction of oil and gas from subterranean formations.

Abstract: A semiconductor package structure includes: (1) a first substrate; (2) at least one first semiconductor element attached to the first substrate; and (3) a second substrate including a plurality of thermal vias and a plurality of conductive vias, wherein one end of each of the thermal vias directly contacts the first semiconductor element.

Abstract: A server system, a server device, and a power supply recovery method therefor are provided. The server system includes a plurality of servers and a power controller. Each of the servers includes an AC power supply and a DC power supply. The DC power supplies of the servers are mutually connected through a cable. The power controller communicates with the servers. When a specific server detects that the AC power supply belonging thereto does not operate normally, the power controller informs other servers of a power required by the specific server, and the specific server controls the DC power supply belonging thereto to obtain powers provided from other servers through the cable, so as to maintain the operation of the specific server.

Abstract: Coatings and compositions for coating particulates are described that can be used as, for example, as proppants to, for example, extract oil and gas from subterranean formations. The coatings can be, for example, an inner coating adjacent to the particulate comprising a polyurethane and an outer coating comprising an polyurethane dispersion; a coating comprising a polyurethane admixed with a polyurethane dispersion; or a polyurethane dispersion layer and is free of an inner polyurethane layer.

Abstract: Materials and methods for preparing reactive lignin and for preparing a bio-based adhesive are described herein.

Abstract: Embodiments disclosed herein provide coated particles that can be used, for example, in the extraction of oil and gas from subterranean formations.

Abstract: A method of manufacturing a semiconductor package includes: (a) providing a carrier; (b) disposing a dielectric layer and a conductive pad on the carrier; (c) disposing a redistribution layer on the dielectric layer to electrically connect to the conductive pad; (d) connecting a die to the redistribution layer; (e) removing at least a portion of the carrier to expose the conductive pad; and (f) disposing an electrical contact to electrically connect to the conductive pad.

Abstract: Materials and methods for preparing reactive lignin and for preparing a bio-based adhesive are described herein.

Abstract: An automated website data collection method uses a hybrid web crawler strategy to obtain a probability distribution of a webpage tag of a webpage of a website to obtains an important feature of the website, and then extracts a text content of important features of the website, and forms a seed vocabulary data set using a composite semantic model. A thematic vocabulary data set having high frequency and highly representative hierarchical structure is further generated by the seed vocabulary data set, and the thematic vocabulary data can be further presented by the visualized system to show the hierarchical structure of thematic vocabulary data set.

Abstract: A touchpad device includes a touch module, communication unit, memory unit, and processing unit. The processing unit receives a touch input sensed by the touch module, performing touch operation detection, and sending one or more operation signals to a terminal device through the communication unit. The processing unit, when detecting a first touch operation occurs on a first mouse button region and ends, sends an operation signal including indication of continuous pressing of a virtual mouse button. The processing unit, when detecting a second touch operation is a sliding movement of a single touch point after the first touch operation ends, sends coordinates-related messages of the sliding movement. The processing unit, when detecting a third touch operation after the first touch operation ends, sends operation signals including a message indicating release of the virtual mouse button and a message indicating an instruction corresponding to the third touch operation.

Abstract: A method of producing ceria nanocrystals is provided. The method includes providing a gas that includes ozone to a solution that includes a cerium salt, and obtaining ceria nanocrystals from the solution after the gas is provided to the first solution. A method of producing nanoparticles is provided. The method includes providing a gas that includes ozone to a solution that includes a metal salt that includes at least one of a transition metal or a lanthanide, and producing at least one of metal oxide nanoparticles, metal oxynitrate nanoparticles, or metal oxyhydroxide nanoparticles from the solution after the gas is provided to the solution.

Abstract: A semiconductor package structure includes: (1) a first substrate; (2) at least one first semiconductor element attached to the first substrate; and (3) a second substrate including a plurality of thermal vias and a plurality of conductive vias, wherein one end of each of the thermal vias directly contacts the first semiconductor element.