Abstract: Systems and methods for an Internet of Things (IoT), smart home climate control and communication system are provided. The IoT, smart home climate control and communication system includes a first smart home device that receives signal sources from a wide area network, transmits signals, data and commands to one or more smart home devices in a home or building in an IoT LAN. The first smart home device also receives signals, data and commands from the one or more smart home devices in the home or building on the IoT LAN, and transmits signals, data and/or commands to the wide area network. The IoT LAN is distinct from a residential wireless LAN.

Abstract: A semiconductor package structure includes a first substrate, at least one first semiconductor element and a second substrate. The first semiconductor element is attached to the first substrate. The second substrate defines a cavity and includes a plurality of thermal vias. One end of each of the thermal vias is exposed in the cavity, and the first semiconductor element is disposed within the cavity and thermally connected to the thermal vias.

Abstract: A touchpad device includes a touch module, communication unit, memory unit, and processing unit. The processing unit receives a touch input sensed by the touch module, performing touch operation detection, and sending one or more operation signals to a terminal device through the communication unit. The processing unit, when detecting a first touch operation occurs on a first mouse button region and ends, sends an operation signal including indication of continuous pressing of a virtual mouse button. The processing unit, when detecting a second touch operation is a sliding movement of a single touch point after the first touch operation ends, sends coordinates-related messages of the sliding movement. The processing unit, when detecting a third touch operation after the first touch operation ends, sends operation signals including a message indicating release of the virtual mouse button and a message indicating an instruction corresponding to the third touch operation.

Abstract: A ceiling fan includes a body having a disk which is driven by a motor. Multiple frames are connected to the disk and each frame has a rod which is connected between at least two seats and the disk. The at least two seats each are positioned by an inclination angle relative to a horizontal plane. A height difference is formed between the at least two seats of each rod. A blade is connected to each of the at least two seats of each rod of each frame. The ceiling fan includes less number of seats while more blades are connected to the seats.

Abstract: An image capture device and a calibration method of phase detection autofocus thereof are provided. A contrast-based autofocus procedure is executed to move a lens to multiple lens positions, and a statistical distribution of focus values is obtained based on the contrast-based autofocus procedure. Whether the phase linear relationship for a phase detection autofocus procedure is calibrated is determined according to the statistical distribution of the focus values. If yes, then a first phase difference detected when the lens is located at one of the lens positions is obtained, and a second phase difference detected when the lens is located at another one of the lens positions is obtained. The phase linear relationship of the phase detection autofocus procedure is calibrated according to the one of the lens positions, the first phase difference, the other one of the lens positions, and the second phase difference.

Abstract: A semiconductor package structure includes a first substrate, at least one first semiconductor element and a second substrate. The first semiconductor element is attached to the first substrate. The second substrate defines a cavity and includes a plurality of thermal vias. One end of each of the thermal vias is exposed in the cavity, and the first semiconductor element is disposed within the cavity and thermally connected to the thermal vias.

Abstract: The measurement equipment includes a rack, a first image capturing device, a second image capturing device, a third image capturing device and a fourth image capturing device. Wherein, the first image capturing device and the second image capturing device capture an entire image of a to-be-measured object, the third image capturing device and the fourth image capturing device capture a plurality of local images of a plurality of local areas of the to-be-measured object, and the entire image and the local images and are simultaneously captured.

Abstract: Disclosed herein is an anthracene-based organic dye represented by Formula (1): wherein the substituents contained in Formula (1) are as defined herein. The anthracene-based organic dye may be used as a photosensitizer in dye-sensitized solar cells to effectively absorb light having a wavelength range which covers the entire visible light wavelength range and which even expands to a near infrared wavelength range and convert the absorbed light into photoelectric current.

Abstract: An optimization method of image depth information and an image processing apparatus are provided. A to-be-repaired depth map generated based on a left image and a right image is obtained. A superpixel segmenting process is performed on the left image or the right image to obtain multiple superpixels. A plurality of image segments are obtained by aggregating the superpixels according to pixel information in the superpixels. A hole filling process is performed on holes of the to-be-repaired depth map to obtain a hole-filled depth map. A statistical analysis is performed on first valid depth values of the to-be-repaired depth map and second valid depth values of the hole-filled depth map to obtain a plurality of optimized depth values by using the ranges of the image segments, the ranges of the superpixels, the to-be-repaired depth map, and the hole-filled depth map.

Abstract: A server system, a server device, and a power supply recovery method therefor are provided. The server system includes a plurality of servers and a power controller. Each of the servers includes an AC power supply and a DC power supply. The DC power supplies of the servers are mutually connected through a cable. The power controller communicates with the servers. When a specific server detects that the AC power supply belonging thereto does not operate normally, the power controller informs other servers of a power required by the specific server, and the specific server controls the DC power supply belonging thereto to obtain powers provided from other servers through the cable, so as to maintain the operation of the specific server.

Abstract: A semiconductor package device includes a first interconnection structure, a non-silicon interposer and a first die. The first interconnection structure has a first pitch. The non-silicon interposer surrounds the first interconnection structure. The non-silicon interposer includes a second interconnection structure having a second pitch. The second pitch is larger than the first pitch. The first die is above the first interconnection structure and is electrically connected to the first interconnection structure.

Abstract: A semiconductor package device includes a first interconnection structure, a non-silicon interposer and a first die. The first interconnection structure has a first pitch. The non-silicon interposer surrounds the first interconnection structure. The non-silicon interposer includes a second interconnection structure having a second pitch. The second pitch is larger than the first pitch. The first die is above the first interconnection structure and is electrically connected to the first interconnection structure.

Abstract: The present disclosure relates to a semiconductor package and a manufacturing method thereof. The semiconductor package includes a semiconductor element including a main body, a plurality of conductive vias, and at least one filler. The conductive vias penetrate through the main body. The filler is located in the main body, and a coefficient of thermal expansion (CTE) of the filler is different from that of the main body and the conductive vias. Thus, the CTE of the overall semiconductor element can be adjusted, so as to reduce warpage.

Abstract: A semiconductor device package includes a package substrate, a first electronic device, a second electronic device and a first molding layer. The package substrate includes a first surface, a second surface opposite to the first surface, and an edge. The first electronic device is positioned over and electrically connected to the package substrate through the first surface. The second electronic device is positioned over and electrically connected to the first electronic device. The first molding layer is positioned over the package substrate, and the first molding layer encapsulates a portion of the first surface and the edge of the package substrate.

Abstract: A water-flow power device includes a carrier, a first sprocket component, a second sprocket component, a first chain, a second chain, a plurality of blade structures, and an energy conversion unit. The carrier has a first end portion and a second end portion opposite to the first end portion. The first sprocket component is disposed at the first end portion of the carrier. The second sprocket component is disposed at the second end portion of the carrier. The first chain is configured to surround the first sprocket component and the second sprocket component. The second chain is configured to surround the first sprocket component and the second sprocket component. Two ends of each of the blade structures are respectively connected to the first chain and the second chain. The energy conversion unit is connected to the first sprocket component or the second sprocket component.

Abstract: An image capture device and a calibration method of phase detection autofocus thereof are provided. A contrast-based autofocus procedure is executed to move a lens to multiple lens positions, and a statistical distribution of focus values is obtained based on the contrast-based autofocus procedure. Whether the phase linear relationship for a phase detection autofocus procedure is calibrated is determined according to the statistical distribution of the focus values. If yes, then a first phase difference detected when the lens is located at one of the lens positions is obtained, and a second phase difference detected when the lens is located at another one of the lens positions is obtained. The phase linear relationship of the phase detection autofocus procedure is calibrated according to the one of the lens positions, the first phase difference, the other one of the lens positions, and the second phase difference.

Abstract: A blade structure of a water flow power generation system includes a blade body and a tail flap. The blade body has a side porion. The tail flap has a side connection portion. The side connection portion is pivotally connected to the side portion of the blade body.

Abstract: A method of manufacturing a semiconductor package includes: (a) providing a carrier; (b) disposing a dielectric layer and a conductive pad on the carrier; (c) disposing a redistribution layer on the dielectric layer to electrically connect to the conductive pad; (d) connecting a die to the redistribution layer; (e) removing at least a portion of the carrier to expose the conductive pad; and (f) disposing an electrical contact to electrically connect to the conductive pad.

Abstract: Disclosed herein is an anthracene-based organic dye represented by Formula (1): wherein the substituents contained in Formula (1) are as defined herein. The anthracene-based organic dye may be used as a photosensitizer in dye-sensitized solar cells to effectively absorb light having a wavelength range which covers the entire visible light wavelength range and which even expands to a near infrared wavelength range and convert the absorbed light into photoelectric current.

Abstract: Coatings and compositions are provided for coating particulates that can be used as, for example, as proppants. The proppants can be used, for example, to extract oil and gas from subterranean formations.