Abstract: An electronic device is provided. The electronic device includes a plurality of expansion connector modules, a power supply path switch circuit, a system load and a controller. The power supply path switch circuit includes a plurality of input ends connected to output ends of expansion connector modules respectively. The system load is coupled to the power supply path switch circuit. The controller is coupled to the expansion connector module and the power supply path switch circuit. The controller determines whether a first power supply source is coupled to one of the expansion connector modules through the expansion connector modules. When the first power supply source is connected to the one of the expansion connector modules, the controller detects the power of the first power supply source via the expansion connector module connected to the first power supply source.

Abstract: Various integrated circuit (IC) design methods are disclosed herein. An exemplary method includes receiving an IC design layout having an IC feature to be formed on a wafer using a lithography process and inserting a spacing in the IC feature, thereby generating a modified IC design layout that divides the IC feature into a first main feature and a second main feature separated by the spacing. The spacing has a sub-resolution dimension, such that the IC feature does not include the spacing when formed on the wafer by the lithography process using the modified IC design layout. A mask can be fabricated based on the modified IC design layout, wherein the mask includes the first main feature and the second main feature separated by the spacing. A lithography process can be performed using the mask to form the IC feature (without the spacing) on a wafer.

Abstract: A data writing method, a memory control circuit unit and a memory storage apparatus are provided. The method includes: receiving a first write command and first data corresponding to the first write command, and writing the first data into a third physical erasing unit in first physical erasing units; and if a usage frequency of a fourth physical erasing unit in the first physical erasing units is less than a predetermined value, performing a data arrangement operation corresponding to the first write command to copy second data stored by the fourth physical to at least one of second physical erasing units.

Abstract: A device includes a semiconductor substrate, a plurality of micro-lenses disposed on the substrate, each micro-lens being configured to direct light radiation to a layer beneath the plurality of micro-lenses. The device further includes a transparent layer positioned between the plurality of micro-lenses and the substrate, the transparent layer comprising a structure that is configured to block light radiation that is traveling towards a region between adjacent micro-lenses, wherein the structure and the transparent material are coplanar at respective top surfaces and bottom surfaces thereof.

Abstract: A locking structure for an injection pen. The locking structure for an injection pen is disposed among a spiral duct (30), a push rod (81) and a propelling lever (60) of a circularly-pushing device (1) of the injection pen. The propelling lever (60) penetrates in a tube center hole (331) of a linkage wall (33) in the spiral duct (30) by means of a dosage control section (63) having a push thread (631). The push rod (81) penetrates in the propelling lever (60) by means of a rod portion (811). The locking structure comprises a necking ring portion (36), a buckling recessed portion (814), and an elastic clasp (612). The necking ring portion (36) is formed at the rear side surface of the linkage wall (33) in the spiral duct (30). The buckling recessed portion (814) is formed in the front section of the rod portion (811) of the push rod (81). The elastic clasp (612) is formed in the rear end of the propelling lever (60) adjacent to the dosage control section (63).

Abstract: An injection pen comprises a circularly pushing device (1) and a vial housing (2), and is used to combine a medication vial (3) with a needle (4). The circularly pushing device (1) comprises a jointing member (10), a spiral sleeve (20), a spiral duct (30), a spirally-pushing tube (40), a threaded-connection shrink-ring (50), a propelling lever (60), a one-way ratchet ring (70), and an injection operation member (80). During the injection, the one-way ratchet ring (70) on a push rod (81) is jointed with a one-way ratchet groove portion (46) of the spirally-pushing tube (40) so as to restrain the rotation directions of the push rod (81) and the spirally-pushing tube (40); the propelling lever (60) cannot be rotated due to the limit of the jointing member (10).

Abstract: A data writing method, a memory control circuit unit and a memory storage apparatus are provided. The method includes: receiving a first write command and first data corresponding to the first write command, and writing the first data into a third physical erasing unit in first physical erasing units; and if a usage frequency of a fourth physical erasing unit in the first physical erasing units is less than a predetermined value, performing a data arrangement operation corresponding to the first write command to copy second data stored by the fourth physical to at least one of second physical erasing units.

Abstract: Provided is an integrated circuit (IC) design method. The method includes receiving a design layout of the IC, the design layout having a first main feature, and adding a negative assist feature to the design layout, wherein the negative assist feature has a first width, the negative assist feature divides the first main feature into a second main feature and a third main feature by the first width, and the first width is sub-resolution in a photolithography process.

Abstract: The present disclosure relates to a method of forming a micro-electro mechanical system (MEMs) structure. In some embodiments, the method may be performed by providing a device substrate having a first MEMS device and a second MEMS device, and by providing a capping structure having a first cavity and a second cavity. The capping structure is bonded to the device substrate, such that the first cavity is arranged over the first MEMS device and the second cavity is arranged over the second MEMS device. A first pressure is established within the first cavity and the second cavity. A vent is selectively etched within the capping structure to change the first pressure within the second cavity to a second pressure, which is different from the first pressure.

Abstract: The present invention discloses a phenanthroline-based compound and an organic EL device employing the compound as phosphorescent light emitting host material of a light emitting layer and/or electron transporting layer material and/or hole blocking layer material and/or a thermally activated delayed fluorescence (TADF) material of a light emitting layer which can display good performance.

Abstract: The present invention discloses an indenotriphenylene-based amine derivative represented by the following formula (A): wherein R1 to R5, m, n, p, L and Ar are the same definition as described in the present invention. The present invention also discloses an organic EL device employing the indenotriphenylene-based amine derivative as a hole transport material or an electron blocking material, which can lower driving voltage and power consumption and increase efficiency and half-life time.

Abstract: A device includes a semiconductor substrate, a plurality of micro-lenses disposed on the substrate, each micro-lens being configured to direct light radiation to a layer beneath the plurality of micro-lenses. The device further includes a transparent layer positioned between the plurality of micro-lenses and the substrate, the transparent layer comprising a structure that is configured to block light radiation that is traveling towards a region between adjacent micro-lenses, wherein the structure and the transparent material are coplanar at respective top surfaces and bottom surfaces thereof.

Abstract: The present invention generally discloses an organic optoelectronic material and organic electroluminescent (herein referred to as organic EL) device, organic photovoltaics (herein referred to as OPV) device and organic thin-film transistor (herein referred to as OTFT) device using the organic optoelectronic material. More specifically, the present invention relates to the organic optoelectronic material formula (1), and an organic EL device, OPV device and OTFT device employing the organic optoelectronic material can improve performance.

Abstract: The present disclosure relates to a method of forming a micro-electro mechanical system (MEMs) structure. In some embodiments, the method may be performed by providing a device substrate having a first MEMS device and a second MEMS device, and by providing a capping structure having a first cavity and a second cavity. The capping structure is bonded to the device substrate, such that the first cavity is arranged over the first MEMS device and the second cavity is arranged over the second MEMS device. A first pressure is established within the first cavity and the second cavity. A vent is selectively etched within the capping structure to change the first pressure within the second cavity to a second pressure, which is different from the first pressure.

Abstract: A method includes forming a plurality of pixels formed on a front surface of a semiconductor substrate, forming an array of color filters over the plurality of pixels, each color filter being adapted for allowing a wavelength of light radiation to reach at least one of the plurality of pixels, forming a plurality of micro-lenses over the array of color filters, and forming a second layer between the pixels and the color filters. The second layer further includes a structure adapted for blocking light radiation that is traveling towards a region between adjacent micro-lens, further wherein the plurality of micro-lenses are in contact with the array of color filters, and wherein the structure and the transparent material are coplanar at respective top surfaces thereof, and further wherein the structure directly contacts a bottom surface of at least one of the color filters.

Abstract: The present invention discloses a novel phenanthroline-based compound is represented by the following formula(I), the organic EL device employing the phenanthroline-based compound as hole blocking material/electron transport material or phosphorescent host can display good performance. L, m, n, X, Y and R1 to R20 each have the same meaning as described in the present invention.

Abstract: Some embodiments relate to multiple MEMS devices that are integrated together on a single substrate. A device substrate comprising first and second micro-electro mechanical system (MEMS) devices is bonded to a capping structure. The capping structure comprises a first cavity arranged over the first MEMS device and a second cavity arranged over the second MEMS device. The first cavity is filled with a first gas at a first gas pressure. The second cavity is filled with a second gas at a second gas pressure, which is different from the first gas pressure. A recess is arranged within a lower surface of the capping structure. The recess abuts the second cavity. A vent is arranged within the capping structure. The vent extends from a top of the recess to the upper surface of the capping structure. A lid is arranged within the vent and configured to seal the second cavity.

Abstract: A semiconductor device includes a device substrate and a conductive capping substrate. The device substrate includes at least one micro-electro mechanical system (MEMS) device. The conductive capping substrate is bonded to the device substrate and includes a cap portion covering the MEMS device, and a conductor portion in electrical contact with the device substrate.

Abstract: A method includes forming a plurality of pixels formed on a front surface of a semiconductor substrate, forming an array of color filters over the plurality of pixels, each color filter being adapted for allowing a wavelength of light radiation to reach at least one of the plurality of pixels, forming a plurality of micro-lenses over the array of color filters, and forming a second layer between the pixels and the color filters. The second layer further includes a structure adapted for blocking light radiation that is traveling towards a region between adjacent micro-lens, further wherein the plurality of micro-lenses are in contact with the array of color filters, and wherein the structure and the transparent material are coplanar at respective top surfaces thereof, and further wherein the structure directly contacts a bottom surface of at least one of the color filters.

Abstract: A semiconductor structure includes a first substrate, a second substrate, a first sensing structure over the first substrate, and between the first substrate and the second substrate, a via extending through the second substrate, and a second sensing structure over the second substrate, and including an interconnect structure electrically connected with the via, and a sensing material at least partially covering the interconnect structure.