Patents by Inventor Chin Wu

Chin Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11478966
    Abstract: A composite plate structure includes a composite plate and a resin component. The composite plate includes a first fiber layer, a second fiber layer and a core layer. The second fiber layer has a first region, wherein an area of the second fiber layer is smaller than an area of the first fiber layer. The core layer is disposed between the first fiber layer and the second fiber layer, wherein the core layer is exposed at the first region. The resin component is connected to the composite plate, wherein the resin component is combined with the core layer at the first region. In addition, a manufacturing method of the composite plate is also provided.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: October 25, 2022
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Jung-Chin Wu, Po-An Lin, Sheng-Hung Lee, Han-Ching Huang, Kuo-Nan Ling
  • Publication number: 20220332087
    Abstract: A composite material structure includes a first fiber layer, a second fiber layer, and a third fiber layer. The first fiber layer is composed of a first long fiber and a first resin material. The second fiber layer is composed of a second long fiber and a second resin material. The third fiber layer is disposed between the first fiber layer and the second fiber layer. The third fiber layer is composed of a short fiber and a third resin material. A length of the first long fiber and a length of the second long fiber are both greater than a length of the short fiber, and the length of the short fiber is less than or equal to 25 mm.
    Type: Application
    Filed: April 18, 2022
    Publication date: October 20, 2022
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Han-Ching Huang, Jung-Chin Wu, Kuo-Nan Ling, Sheng-Hung Lee
  • Patent number: 11471739
    Abstract: A punching-training device is provided, including: a support body, having a seat end and an assembling end; and a punching mechanism, including a first punched member which is freely rotatably assembled to the assembling end and a pad, the first punched member including a body portion disposed around the assembling end, the pad being disposed on and rotatable together with the body portion.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: October 18, 2022
    Assignee: AZUNI INTERNATIONAL CO., LTD.
    Inventor: Li-Chin Wu
  • Publication number: 20220325275
    Abstract: The present invention provides methods to barcode nucleic acid for detection and sequencing. It applies a barcode template in a compartment with various targets, including nucleic acid fragments, nuclei and/or cells. After clonal amplification within the compartment, barcode sequence will integrate into its targets before the compartment is broken so that it will effectively barcode nucleic acid fragments originated from a nucleic acid fragment, a nucleus or a cell clonally. The barcode information can be used for tracking the origin of the fragment, nucleus or cell and be used for haplotype phasing and a variety of single cell-based applications N including whole genome sequencing, targeted sequencing, RNA sequencing and immune repertoire sequencing.
    Type: Application
    Filed: June 4, 2020
    Publication date: October 13, 2022
    Inventors: Zhoutao Chen, Devin Porter, Guoya Mo, Tsai-Chin Wu
  • Publication number: 20220298545
    Abstract: The present disclosure provides methods and compositions for tracking nucleic acid fragment origin by target-specific barcode tagging when original nucleic acid targets break into small fragments. Nucleic acid targets are captured in vitro on a solid support with clonally localized nucleic acid barcode templates. Many nucleic acid targets can be processed simultaneously in a massively parallel fashion without partition. These nucleic acid target tracking methods can be used for a variety of applications in both whole genome sequencing and targeted sequencing in order to accurately identify genomic variants, haplotype phasing and assembly, for example.
    Type: Application
    Filed: August 19, 2020
    Publication date: September 22, 2022
    Inventors: Zhoutao Chen, Tsai-Chin Wu, Long Kim Pham, Yong Wang, Ming Lei
  • Publication number: 20220277933
    Abstract: A wafer treatment system is provided. The wafer treatment system includes a wafer treatment chamber defining a treatment area within which a wafer is treated. The wafer treatment system includes a gas injection system. The gas injection system includes a gas injector configured to inject a first gas, used for treatment of the wafer, into the treatment area. A first gas tube is configured to conduct the first gas at a first temperature to the gas injector. The gas injection system includes a heating enclosure enclosing the gas injector. A second gas tube is configured to conduct a heated gas to the heating enclosure to increase an enclosure temperature at the heating enclosure to a second enclosure temperature. A temperature of the first gas is increased in the gas injector from the first temperature to a second temperature due to the second enclosure temperature at the heating enclosure.
    Type: Application
    Filed: February 26, 2021
    Publication date: September 1, 2022
    Inventors: Po Hsun CHEN, Chun Wei CHOU, Keng-Ying LIAO, Tzu-Pin LIN, Tai Chin WU, Su-Yu YEH, Po-Zen CHEN
  • Patent number: 11423149
    Abstract: A method securely executing an extensible firmware application is performed by a computer apparatus. The computer apparatus includes a firmware volume and a boot loader. The firmware volume includes a firmware application module to be executed, has passed a security check, and is attached with a secure encryption signature. The boot loader is attached with a first valid digital signature, and is verifiable by a secure boot certificate signature database of the computer apparatus. When the firmware application module is executed, the boot loader or the secure boot certificate signature database of the computer apparatus first verifies a secure encryption signature of the firmware volume, and the boot loader then loads the firmware application module to a buffer memory for further reading and execution, such that execution of the firmware application module is allowed and is executed securely in a secure boot mode under supervision of the boot loader.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: August 23, 2022
    Assignee: INSYDE SOFTWARE CORP.
    Inventor: Wen-Chin Wu
  • Publication number: 20220257730
    Abstract: The present invention relates to a botulinum toxin type A complex, and a formulation thereof and a usage method therefor. The present invention provides the botulinum toxin type A complex, comprising an HA70 component, and an HA17 component, an HA33 component, an NTNH component, and a BoNT/A1 component, wherein the botulinum toxin complex has a molecular weight of 740-790 kDa. Compared with the existing botulinum toxin complexes, the botulinum toxin complex of the present invention is smaller in molecular weight and higher in safety, and has a comparable treatment effect.
    Type: Application
    Filed: March 31, 2020
    Publication date: August 18, 2022
    Inventors: Tzu-Wen Tsau, Yung-Kai Wang, Kuan-Cheng Shen, Yueh-Chin Wu, Cheng-Der Tony Yu, Yu-Chun Tseng
  • Publication number: 20220247903
    Abstract: An electronic device includes an outer casing, a sensing module, and a thermal insulation module. The sensing module includes a circuit board and a sensing unit and a heating unit which are disposed on the circuit board. The heating unit is configured to heat the sensing unit. The thermal insulation module is accommodated within the outer casing and includes a casing assembly and a thermal insulation filler. The sensing module is accommodated within the casing assembly. The thermal insulation filler is arranged between the circuit board of the sensing module and an inner surface of the casing assembly so as to contact and cover the heating unit.
    Type: Application
    Filed: March 29, 2021
    Publication date: August 4, 2022
    Inventors: Po-Liang Huang, Wen-Chin Wu, You-Xin Liu
  • Patent number: 11327802
    Abstract: Systems and methods for exporting logical object metadata. In one example, the system includes an electronic processor configured to receive a first input from a user. The first input includes a logical object location and at least one metadata export option. The electronic processor is also configured to create an export job based upon the first input. The electronic processor is also configured to store the export job in a job queue, determine when a computing resource is available to execute the export job, and execute the export job when the computing resource is available. The electronic processor is also configured to store a job manifest in a memory location. In one example, the job manifest includes metadata for each logical object located in the logical object location.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: May 10, 2022
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Wan Chin Wu, Hani Gamal Loza, Joe Keng Yap, Wenyu Cai, David Charles Oliver, Simon Bourdages
  • Publication number: 20220099621
    Abstract: A nucleic acid detection kit includes a kit body, a detection chip disposed in the kit body, and an electrophoresis box disposed outside of the kit body. The detection chip comprises a channel and is connected to the electrophoresis box. A microbead of testable material in solution undergoes a PCR amplification reaction, an electrophoretic process, and is fluoresced for highlighting, images of elements made fluorescent can be taken and displayed. A nucleic acid detection device which can receive the nucleic acid detection kit is also disclosed. The nucleic acid detection device has a simple structure suitable for home use, being portable, flexible, and convenient.
    Type: Application
    Filed: September 29, 2021
    Publication date: March 31, 2022
    Inventors: CHIA-HSIN CHANG, CHANG-CHIN WU, PENG-YU CHIU, CHING-CHU HUANG, WEI-HUA HSU
  • Patent number: 11226548
    Abstract: A projection screen for diffusing illumination light into a range of viewing angles is formed by depositing a coating on a substrate. Within the coating are particles having an average particle height. Protrusions at least two microns higher than the average particle height may be substantially uniformly distributed over the screen. In some embodiments, each protrusion may be no closer than 80 microns to another protrusion.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: January 18, 2022
    Assignee: RealD
    Inventor: Ching-Chin Wu
  • Publication number: 20210373443
    Abstract: A method for manufacturing a lithographic mask for an integrated circuit includes performing an optical proximity correction (OPC) process to an integrated circuit mask layout to produce a corrected mask layout. The method further includes performing an inverse lithographic technology (ILT) process to the corrected mask layout to enhance the corrected mask layout to produce an OPC-ILT-enhanced mask layout. The method also includes performing an inverse lithographic technology (ILT) process to the corrected mask layout to enhance the corrected mask layout to produce an OPC-ILT-enhanced mask layout.
    Type: Application
    Filed: August 16, 2021
    Publication date: December 2, 2021
    Inventors: Hsu-Ting HUANG, Tung-Chin WU, Shih-Hsiang LO, Chih-Ming LAI, Jue-Chin YU, Ru-Gun LIU, Chin-Hsiang LIN
  • Publication number: 20210359180
    Abstract: A pixel array substrate includes a base, pixel structures, first bonding pads, first wirings, and a first testing element. The pixel structures are disposed on an active area of a first surface of the base. The first bonding pads are disposed on a peripheral region of the first surface. Each of the first wirings is disposed on a corresponding first bonding pad, a first sidewall of the base, and a corresponding second bonding pad. The first testing element is disposed on the active area of the first surface and has a first testing line. The first testing line is electrically connected to at least one of the first bonding pads, and an end of the first testing line is substantially aligned with an edge of the base.
    Type: Application
    Filed: August 31, 2020
    Publication date: November 18, 2021
    Applicant: Au Optronics Corporation
    Inventors: Shang-Jie Wu, Hao-An Chuang, Yu-Chieh Kuo, He-Yi Cheng, Che-Chia Chang, Yi-Jung Chen, Yi-Fan Chen, Yu-Hsun Chiu, Mei-Yi Li, Yu-Chin Wu
  • Patent number: 11178122
    Abstract: A data encryption and decryption method is provided. The method is used in a data encryption and decryption system and includes: establishing, by a data encryption and decryption device, a first secure sockets layer (SSL) connection with a mobile device; receiving a data transmitted from the mobile device; generating a first symmetric key, encrypting the data using the first symmetric key, and generating first encrypted data; encrypting the first symmetric key using a first public key, and generating a first encrypted key; and transmitting the first encrypted data and the first encrypted key to the mobile device.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: November 16, 2021
    Assignee: I.X Co., Ltd.
    Inventors: Gwan-Hwan Hwang, Shih-Wei Wang, Tsu-Chin Wu
  • Publication number: 20210308257
    Abstract: The present invention relates to an immunogenic composition against severe acute respiratory syndrome coronavirus 2 (SARS-CoV-2), especially to an immunogenic composition having a recombinant SARS-CoV-2 S protein and adjuvant.
    Type: Application
    Filed: June 18, 2021
    Publication date: October 7, 2021
    Inventors: Tsun-Yung KUO, Charles CHEN, Chung-Chin WU, Yi-Jiun LIN, Meei-Yun Lin, Yu-Chi WU, John Darren CAMPBELL, Robert S. JANSSEN, David NOVACK
  • Publication number: 20210283482
    Abstract: A punching-training device is provided, including: a support body, having a seat end and an assembling end; and a punching mechanism, including a first punched member which is freely rotatably assembled to the assembling end and a pad, the first punched member including a body portion disposed around the assembling end, the pad being disposed on and rotatable together with the body portion.
    Type: Application
    Filed: March 13, 2020
    Publication date: September 16, 2021
    Inventor: LI-CHIN WU
  • Patent number: 11092899
    Abstract: A method for manufacturing a lithographic mask for an integrated circuit includes performing an optical proximity correction (OPC) process to an integrated circuit mask layout to produce a corrected mask layout. The method further includes performing an inverse lithographic technology (ILT) process to the corrected mask layout to enhance the corrected mask layout to produce an OPC-ILT-enhanced mask layout. The method also includes performing an inverse lithographic technology (ILT) process to the corrected mask layout to enhance the corrected mask layout to produce an OPC-ILT-enhanced mask layout.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: August 17, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsu-Ting Huang, Tung-Chin Wu, Shih-Hsiang Lo, Chih-Ming Lai, Jue-Chin Yu, Ru-Gun Liu, Chin-Hsiang Lin
  • Patent number: 11075348
    Abstract: Disclosed are a thin film transistor includes a gate electrode, an active layer including a semiconductor material and a first elastomer, a gate insulator between the gate electrode and the active layer, and a source electrode and a drain electrode electrically connected to the active layer, wherein each of the semiconductor material and the first elastomer has a hydrogen bondable moiety, and the semiconductor material and the first elastomer are subjected to a dynamic intermolecular bonding by a hydrogen bond and a thin film transistor array and an electronic device including the same.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: July 27, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Youngjun Yun, Xuzhou Yan, Jinyoung Oh, Zhenan Bao, Hung-Chin Wu
  • Patent number: D950360
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: May 3, 2022
    Assignee: GETAC TECHNOLOGY CORPORATION
    Inventors: Yu-Chin Wu, Hsien-Chen Hu