Abstract: A semiconductor device and method that comprise a first dielectric layer over a encapsulant that encapsulates a via and a semiconductor die is provided. A redistribution layer is over the first dielectric layer, and a second dielectric layer is over the redistribution layer, and the second dielectric layer comprises a low-temperature polyimide material.

Abstract: An optical device includes a first waveguide, ring-shaped waveguides adjacent to the first waveguide, and heaters coupled to the ring-shaped waveguides in one-to-one correspondence. A method includes coupling a first light source with a first wavelength to the first waveguide, increasing electric current through the heaters until a first one of the ring-shaped waveguides resonates, assigning the first one of the ring-shaped waveguides to the first wavelength, resetting the electric current through the heaters to the initial electric current, coupling a second light source with a second wavelength to the first waveguide wherein the second wavelength is different from the first wavelength, increasing the electric current through the heaters until a second one of the ring-shaped waveguides resonates wherein the second one of the ring-shaped waveguides is different from the first one of the ring-shaped waveguides, and assigning the second one of the ring-shaped waveguides to the second wavelength.

Abstract: An electronic device manufacturing system configured to obtain sensor data associated with a deposition process performed in a process chamber to deposit a film stack on a surface of a substrate. The film stack can include a known film pattern and an unknown film pattern. The manufacturing system is further configured to input the sensor data into a first trained machine-learning model to obtain a first output value of the first trained machine-learning model. The first output value can be associated with the known film pattern. The manufacturing system is further configured to input the first output value into a second trained machine-learning model to obtain a second output value of the second trained machine-learning model. The second output value can be indicative of metrology data of the known film pattern.

Abstract: The present disclosure provides a three-dimensional memory device and a method of fabricating the same, which includes a substrate, and a memory stack structure. The memory stack structure is disposed on the substrate, and includes a plurality of stack units sequentially stacked into a staircase shape, wherein each of the stack units has a stepped slope, the stepped slope of any one of the stack units disposed in a related lower position is less than the stepped slope of another one of the stack units disposed over the one of the stack units. Through this arrangements, the three-dimensional memory device may therefore obtain an optimized structural integrity, as well as improved component efficiency.

Abstract: A business data exchange system and a business data exchange method are provided. The business data exchange system includes a software as a service processor and a tenant processor. The software as a service processor is coupled to a software as a service application program. The tenant processor is coupled to the software as a service processor and an application system. When the software as a service application program calls an application program of the application system, the software as a service processor transmits call information to the tenant processor. The tenant processor receives the call information and parses the call information to call the application system and transmit the call information to the application system. The application system parses the call information and performs logical processing to generate business data, and the application system returns the business data to the software as a service application program.

Abstract: A sensing electronic device includes a substrate, and a reference voltage control unit. The sensing array is arranged on the substrate, and includes a first sensing electrode and a second sensing electrode. The reference voltage control unit is electrically connected to the sensing array. In an operation period, the reference voltage control unit has a first voltage, the first sensing electrode has a second voltage, and the second sensing electrode has a third voltage, wherein a difference between the first voltage and the second voltage is different from a difference between the first voltage and the third voltage.

Abstract: A failure diagnostic system of a motor encoder is disclosed and includes a motor, an encoder, a servo driver, and a safety module. The servo driver controls the motor through a current command. The safety module continuously obtains a feedback position of the motor through the encoder. When the safety module determines based on the feedback position that the current state of the motor is consistent with a pre-determined disturbance condition, the safety module requests the servo driver to output an additional current command to disturb the motor. Next, the safety module determines whether the encoder is failure based on a variation of following feedback position.

Abstract: A sensing module, a memory device, and a sensing method are provided to perform a read operation so that the un-programmed/programmed state of a memory cell is identified. The sensing module includes a sensing amplifier and a current sink, and both are electrically connected to the memory cell. The sensing amplifier generates a sensing current and identifies the un-programmed/programmed state of the memory cell accordingly. The current sink receives a reference current being equivalent to the summation of the sensing current and a cell current flowing through the memory cell. The reference current is constant, and the sensing current is changed with the cell current. The cell current is generated based on a high read voltage and a low read voltage applied to the memory cell. The sensing current is higher if the memory cell is un-programmed, and the sensing current is lower if the memory cell is programmed.

Abstract: A method for a system information (SI) request procedure performed by a user equipment (UE) is provided. The method includes: receiving a system information block type 1 (SIB1) from a cell; transmitting, to the cell, a first message including a common control channel (CCCH) service data unit (SDU)that includes a radio resource control (RRC) SI request message; receiving, from the cell, a medium access control (MAC) control element (CE) including a UE contention resolution identity; and indicating, by a MAC entity of the UE, reception of an acknowledgment for the RRC SI request message to an RRC entity of the UE after determining that the UE contention resolution identity matches multiple consecutive bits, starting from the most significant bit (MSB), of the CCCH SDU. The SIB1 does not include information related to a Random Access (RA) resource specific to SI requested by the RRC SI request message.

Abstract: An electronic package is provided, and the manufacturing method of which is to form a plurality of conductive pillars and dispose an electronic element on a first circuit structure, then cover the plurality of conductive pillars and the electronic element with a cladding layer, and then form a second circuit structure on the cladding layer, so that the plurality of conductive pillars are electrically connected to the first circuit structure and the second circuit structure, and the electronic element is electrically connected to the first circuit structure, where a fan-out redistribution layer is configured in the first circuit structure and the second circuit structure, and at least one ground layer is configured in the second circuit structure. Further, the ground layer includes a plurality of sheet bodies arranged in an array, so that at least one slot is disposed between every two adjacent sheet bodies.

Abstract: An optical detection device and an operation method thereof is disclosed. The optical detection device includes a light source, an optical coupling element, a reference optical path modulation element and a data processing element. The light source provides an incident light. The optical coupling element divides the incident light into a reference light and a detection light and emits them to the reference optical path modulation element and the sample to be tested respectively. The reference optical path modulation element reflects the reference light and rapidly changes the light path of reference light. The optical coupling element interferes the reference light reflected by the reference optical path modulation element and the detection light reflected by the sample to be tested to generate an optical interference signal. The data processing element receives and analyzes the optical interference signal to obtain an optical detection result about the sample to be tested.

Abstract: A semiconductor device and method of forming the same are disclosed. The semiconductor device includes a substrate, an isolation structure over the substrate, a fin extending from the substrate, and an epitaxial feature over the fin. The epitaxial feature comprises a lower portion and an upper portion. The lower portion extends from the fin and extends above the isolation structure. The upper portion is over the lower portion. The upper portion extends partially through the lower portion in a cross section perpendicular to a lengthwise direction of the fin.

Abstract: The present disclosure provides a photo sensing device, the photo sensing device includes a substrate, including a silicon layer at a front surface, a photosensitive member extending into and at least partially surrounded by the silicon layer, a first doped region having a first conductivity type at a first side of the photosensitive member, wherein the first doped region is in the silicon layer, and a second doped region having a second conductivity type different from the first conductivity type at a second side of the photosensitive member opposite to the first side, wherein the second doped region is in the silicon layer, and the first doped region is apart from the second doped region, and a superlattice layer disposed between the photosensitive member and the silicon layer, wherein the superlattice layer includes a first material and a second material different from the first material.

Abstract: An optical keyswitch includes a keycap, a support mechanism, and a switch module. The support mechanism is disposed below the keycap and configured to support the keycap moving upward and downward, the support mechanism comprising a first frame and a second frame, the first frame having a sliding end. The switch module includes a circuit board, an emitter, and a receiver, the emitter and the receiver are electrically connected to the circuit board, and the emitter emitting an optical signal to the receiver. When the keycap is pressed, the first frame is driven by the keycap to slide substantially parallel to the circuit board and block the optical signal with the sliding end, so the switch module is triggered to generate a triggering signal.

Abstract: A mouse pad suitable for operating with a wireless mouse is provided. The mouse pad includes a first charging circuit, a second charging circuit, a control circuit, a power supply module, a conversion circuit and a main body. The first charging circuit, the second charging circuit and the conversion circuit are each electrically connected to the control circuit, and the power supply module is electrically connected to the conversion circuit. The first charging circuit and the second charging circuit each outputs an electromagnetic energy to the wireless mouse. When the control circuit receives a load current flowing through the first charging circuit and the load current flowing through the second charging circuit, through the control circuit, a power supply current of the power supply module to the first charging circuit and to the second charging circuit are dynamically adjusted.

Abstract: The present disclosure provides an interference filter, a lithography system incorporating an interference filter, and a method of fabricating an interference filter. The interference filter includes a transparent substrate having a front surface and a back surface, a plurality of alternating material layers formed over the front surface of the transparent substrate that form a bandpass filter, and an anti-reflective structure formed over the back surface of the transparent substrate. The alternating material layers alternate between a relatively high refractive index material and a relatively low refractive index material.

Abstract: A manufacturing method of a semiconductor package is provided. The manufacturing method includes the following. A plurality of semiconductor components are provided. Each semiconductor component has at least one conductive bump. A substrate is provided. The substrate has a plurality of conductive pads. A transfer device is provided. The transfer device transfers the semiconductor components onto the substrate. A heating device is provided. The heating device heats or pressurizes at least two semiconductor components. During transferring of the semiconductor components to the substrate, the at least one conductive bump of each semiconductor component is docked to a corresponding one of the conductive pads.

Abstract: An air compressor contains: a body, a cylinder, a motor, and a transmission mechanism. The body includes multiple positioning orifices which are a first positioning orifice and a second positioning orifice. The cylinder is connected on the body and communicates with an air storage holder. The motor is fixed on the body, a small gear is received in the first positioning orifice, and a connection seat of the motor is accommodated in the first orifice. The transmission mechanism actuates the piston to move in the cylinder reciprocately so as to produce compressed airs. The motor further includes multiple fixing portions extending from a head edge of the casing thereof and configured to engage with the body, thus fixing the motor on the body securely without using any screws.