Abstract: A method of channel state information (CSI) report can include receiving a CSI report configuration at a user equipment (UE) from a base station, the CSI report configuration being associated with a set of CSI reference signal (CSI-RS) resources corresponding to multiple transmission reception points (TRPs), performing a channel measurement based on the CSI-RSs resources corresponding to the multiple TRPs, determining a precoder matrix indicator (PMI) based on measurement results of the channel measurement, the PMI corresponding to a precoder matrix, denoted W, of a Type II CSI codebook, the precoder matrix having a spatial domain (SD) basis vector matrix, denoted W1, SD basis selection of the SD basis vector matrix being TRP-specific, and transmitting a CSI report to the base station, the CSI report including the PMI.

Abstract: An information handling system uses one connector for both liquid and air cooling and detects the type of cooling system installed. That provides the ability to choose the correct thermal handling table based on the installed cooling system. To detect the type of cooling system installed, a thermal management controller sets a control signal supplied to the cooling system through the connector to a first control value and determines if a tachometer signal supplied by the cooling system to the thermal management controller through the connector indicates a first type of cooling system. If the first type of cooling system is not detected, the thermal management controller checks if the tachometer signal from the cooling system with the control signal set at the first control value, or alternatively at a second control value, indicates a second type of cooling system. If no cooling system is detected, an error condition exists.

Abstract: In some embodiments, the present disclosure relates to an image sensor. The image sensor comprises a substrate. A photodetector is in the substrate and includes a semiconductor guard ring extending into a first side of the substrate. A shallow trench isolation (STI) structure extends into the first side of the substrate. An outer isolation structure extends into a second side of the substrate, opposite the first side of the substrate, to the STI structure. The STI structure and the outer isolation structure laterally surround the photodetector. An inner isolation structure extends into the second side of the substrate and overlies the photodetector. The inner isolation structure is vertically separated from the photodetector by the substrate. Further, the outer isolation structure laterally surrounds the inner isolation structure.

Abstract: A method and a User Equipment (UE) for performing uplink repetitions and a related base station (BS) are provided. The method includes a UE receiving a Reference Signal Received Power (RSRP) threshold from a Base Station (BS); initiating a 4-step Random Access (RA) procedure; performing a Downlink (DL) Reference Signal (RS) measurement to obtain an RSRP measurement result; and performing a Message 1 (Msg1) repetition operation and a Message 3 (Msg3) repetition request operation within the 4-step RA procedure after determining that the RSRP measurement result is equal to or less than the RSRP threshold.

Abstract: The present invention provides diagnostic devices and methods for quantifying the amounts of an acute phase reactant (e.g., C-reactive protein (CRP) or serum amyloid A (SAA)) in a body fluid sample and/or white blood cell counts in blood sample. In particular, the present invention provides a rapid assay to detect CRP, SAA, and/or white blood cells in blood with high sensitivity and specificity.

Abstract: An article (100) for a display device includes a diffraction grating film (102), a first optically clear adhesive layer (120), and a second optically clear adhesive layer (130). The diffraction grating film includes a base layer (104) and a plurality of microstructures (106) projecting from the base layer. The base layer defines a non-structured surface of the diffraction grating film and the plurality of microstructures define a structured surface of the diffraction grating film opposite to the non-structured surface. The first optically clear adhesive layer is disposed on the structured surface of the diffraction grating film. The second optically clear adhesive layer is disposed on the non-structured surface of the diffraction grating film.

Abstract: A method of channel state information (CSI) report can include receiving a CSI report configuration at a user equipment (UE) from a base station, the CSI report configuration being associated with a set of CSI reference signal (CSI-RS) resources corresponding to multiple transmission reception points (TRPs), performing a channel measurement based on the CSI-RSs resources corresponding to the multiple TRPs, determining a precoder matrix indicator (PMI) based on measurement results of the channel measurement, the PMI corresponding to a precoder matrix, denoted W, of a Type II CSI codebook, the precoder matrix having a spatial domain (SD) basis vector matrix, denoted W1, SD basis selection of the SD basis vector matrix being TRP-specific, and transmitting a CSI report to the base station, the CSI report including the PMI.

Abstract: A semiconductor package includes a first wafer comprising a first substrate, a first device structure, and a first bonding layer having a pattern of first bonding pads. The first bonding layer is disposed over the first substrate and the first device structure. The semiconductor package includes a second wafer comprising a second substrate, a second device structure, and a second bonding layer having a pattern of second bonding pads. The second bonding layer is disposed over the first bonding layer. The second device structure is disposed over the second bonding layer. The second substrate is disposed over the second device structure. The first bonding pads are each aligned with a corresponding one of the second bonding pads. The first device structure is electrically coupled to the second device structure, through at least one of the first bonding pads and at least one of the second bonding pads.

Abstract: A system and a method of random access resource selection are provided. The method includes a target Base Station (BS) transmitting a first Synchronization Signal Block (SSB) to a User Equipment (UE), the first SSB associated with a first contention-free random access resource for the UE to transmit a random access preamble; the target BS transmitting a second SSB to the UE, the second SSB associated with a contention-based random access resource; and in a case that a first Synchronization Signal-Reference Signal Received Power (SS-RSRP) of the first SSB is not greater than an SS-RSRP threshold and a second SS-RSRP of the second SSB is greater than the SS-RSRP threshold, the target BS receiving the random access preamble from the UE using the contention-based random access resource.

Abstract: A multi-mode hybrid control DC-DC converting circuit has a switching power converter and a microcontroller. The switching power converter has a transformer and a switching switch. The switching switch is connected to a primary-side winding of the transformer in series. The microcontroller is connected to the switching power converter and a control terminal of the switching switch. The microcontroller sets multiple thresholds according to an input voltage of the switching power converter, and determines whether a feedback voltage of the switching power converter is higher or lower than each one of the thresholds to perform a variable-frequency mode, a constant-frequency mode, or a pulse-skipping mode. The microcontroller outputs a driving signal to the switching switch and correspondingly adjusts a frequency of the driving signal according to the variable-frequency mode, the constant-frequency mode, or the pulse-skipping mode which is performed.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate and a device region formed over the substrate. The semiconductor structure further includes an interconnect structure formed over the device region and a first passivation layer formed over the interconnect structure. The semiconductor structure also includes a metal pad formed over and extending into the first passivation layer and a second passivation layer formed over the first passivation layer. The second passivation layer includes a thermal conductive material, and the thermal conductivity of the thermal conductive material is higher than 4 W/mK.

Abstract: A method of channel state information (CSI) report can include receiving a CSI report configuration at a user equipment (UE) from a base station, the CSI report configuration being associated with a set of CSI reference signal (CSI-RS) resources corresponding to multiple transmission reception points (TRPs), performing a channel measurement based on the CSI-RSs resources corresponding to the multiple TRPs, determining a precoder matrix indicator (PMI) based on measurement results of the channel measurement, the PMI corresponding to a precoder matrix, denoted W, of a Type II CSI codebook, the precoder matrix having a spatial domain (SD) basis vector matrix, denoted W1, SD basis selection of the SD basis vector matrix being TRP-specific, and transmitting a CSI report to the base station, the CSI report including the PMI.

Abstract: A photographing optical lens assembly includes five lens elements with refractive power, in order from an object side to an image side. The first lens element with refractive power has a convex object-side surface. The second lens element with positive refractive power has an object-side surface and an image-side surface both being aspheric. The third lens element has positive refractive power. The fourth lens element with refractive power has a concave object-side surface. The fifth lens element with refractive power has an object-side surface and a concave image-side surface with at least one inflection point, both the object-side surface and the image-side surface being aspheric.

Abstract: The invention discloses a coupled power generating device, a power-generating insole and a light emitting shoe, the device comprising a column-shaped hollow shell, at least one group of magnetic induction coils that is provided on the outer wall of the column-shaped hollow shell, at least one removable column-shaped magnet that is provided on the inner wall of the column-shaped hollow shell, two triboelectric nano generating units that are provided at both ends of the column-shaped hollow shell. The coupled power generating device has the advantages of long service life, high output current, stable electrical performance and compact size.

Abstract: A substrate handling device includes a substrate reception area defined by an edge. The substrate reception area includes a planar surface, wherein the edge extends upward from the planar surface. The substrate reception area further includes a plurality of contact structures extending upwards from the planar surface, wherein a first contact structure of the plurality of contact structures directly contacts a side surface of the edge, a second contact structure of the plurality of contact structures separated from the edge, a shape of the first contact structure is different from a shape of the second contact structure. The substrate reception area and the planar surface include a first material. Each contact structure of the plurality of contact structures includes a second material different from the first material, and the second material has a hardness aligned to a hardness of a substrate material.

Abstract: In some embodiments, the present disclosure relates to an integrated chip that includes an insulator layer arranged over a substrate. Further, an upper routing structure is arranged over the insulator layer and is made of a semiconductor material. A lower optical routing structure is arranged below the substrate and is embedded in a lower dielectric structure. The integrated chip further includes an anti-reflective layer that is arranged below the substrate and directly contacts the substrate.

Abstract: A method of making a fabric-creped absorbent cellulosic sheet. The method includes compactively dewatering a papermaking furnish to form a web having a consistency of about 30 percent to about 60 percent, creping the web under pressure in a creping nip between a transfer surface and a structuring fabric, the structuring fabric including knuckles formed on warp yarns of the structuring fabric, with the knuckles having a length in the machine direction (MD) of the absorbent sheet and a width in the cross machine direction (CD) of the absorbent sheet, wherein a planar volumetric density index of the structuring fabric multiplied by a ratio of the length of the knuckles to the width of the knuckles is at least about 43, and drying the web to form the absorbent cellulosic sheet.

Abstract: An electronic device includes a display panel and image processing circuitry. The image processing circuitry receives input image data corresponding to an image to display on the display panel, modifies the input image data by executing a first context task (e.g., lower priority task), and receives a context switch request. The image processing circuitry also pauses modification of the input image data by pausing execution of the first context task and then switches to modifying the input image data by executing a second context task (e.g., higher priority task).

Abstract: A layout design methodology is provided for a device that includes two or more identical structures. Each device can have a first die, a second die stacked over the first die and a third die stacked over the second die. The second die can include a first through-silicon via (TSV) and a first circuit, and the third die can include a second TSV and a second circuit. The first TSV and the second TSV can be linearly coextensive. The first and second circuit can each be a logic circuit having a comparator and counter used to generate die identifiers. The counters of respective device die can be connected in series between the dice. Each die can be manufactured using the same masks but retain unique logical identifiers. A given die in a stack of dice can thereby be addressed by a single path in a same die layout.

Abstract: An oligomer is formed by reacting a diacid monomer with (a) epoxy resin or (b) glycidyl methacrylate, wherein the diacid monomer has a chemical structure of wherein X is —O—, and each R1 is independently CH3, CH2F, CHF2, or CF3. A composition containing the oligomer can be cured to serve as a sealant of an optoelectronic device, and the sealant can be lifted off by a laser beam irradiation.