Abstract: A method of forming a magnetoresistive (MR) sensor with a composite tunnel barrier comprised primarily of magnesium oxynitride and having a MR ratio of at least 70%, resistance x area (RA) product <1 ohm-?m2, and fewer pinholes than a conventional MgO layer is disclosed. The method involves forming a Mg/MgON/Mg, Mg/MgON/MgN, MgN/MgON/MgN, or MgN/MgON/Mg intermediate tunnel barrier stack and then annealing to drive loosely bound oxygen into adjacent layers thereby forming MgO/MgON/Mg, MgO/MgON/MgON, MgON/MgON/MgON, and MgON/MgON/MgO composite tunnel barriers, respectively, wherein oxygen content in the middle MgON layer is greater than in upper and lower MgON layers. The MgON layer in the intermediate tunnel barrier may be formed by a sputtering process followed by a natural oxidation step and has a thickness greater than the Mg and MgN layers.

Abstract: A heat dissipation module includes a heat dissipation fin set. The heat dissipation fin set includes a plurality of heat dissipation fins, wherein these heat dissipation fins are stacked on each other, and each of the heat dissipation fins has a front side, a rear side opposite to the front side and at least one turbulent structure set. The turbulent structure set is located between the front side and the rear side and includes a plurality of first turbulent structures. The first turbulent structures are arranged from the front side to the rear side in sequence. A heat dissipation airflow flows from the front side toward the turbulent structure set along a flowing direction, and passes through the turbulent structure set to flow toward the rear side. An extending direction of each of the first turbulent structures is tilted relative to the flowing direction.

Abstract: A device includes a load circuit configured to receive an amplified communication signal, the load circuit having a center tapped inductor structure configured to divide the amplified communication signal into a first portion and a second portion, the load circuit configured to resonate at a harmonic of the amplified communication signal.

Abstract: An optical lens including a first lens group and a second lens group is provided. The first lens group is disposed between a magnified side and a reduced side and has a negative refractive power. The first lens group includes four lenses. Two lenses closest to the magnified side in the first lens group are aspheric lenses. The second lens group is disposed between the first lens group and the reduced side and has a positive refractive power. The second lens group includes at least seven lenses.

Abstract: A fluid supply device includes a base member including an end plate and a rod perpendicularly extending from a first end of the end plate and defining a first channel axially and a through slot radically, a container attached to a second end of the end plate opposite to the first end and defining a second channel to contain fluid, a pushing member slidably received in the first channel and the second channel, an actuating sleeve threadedly engaging with the rod, and a fixing member attached to the actuating sleeve and extending through the through slot and the pushing member. The actuating sleeve is rotated to drive the pushing member to slide in the first channel and the second channel to push the fluid.

Abstract: The present invention provides compositions and methods for treating cancer in a human. The invention relates to targeting the stromal cell population in a tumor microenvironment. For example, in one embodiment, the invention provides a composition that is targeted to fibroblast activation protein (FAP). The invention includes a chimeric antigen receptor (CAR) which comprises an anti-FAP domain, a transmembrane domain, and a CD3zeta signaling domain.

Abstract: An apparatus includes an amplifier and a first inductor coupled to an input of the amplifier. The apparatus also includes a second inductor that is inductively coupled to the first inductor and that couples the amplifier to a first supply node. The apparatus further includes a third inductor that is inductively coupled to the first inductor and to the second inductor and that couples the amplifier to a second supply node.

Abstract: A back end of the line (BEOL) fuse structure having a stack of vias. The stacking of vias leads to high aspect ratios making liner and seed coverage inside the vias poorer. The weakness of the liner and seed layers leads to a higher probability of electromigration (EM) failure. The fuse structure addresses failures due to poor liner and seed coverage. Design features permit determining where failures occur, determining the extent of the damaged region after fuse programming and preventing further propagation of the damaged dielectric region.

Abstract: A wafer probing system includes a probe card assembly having a plurality of individual probe structures configured make contact with a semiconductor wafer mounted on a motor driven wafer chuck, with each probe structure configured with a pressure sensing unit integrated therewith; and a controller configured to drive the probe card assembly with one or more piezoelectric driver units response to feedback from the pressure sensing units of the individual probe structures.

Abstract: Embodiments of the present invention provide an apparatus and method for wafer thinning endpoint detection. Embodiments of the present invention utilize through silicon via (TSV) structures formed in the wafer. A specially made wafer handle is bonded to the wafer. Conductive slurry is used in the wafer backside thinning process. The wafer handle provides electrical connectivity to an electrical measurement tool, and conductive posts in the wafer handle are proximal to a test structure on the wafer. A plurality of electrically isolated TSVs is monitored via the electrical measurement tool. When the TSVs are exposed on the backside as a result of thinning, the conductive slurry shorts the electrically isolated TSVs, changing the electrical properties of the plurality of TSVs. The change in electrical properties is detected and used to trigger termination of the wafer backside thinning process.

Abstract: A hard disk duplication device capable of expanding duplication capacity by chain connection, including one or more duplicators, the duplicator including: an expansion input connection port; an expansion output connection port; an information display screen; multiple buttons including a start button and multiple selection buttons; and at least one hard disk connection port; wherein, the chain connection is achieved by connecting the expansion output connection port of one of a plurality of the duplicators with the expansion input connection port of another of the plurality of the duplicators.

Abstract: A technology for facilitating testing of a web application is provided. In some embodiments, a data file including recorded data of one or more recorded gesture-events is received. A test case is loaded with the recorded data. The one or more recorded gesture events are replayed in the test case and the web application is executed to generate test results.

Abstract: A baking method for metallic paste on transparent substrate first prepares a thin transparent substrate coated with metallic paste and the thin transparent substrate is arranged in roll-to-roll or in batch to a baking area of a baking device. A near-infrared light source with a predetermined distance with the baking area is provided, and the near-infrared light source irradiates a near-infrared light with predetermined wavelength to the thin transparent substrate for baking process. In baking operation, the thin transparent substrate is placed on the baking area for static baking or dynamic baking. The thin transparent substrate is then sent to a cooling stabilization area for normal cooling.

Abstract: A hand-activated counting device includes a pressing module having an elastic assembly and a counting module coupled to the pressing module. The elastic assembly includes a first deformable elastic membrane with a first connecting portion, a second deformable elastic membrane with a second connecting portion, and an insulating element. The counting module includes a housing, a circuit board supported by the housing, a counter, a power supply, and a display. The first deformable elastic membrane is positioned opposite the second deformable elastic membrane with the insulating element separating the first deformable elastic membrane from the second deformable elastic membrane. The power supply is electronically connected to the display and electronically connected to the counter by the elastic assembly. The first connecting portion is coupled to a first contact of the counter and the second connecting portion is coupled to a second contact of the counter.

Abstract: A method for fabricating an interconnect function array includes forming a first plurality of conductive lines on a substrate, forming an insulator layer over the first plurality of conductive lines and the substrate, removing portions of the insulator layer to define cavities in the insulator layer that expose portions of the substrate and the first plurality of conductive lines, wherein the removal of the portions of the insulator layer results in a substantially random arrangement of cavities exposing portions of the substrate and the first plurality of conductive lines, depositing a conductive material in the cavities, and forming a second plurality of conductive lines on portions of the conductive material in the cavities and the insulator layer.

Abstract: A method for suppression of vibration includes: adjusting a center frequency of a band-pass filter, and subjecting a to-be-detected signal to processing by the band-pass filter to result in a bandpass-filtered signal; performing signal processing upon the bandpass-filtered signal to obtain a converted result; determining whether a scanning process is completed, and repeating the previous two steps when a result is negative to obtain plural converted results; determining a maximum value among the converted results, and determining the corresponding center frequency to serve as an interference frequency; and setting the interference frequency as an operating frequency of a notch filter.

Abstract: The present disclosure provides an embodiment of a method, for a lithography process for reducing a critical dimension (CD) by a factor n wherein n<1. The method includes providing a pattern generator having a first pixel size S1 to generate an alternating data grid having a second pixel size S2 that is <S1, wherein the pattern generator includes multiple grid segments configured to offset from each other in a first direction; and scanning the pattern generator in a second direction perpendicular to the first direction during the lithography process such that each subsequent segment of the grid segments is controlled to have a time delay relative to a preceding segment of the grid segments.

Abstract: An image pickup apparatus includes a lens, an image sensor, an optical filter, and a driving device. The lens focuses light beams from at least one subject to form an optical image, and the image sensor receives the optical image and converts the optical image into at least one electric signal. The optical filter includes a first plate and a second plate, the first plate is disposed between the lens and the image sensor, and the second plate is disposed between the first plate and the image sensor. The driving device moves the second plate. The second plate has substantially the same index of refraction as the first plate, and a thickness of the second plate is continuously decreased or increased across the second plate.

Abstract: The present disclosure generally provides for integrated circuit (IC) structures with through-semiconductor vias (TSV). In an embodiment, an IC structure may include a through-semiconductor via (TSV) embedded in a substrate, the TSV having a cap; a dielectric layer adjacent to the substrate; a metal layer adjacent to the dielectric layer; a plurality of vias each embedded within the dielectric layer and coupling the metal layer to the cap of the TSV at respective contact points, wherein the plurality of vias is configured to create a substantially uniform current density throughout the TSV.