Abstract: The present disclosure provides a method and a system for scanning wafer. The system captures a defect image of a wafer, and generates a reference image corresponding to the first defect image based on a reference image generation model. The system generates a defect marked image based on the defect image and the reference image.

Abstract: The invention is related to a non-transitory computer program product, a method and an apparatus for controlling access to a flash memory card. The method, performed by a processing unit of a bridge integrate circuit (IC), includes: determining whether a temperature of a motherboard has exceeded a threshold through a temperature sensor IC after receiving a host read or write command from a host side; requesting a flash memory card to enter a sleep state when the temperature of the motherboard has exceeded the threshold; and instructing the flash memory card to perform an operation corresponding to the host read or write command when the temperature of the motherboard hasn't exceeded the threshold. The bridge IC and the temperature sensor IC are disposed on the motherboard, the flash memory card is inserted into a card slot on the motherboard, and the bridge IC is coupled to the temperature sensor IC and the flash memory card through a circuit of the motherboard.

Abstract: An electronic device including a first body, a second body, a hinge structure, an electronic assembly and a linkage mechanism is provided. The first body and the second body are pivoted to each other through the hinge structure. The electronic assembly is disposed on the first body. The linkage mechanism is disposed in the first body and connected between the hinge structure and the electronic assembly. When the second body is closed to the first body, the electronic assembly is hidden between the first body and the second body. When the second body is opened relative to the first body with an opening angle less than a predetermined angle, the hinge structure does not drive the linkage mechanism. When the second body is opened relative to the first body with the opening angle not less than the predetermined angle, the hinge structure drives the linkage mechanism and the linkage mechanism drives the electronic assembly to be opened relative to the first body.

Abstract: A smart ring includes an antenna chip and a metal ring used as an antenna, and the antenna chip is electrically connected to the metal ring to form an antenna circuit. The metal body of the smart ring is designed as a composition structure of the antenna circuit, that is. the antenna is integrated into the metal ring, the space for accommodating the antennas and the cost for additional physical antennas are saved, and the design flexibility and the competitiveness of the product are improved. Nickel-zinc ferrite is unnecessary, which can reduce the cost. The ring can keep the radiation characteristic of the circular antenna that is not susceptible to the interference from human body. The metal body of the ring is a metal structure, which can fulfill both of strength requirement and texture requirement of the structure, and at the same time has good antenna characteristics.

Abstract: A memory cell includes: a resistive material layer comprising a first portion that extends along a first direction and a second portion that extends along a second direction, wherein the first and second directions are different from each other; a first electrode coupled to a bottom surface of the first portion of the resistive material layer; and a second electrode coupled to the second portion of the resistive material layer.

Abstract: This invention relates to exosome compositions and methods of using them.

Abstract: In some embodiments, the present disclosure relates to an integrated chip structure. The integrated chip structure includes a first plurality of interconnects arranged within a first inter-level dielectric (ILD) structure on a first substrate, and a second plurality of interconnects arranged within a second ILD structure between the first ILD structure and a second substrate. A bonding structure is disposed within a recess extending through the second substrate. A connector structure is vertically between the first plurality of interconnects and the second plurality of interconnects. The second plurality of interconnects include a first interconnect directly contacting the bonding structure. The second plurality of interconnects also include one or more extensions extending from directly below the first interconnect to laterally outside of the first interconnect and directly above the connector structure, as viewed along a cross-sectional view.

Abstract: A display substrate is provided. The display substrate includes: a plurality of pixel unit groups arranged in rows, each of the pixel unit groups including: a first-color sub-pixel unit, and a ring-shaped second-color sub-pixel unit surrounding the first-color sub-pixel unit.

Abstract: An ultrasound image system is provided. The ultrasound image system includes an ultrasound probe and a processing circuit. The ultrasound probe includes a substrate, a first transducer array and a second transducer array. The first transducer array is fixed disposed on the substrate and configured to receive a first ultrasound signal The second transducer array is fixed disposed on the substrate and configured to receive a second ultrasound signal. Each of the first transducer array and the second transducer array includes a plurality of ultrasound transducer elements arranged along a first direction. The ultrasound transducer elements of the first transducer array are interleaved with the ultrasound transducer elements of the second transducer array. The processing circuit is coupled to the first transducer array and the second transducer array and is configured to generate an ultrasound image signal according to the first ultrasound signal and the second ultrasound signal.

Abstract: A trace configuration calculating method is applied to pivotal connection of a first workpiece and a hinge. A first trace space is formed at a position where the hinge is pivoted to the first workpiece. A first trace is disposed through the first trace space. The trace configuration calculating method includes the hinge and the first workpiece rotating first and second angles to make the first trace space have first and second contour cross-sections respectively, overlapping the first and second contour cross-sections to form a first intersection area, calculating a first maximum inscribed circle according to the first intersection area, and determining a first optimal center and a first maximum diameter of the first trace according to the first maximum inscribed circle.

Abstract: A memory includes: a dielectric fin formed over a substrate; and a pair of memory cells disposed along respective sidewalls of the dielectric fin, each of the pair of memory cells comprising: a first conductor layer; a selector layer; a resistive material layer; and a second conductor layer, wherein the first conductor layer, selector layer, resistive material layer, and second conductor layer each includes upper and lower boundaries, and at least one of the upper and lower boundaries is tilted away from one of the sidewalls of the dielectric fin by an angle.

Abstract: A flash memory controller for controlling a flash memory module includes a communication interface for receiving a first data and a second data; and a processing circuit for dynamically controlling a data writing mode of the flash memory module according to an amount of stored data in the flash memory module. If the amount of stored data in the flash memory module is less than a first threshold when the communication interface receives the first data, the processing circuit controls the flash memory module so that the first data is written into the first data block under an one-bit-per-cell mode. If the amount of stored data in the flash memory module is greater than the first threshold when the communication interface receives the second data, the processing circuit controls the flash memory module so that the second data is written into the second data block under a two-bit-per-cell mode.

Abstract: A projection device includes a casing, a projection lens, and a fan. The casing includes a main body, a first base, and a second base, wherein the main body has a first side, a second side opposite to the first side, a middle section located between the first side and the second side, air inlet holes at least distributed in the middle section, and air outlet holes at least distributed in the middle section. The first base is installed on the first side, and the second base is installed on the second side. A minimum outer dimension of the main body falls in the middle section, and the air inlet holes face away from the air outlet holes. The projection lens is installed on the main body and located at the same side as the air outlet holes. The fan is installed in the main body.

Abstract: A method includes forming a gate stack of a transistor. The formation of the gate stack includes forming a silicon oxide layer on a semiconductor region, depositing a hafnium oxide layer over the silicon oxide layer, depositing a lanthanum oxide layer over the hafnium oxide layer, and depositing a work-function layer over the lanthanum oxide layer. Source/drain regions are formed on opposite sides of the gate stack.

Abstract: A system, method and non-transitory computer-readable storage medium for monitoring motion during medical imaging. The monitoring of the motion includes initiating an acquisition of image data, measuring physiological signals of a patient, generating a prediction signal by integrating the physiological signals, determining whether patient motion is likely to occur based on the prediction signal and modifying the acquisition of image data, if it is predicted that patient motion is likely to occur.

Abstract: A process is provided to fabricate a finFET device having a semiconductor layer of a two-dimensional “2D” semiconductor material. The semiconductor layer of the 2D semiconductor material is a thin film layer formed over a dielectric fin-shaped structure. The 2D semiconductor layer extends over at least three surfaces of the dielectric fin structure, e.g., the upper surface and two sidewall surfaces. A vertical protrusion metal structure, referred to as “metal fin structure”, is formed about an edge of the dielectric fin structure and is used as a seed to grow the 2D semiconductor material.

Abstract: A document processing system and method for performing document classification by machine learning include an input module, a processing module, and at least one storage module preconfigured with a classification folder matching a code. Upon completion of a first-instance model construction procedure, the input module receives a document image. The processing module compares the document image with a machine learning model information to generate a computation result and stores the document image in the classification folder according to the computation result. Therefore, classification of the document images is automated according to the code of the corresponding classification folder, thereby enhancing the accuracy and efficiency of document classification.

Abstract: A semiconductor memory structure includes a semiconductor layer, a conductive layer disposed over the semiconductor layer, a gate penetrating through the conductive layer and the semiconductor layer, and an interposing layer disposed between the gate and the conductive layer and between the gate and the semiconductor layer, wherein a pair of channel regions is formed in the semiconductor layer at two sides of the gate.

Abstract: The present invention relates to a non-fullerene acceptor compound containing benzoselenadiazole, and organic optoelectronic devices comprising the same.

Abstract: A chemical mechanical planarization apparatus includes a multi-zone platen comprising a plurality of individually controlled concentric toroids. The rotation direction, rotation speed, applied force, relative height, and temperature of each concentric toroid is individually controlled. Concentric polishing pads are affixed to an upper surface of each of the individually controlled concentric toroids. The chemical mechanical planarization apparatus includes a single central slurry source or includes individual slurry sources for each individually controlled concentric toroid.