Abstract: A head-mounted display device includes a display assembly, a rotating assembly, and a fixed assembly. The rotating assembly is connected to the display assembly and includes a motor holder, a motor and a first connecting element. The motor is disposed on the motor holder. The first connecting element has a first accommodating portion and a second accommodating portion, wherein the first connecting element receives a part of the motor and the second connecting element receives a part of the motor holder. The fixed assembly is connected to the rotating assembly. The rotating assembly rotates the display assembly relative to the fixed assembly.

Abstract: A wearable display device includes a wearing device, a linking-lever set, a bracket and an optical imaging device. The linking-lever set includes a first rod and a second rod, and the first rod is pivotally connected to the wearing device and the second rod, respectively. The bracket is fixedly connected to the optical imaging device, and is pivotally connected to the second rod of the at least one linking-lever set.

Abstract: A headband adjustment structure includes a base, a wearing unit, a rotary adjusting assembly, a linkage member and an elastic element. The wearing unit includes a first end portion and a second end portion that overlap with each other. The first end portion and the second end portion are movably located in the base to define an adjustable accommodation space. The rotary adjusting assembly is pivotally located within the base, and provided with a gear body meshed with a first toothed rack of the first end portion and a second toothed rack of the second end portion so as to simultaneously move the first end portion and the second end portion in opposite directions for adjusting the adjustable accommodation space. The linkage member is connected to the rotary adjusting assembly. The elastic element abutting against the linkage member and the base, respectively.

Abstract: A head-mounted display device includes a display assembly, a rotating assembly, and a fixed assembly. The rotating assembly is connected to the display assembly and includes a motor holder, a motor and a first connecting element. The motor is disposed on the motor holder. The first connecting element has a first accommodating portion and a second accommodating portion, wherein the first connecting element receives a part of the motor and the second connecting element receives a part of the motor holder. The fixed assembly is connected to the rotating assembly. The rotating assembly rotates the display assembly relative to the fixed assembly.

Abstract: A method for adjusting accompaniment music is disclosed. The method transposes the musical key of at least one section of the accompaniment music such that a song will have different musical key transpositions for different sections of the accompaniment music, so that singers whose vocal ranges are narrow can sing songs after the adjustment.

Abstract: A device for adjusting interpupillary distance is provided. The device for adjusting interpupillary distance includes an adjustment bottom, a housing, and an adjustment support. The housing is disposed on the adjustment bottom. The housing includes a base, a holder, and a deformation part disposed between the base and the holder. The holder moves relative to the base via the deformation part. The adjustment support is connected to the holder and the adjustment bottom.

Abstract: A wearable display device includes a wearing device, a fixed frame, a sliding member, a bracket and an optical imaging device. The fixed frame is fixedly connected to the wearing device. The sliding member is slidably coupled to the fixed frame. The bracket is pivotally connected to the sliding member and is interlocked with the sliding member. The optical imaging device is fixedly connected to the bracket for sliding and rotating relative to the fixed frame.

Abstract: A semiconductor device includes a first magnetic tunneling junction (MTJ) and a second MTJ on a substrate, a passivation layer on the first MTJ and the second MTJ, and an ultra low-k (ULK) dielectric layer on the passivation layer. Preferably, a top surface of the passivation layer between the first MTJ and the second MTJ is lower than a top surface of the passivation layer directly on top of the first MTJ.

Abstract: A manufacturing method of a semiconductor device includes the following steps. First patterned structures are formed on a substrate. Each of the first patterned structures includes a first semiconductor pattern and a first bottom protection pattern disposed between the first semiconductor pattern and the substrate. A first protection layer is formed on the first patterned structures and the substrate. A part of the first protection layer is located between the first patterned structures. A first opening is formed in the first protection layer between the first patterned structures. The first opening penetrates the first protection layer and exposes a part of the substrate. A first etching process is performed after forming the first opening. A part of the substrate under the first patterned structures is removed by the first etching process for suspending at least a part of each of the first patterned structures above the substrate.

Abstract: A method for fabricating semiconductor device includes the steps of: forming a first magnetic tunneling junction (MTJ) on a substrate; forming a first ultra low-k (ULK) dielectric layer on the first MTJ; performing a first etching process to remove part of the first ULK dielectric layer and forming a damaged layer on the first ULK dielectric layer; and forming a second ULK dielectric layer on the damaged layer.

Abstract: A head-mounted display apparatus includes a wearing device, a display-source arrangement portion and an optical assembly. The wearing device has a head-wearing portion and a hat brim portion connected to the head-wearing portion. The display-source arrangement portion is connected with the hat brim portion. The optical assembly is movably disposed on the hat brim portion, and arranged between the head-wearing portion and the display-source arrangement portion.

Abstract: A manufacturing method of a semiconductor device includes the following steps. First patterned structures are formed on a substrate. Each of the first patterned structures includes a first semiconductor pattern and a first bottom protection pattern disposed between the first semiconductor pattern and the substrate. A first protection layer is formed on the first patterned structures and the substrate. A part of the first protection layer is located between the first patterned structures. A first opening is formed in the first protection layer between the first patterned structures. The first opening penetrates the first protection layer and exposes a part of the substrate. A first etching process is performed after forming the first opening. A part of the substrate under the first patterned structures is removed by the first etching process for suspending at least a part of each of the first patterned structures above the substrate.

Abstract: A method for fabricating semiconductor device includes the steps of: forming a first magnetic tunneling junction (MTJ) on a substrate; forming a first ultra low-k (ULK) dielectric layer on the first MTJ; performing a first etching process to remove part of the first ULK dielectric layer and forming a damaged layer on the first ULK dielectric layer; and forming a second ULK dielectric layer on the damaged layer.

Abstract: A method for fabricating semiconductor device includes the steps of: forming a magnetic tunneling junction (MTJ) on a substrate and a top electrode on the MTJ; forming a first inter-metal dielectric (IMD) layer around the MTJ and the top electrode; forming a stop layer on the first IMD layer; forming a second IMD layer on the stop layer; performing a first etching process to remove the second IMD layer and the stop layer; performing a second etching process to remove part of the top electrode; and forming a metal interconnection to connect to the top electrode.

Abstract: A manufacturing method of a semiconductor device includes the following steps. First patterned structures are formed on a substrate. Each of the first patterned structures includes a first semiconductor pattern and a first bottom protection pattern disposed between the first semiconductor pattern and the substrate. A first protection layer is formed on the first patterned structures and the substrate. A part of the first protection layer is located between the first patterned structures. A first opening is formed in the first protection layer between the first patterned structures. The first opening penetrates the first protection layer and exposes a part of the substrate. A first etching process is performed after forming the first opening. A part of the substrate under the first patterned structures is removed by the first etching process for suspending at least a part of each of the first patterned structures above the substrate.

Abstract: A head mounted display device includes a spectacles frame, two temples, an optomechanical module, a lens and a circuit board module. The temples are connected to the opposite ends of the spectacles frame, respectively. The lens is fixed to the spectacles frame. The optomechanical module is loaded on the spectacles frame, jointed to the lens, and configured for outputting signals to the lens. The circuit board module is disposed on the frame and electrically connected to the optomechanical module.

Abstract: A headband adjustment structure includes a rotary adjusting assembly, a wearing unit having an adjustable accommodation space, a cable management module located between the wearing unit and the rotary adjusting assembly for carrying a cable, an adjustment gear set linkably coupled to the cable management module, and a driving rotation shaft set passing through the wearing unit and the cable management module, and linkably coupled to the wearing unit and the adjustment gear set, and coaxially connected to the rotary adjusting assembly. When the rotary adjusting assembly rotates the driving rotation shaft set, the driving rotation shaft set synchronously moves the wearing unit to adjust the adjustable accommodation space, and moves the cable management module through the adjustment gear set. The amount of the movement of the cable management module is different from that of the wearing unit.

Abstract: The present invention provides a method for forming a semiconductor structure. The method including: Firstly, a substrate is provided, a first region and a second region are defined thereon, next, a gate dielectric layer and a work function metal layer are sequentially formed on the substrate within the first region and within the second region. Afterwards, a dielectric layer is formed on the work function metal layer within the second region, a hydrogen gas treatment is then performed on the substrate, and the work function metal layer is removed within the first region.

Abstract: A head mounted display device includes a spectacles frame, two temples, an optomechanical module, a lens and a circuit board module. The temples are connected to the opposite ends of the spectacles frame, respectively. The lens is fixed to the spectacles frame. The optomechanical module is loaded on the spectacles frame, jointed to the lens, and configured for outputting signals to the lens. The circuit board module is disposed on the frame and electrically connected to the optomechanical module.

Abstract: A wearable device includes a frame, two feet, and two pivoting modules. Each of the pivoting modules includes a first bracket fixedly connected to the frame, and a second bracket fixedly connected to one of the feet and pivotally coupled to the first bracket. The second bracket includes a positioning member and an inserting member. The positioning member is located in the first bracket, and the positioning member includes a plurality of slots. The inserting member is switchably inserted into one of the slots for adjusting a maximum outreaching volume from the frame to the feet.