Abstract: Described is an apparatus which comprises: a first power supply node to provide a first power supply, a second power supply node, and a third power supply node; a first transistor which is operable to couple the first and second power supply nodes; and a charge pump circuit to provide a boosted voltage to the third power supply node in one mode, and to recover charge from the second power node in another mode. Described is a memory unit which comprises: a DRAM which is operable to be refreshed; a gated power supply node coupled to the DRAM to provide a gated power supply to the DRAM; and a charge recycling circuit to recover charge from the gated power supply node after the DRAM is refreshed.

Abstract: Described is an apparatus which comprises: a first oscillator to generate a first clock signal a second oscillator to generate a second clock signal; a phase frequency detector to detect phase difference between the first and second clock signals, and to generate a phase difference; and an output stage, coupled to a load, to generate a power supply for the load according to the phase difference.

Abstract: Methodology enabling a generation of fins having a variable fin pitch less than 40 nm, and the resulting device are disclosed. Embodiments include: forming a hardmask on a substrate; providing first and second mandrels on the hardmask; providing a first spacer on each side of each of the first and second mandrels; removing the first and second mandrels; providing, after removal of the first and second mandrels, a second spacer on each side of each of the first spacers; and removing the first spacers.

Abstract: Described is an apparatus which comprises: a first power supply node to provide a first power supply, a second power supply node, and a third power supply node; a first transistor which is operable to couple the first and second power supply nodes; and a charge pump circuit to provide a boosted voltage to the third power supply node in one mode, and to recover charge from the second power node in another mode. Described is a memory unit which comprises: a DRAM which is operable to be refreshed; a gated power supply node coupled to the DRAM to provide a gated power supply to the DRAM; and a charge recycling circuit to recover charge from the gated power supply node after the DRAM is refreshed.

Abstract: Methodology enabling a generation of an interconnection design utilizing an SIT process is disclosed. Embodiments include: providing a hardmask on a substrate; forming a mandrel layer on the hardmask including: first and second vertical portions extending along a vertical direction and separated by a horizontal distance; and a plurality of horizontal portions extending in a horizontal direction, wherein each of the horizontal portions is positioned between the first and second vertical portions and at a different position along the vertical direction; and forming a spacer layer on outer edges of the mandrel layer.

Abstract: A method for fabricating a FinFET integrated circuit includes depositing a first polysilicon layer at a first end of a diffusion region and a second polysilicon layer at a second end of the diffusion region; diffusing an n-type material into the diffusion region to form a diffused resistor; and epitaxially growing a silicon material between the first and second polysilicon layers to form fins structures over the diffused resistor and spanning between the first and second polysilicon layers.

Abstract: Methodology enabling a generation of fins having a variable fin pitch less than 40 nm, and the resulting device are disclosed. Embodiments include: forming a hardmask on a substrate; providing first and second mandrels on the hardmask; providing a first spacer on each side of each of the first and second mandrels; removing the first and second mandrels; providing, after removal of the first and second mandrels, a second spacer on each side of each of the first spacers; and removing the first spacers.

Abstract: Methodology enabling a generation of fins having a variable fin pitch less than 40 nm, and the resulting device are disclosed. Embodiments include: forming a hardmask on a substrate; providing first and second mandrels on the hardmask; providing a first spacer on each side of each of the first and second mandrels; removing the first and second mandrels; providing, after removal of the first and second mandrels, a second spacer on each side of each of the first spacers; and removing the first spacers.

Abstract: Described is an integrated circuit (IC) which comprises: a first driver having stacked devices, the first driver operable on a first power supply and a first ground supply, the first driver to receive an input signal with a signal swing according to a second power supply and a second ground supply, the second power supply having a voltage level lower than a voltage level of the first power supply, and the second ground supply having a voltage level higher than a voltage level of the first ground supply; a second driver coupled to the first driver, the second driver operable on the second power supply and the second ground supply; and a pair of by-pass devices coupled to the first and second drivers, the pair of by-pass devices to provide the second power supply and the second ground supply according to an output of the first driver.

Abstract: Methodology enabling a generation of an interconnection design utilizing an SIT process is disclosed. Embodiments include: providing a hardmask on a substrate; forming a mandrel layer on the hardmask including: first and second vertical portions extending along a vertical direction and separated by a horizontal distance; and a plurality of horizontal portions extending in a horizontal direction, wherein each of the horizontal portions is positioned between the first and second vertical portions and at a different position along the vertical direction; and forming a spacer layer on outer edges of the mandrel layer.

Abstract: Described is an integrated circuit (IC) which comprises: a first driver having stacked devices, the first driver operable on a first power supply and a first ground supply, the first driver to receive an input signal with a signal swing according to a second power supply and a second ground supply, the second power supply having a voltage level lower than a voltage level of the first power supply, and the second ground supply having a voltage level higher than a voltage level of the first ground supply; a second driver coupled to the first driver, the second driver operable on the second power supply and the second ground supply; and a pair of by-pass devices coupled to the first and second drivers, the pair of by-pass devices to provide the second power supply and the second ground supply according to an output of the first driver.

Abstract: Described herein is an apparatus for adjusting a power supply level for a memory cell to improve stability of a memory unit. The apparatus comprises memory circuitry including memory cells, error detection circuitry to detect error in data stored by memory cells of the memory circuitry, and supply voltage control circuitry to increase supply voltage for one or more memory cells of the memory circuitry based at least in part on detected error.

Abstract: Methodology enabling a generation of fins having a variable fin pitch less than 40 nm, and the resulting device are disclosed. Embodiments include: forming a hardmask on a substrate; providing first and second mandrels on the hardmask; providing a first spacer on each side of each of the first and second mandrels; removing the first and second mandrels; providing, after removal of the first and second mandrels, a second spacer on each side of each of the first spacers; and removing the first spacers.

Abstract: A method for fabricating a FinFET integrated circuit includes depositing a first polysilicon layer at a first end of a diffusion region and a second polysilicon layer at a second end of the diffusion region; diffusing an n-type material into the diffusion region to form a diffused resistor; and epitaxially growing a silicon material between the first and second polysilicon layers to form fins structures over the diffused resistor and spanning between the first and second polysilicon layers.

Abstract: An approach for providing timing-closed FinFET designs from planar designs is disclosed. Embodiments include: receiving one or more planar cells associated with a planar design; generating an initial FinFET design corresponding to the planar design based on the planar cells and a FinFET model; and processing the initial FinFET design to provide a timing-closed FinFET design. Other embodiments include: determining a race condition associated with a path of the initial FinFET design based on a timing analysis of the initial FinFET design; and increasing delay associated with the path to resolve hold violations associated with the race condition, wherein the processing of the initial FinFET design is based on the delay increase.

Abstract: Described herein is an apparatus for adjusting a power supply level for a memory cell to improve stability of a memory unit. The apparatus comprises memory circuitry including memory cells, error detection circuitry to detect error in data stored by memory cells of the memory circuitry, and supply voltage control circuitry to increase supply voltage for one or more memory cells of the memory circuitry based at least in part on detected error.

Abstract: A cache memory system uses multi-bit Error Correcting Code (ECC) with a low storage and complexity overhead. In an embodiment, error correction logic may include a first error correction logic to determine a number of errors in data that is stored in a cache line of a cache memory, and a second error correction logic to receive the data from the first error correction logic if the number of errors is determined to be greater than one and to perform error correction responsive to receipt of the data. The cache memory system can be operated at very low idle power, without dramatically increasing transition latency to and from an idle power state due to loss of state. Other embodiments are described and claimed.

Abstract: An approach for providing timing-closed FinFET designs from planar designs is disclosed. Embodiments include: receiving one or more planar cells associated with a planar design; generating an initial FinFET design corresponding to the planar design based on the planar cells and a FinFET model; and processing the initial FinFET design to provide a timing-closed FinFET design. Other embodiments include: determining a race condition associated with a path of the initial FinFET design based on a timing analysis of the initial FinFET design; and increasing delay associated with the path to resolve hold violations associated with the race condition, wherein the processing of the initial FinFET design is based on the delay increase.

Abstract: A NOR architecture for selecting a word line driver in a DRAM is disclosed. Complements of separately decoded addresses in the low, mid and high ranges are used to select a final word line driver. The output of the word line driver is at a potential negative with respect to ground for a deselected word line and a positive potential more positive than the power supply potential for a selected word line.

Abstract: Embodiments of an invention for low overhead error-correcting-code protection for stored information are described are disclosed. In one embodiment, an apparatus includes a data storage structure, a first check value storage structure, a second check value storage structure, and check value generation hardware. The data storage structure is to store a plurality of first data values. The first check value storage structure is to store a plurality of first check values. The second check value storage structure is to store a plurality of second check values. The check value generation hardware is to generate the first check values and the second check values. The first check values provide a first level of error protection for the first data values and the second check values provide a second level of error protection for a plurality of second data values.