Patents by Inventor Ding Wang

Ding Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cooling Channels in 3DIC Stacks
    Publication number: 20160276314
    Abstract: An integrated circuit structure includes a die including a semiconductor substrate, dielectric layers over the semiconductor substrate, an interconnect structure including metal lines and vias in the dielectric layers, a plurality of channels extending from inside the semiconductor substrate to inside the dielectric layers, and a dielectric film over the interconnect structure and sealing portions of the plurality of channels. The plurality of channels is configured to allow a fluid to flow through.
    Type: Application
    Filed: May 27, 2016
    Publication date: September 22, 2016
    Inventors: Kai-Ming Ching, Ching-Wen Hsiao, Tsung-Ding Wang, Ming Hung Tseng, Chen-Shien Chen
  • Optical interconnect
    Patent number: 9435971
    Abstract: The disclosure generally relates to sets of optical waveguides such as optical fiber ribbons and embedded optical waveguides, and optical interconnects useful for connecting multiple optical waveguides such as in optical fiber ribbon cables and printed circuit boards (PCBs) having optoelectronic capabilities. In particular, the disclosure provides an efficient, compact, and reliable optical waveguide connector that incorporates microlenses and re-directing elements which combine the features of optical waveguide alignment, along with redirecting and shaping of the optical beam.
    Type: Grant
    Filed: July 10, 2015
    Date of Patent: September 6, 2016
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Ding Wang, Terry L. Smith
  • Concentric bump design for the alignment in die stacking
    Patent number: 9437551
    Abstract: An integrated circuit structure includes an alignment bump and an active electrical connector. The alignment bump includes a first non-solder metallic bump. The first non-solder metallic bump forms a ring encircling an opening therein. The active electrical connector includes a second non-solder metallic bump. A surface of the first non-solder metallic bump and a surface of the second non-solder metallic bump are substantially coplanar with each other.
    Type: Grant
    Filed: February 13, 2014
    Date of Patent: September 6, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jung Wei Cheng, Tsung-Ding Wang, Chien-Hsun Lee
  • MULTIPLE PURPOSE OPTICAL CONNECTING ELEMENT
    Publication number: 20160238797
    Abstract: The disclosure generally relates to sets of optical waveguides such as optical fiber ribbons, and fiber optic connectors useful for connecting multiple optical fibers such as in optical fiber ribbon cables. In particular, the disclosure provides an efficient, compact, and reliable optical fiber connector that incorporates a unitary substrate combining the features of optical fiber alignment and redirection of the optical beam to a connected optical fiber.
    Type: Application
    Filed: April 7, 2016
    Publication date: August 18, 2016
    Inventors: James R. Bylander, Ding Wang
  • Package Structures and Methods of Forming the Same
    Publication number: 20160240508
    Abstract: Packages structure and methods of forming them are discussed. A structure includes a first die, a first encapsulant at least laterally encapsulating the first die, and a redistribution structure on the first die and the first encapsulant. The second die is attached by an external electrical connector to the redistribution structure. The second die is on an opposite side of the redistribution structure from the first die. A second encapsulant is on the redistribution structure and at least laterally encapsulates the second die. The second encapsulant has a surface distal from the redistribution structure. A conductive feature extends from the redistribution structure through the second encapsulant to the surface of the second encapsulant. A conductive pillar is on the conductive feature, and the conductive pillar protrudes from the surface of the second encapsulant.
    Type: Application
    Filed: April 24, 2015
    Publication date: August 18, 2016
    Inventors: Hao-Cheng Hou, Ming-Che Liu, Chun-Chih Chuang, Jung Wei Cheng, Tsung-Ding Wang, Hung-Jen Lin
  • MONITORING MODULE AND ESCALATOR/AUTOWALK INCLUDING THE MONITORING MODULE
    Publication number: 20160236911
    Abstract: The present disclosure relates to a monitoring module and an escalator/autowalk including the monitoring module. A monitoring device comprises: a first component disposed on one of the driving device of the escalator or autowalk and a fixed device; and a recess portion disposed on the other of the driving device of the escalator or autowalk and the fixed device and configured to receive at least a part of the first component; wherein a relative movement between the recess portion and the first component triggers the first component so as to indicate a movement of the driving device. By applying the monitoring device of the present disclosure, it is possible to achieve monitoring the movement of the driving device of the escalator or autowalk in multiple directions.
    Type: Application
    Filed: February 12, 2016
    Publication date: August 18, 2016
    Applicant: KONE Corporation
    Inventors: Jim Jin ANQUAN, Yi Ding WANG
  • TRANSCEIVER INTERFACE HAVING STAGGERED CLEAVE POSITIONS
    Publication number: 20160231510
    Abstract: The disclosure generally relates to sets of optical waveguides such as optical fiber ribbons, and fiber optic connectors useful for connecting multiple optical fibers such as in optical fiber ribbon cables. In particular, the disclosure provides an efficient, compact, and reliable optical fiber connector that incorporates an optically transmissive substrate combining the features of optical fiber alignment, along with redirecting and shaping of the optical beam.
    Type: Application
    Filed: April 15, 2016
    Publication date: August 11, 2016
    Inventors: James R. Bylander, Ding Wang
  • Semiconductor package including a substrate with a stepped sidewall structure
    Patent number: 9406632
    Abstract: A semiconductor package includes a passivation layer overlying a semiconductor substrate, a pillar bump overlying the passivation layer, and a molding compound layer overlying the passivation layer and covering a lower portion of the bump. A sidewall of the passivation layer is covered by the molding compound layer.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: August 2, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tsung-Ding Wang, Jung Wei Cheng, Bo-I Lee
  • OPTICAL COUPLER
    Publication number: 20160202427
    Abstract: An optical assembly includes first (102) and second (103) housings configured to move relative to each other. The first housing includes an attachment area (124) configured to permanently attach an optical waveguide (122) and having a facet (634) that optically couples the optical waveguide to the first housing. The first housing further includes an first input/output surface (112) at a non-zero angle to the facet and a light redirecting member (638) optically coupled to change a direction and divergence of light between the facet and the first input/output surface. The second housing includes a second input/output surface (113) facing and optically coupled to the first input/output surface. The first and second input/output surfaces maintain an alignment along a light propagation direction therebetween through a range of motion between the first and second housings.
    Type: Application
    Filed: September 12, 2014
    Publication date: July 14, 2016
    Inventors: Terry L. Smith, Barry J. Koch, Ding Wang
  • Molded underfilling for package on package devices
    Patent number: 9362197
    Abstract: Presented herein are a package-on-package device having a molded underfill and a method for forming the same, the method comprising applying a package mount mounting a die to the first side of a carrier package. A molded underfill may be applied first side of the carrier package, and be in contact with a portion of the package mount a portion of a sidewall of the die. A top package having at least one land may be mounted to the first side of the carrier package above the die, and, optionally separated from the top of the die. The package mount may be coined prior to, during or after applying the molded underfill to optionally be level with the underfill surface. The underfill region contacting the package mount may be below or above the surface of the underfill region contacting the die sidewall.
    Type: Grant
    Filed: November 2, 2012
    Date of Patent: June 7, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Chien-Hsun Lee, Jung Wei Cheng, Tsung-Ding Wang, Ming-Da Cheng, Yung Ching Chen
  • Cooling channels in 3DIC stacks
    Patent number: 9355933
    Abstract: An integrated circuit structure includes a die including a semiconductor substrate; dielectric layers over the semiconductor substrate; an interconnect structure including metal lines and vias in the dielectric layers; a plurality of channels extending from inside the semiconductor substrate to inside the dielectric layers; and a dielectric film over the interconnect structure and sealing portions of the plurality of channels. The plurality of channels is configured to allow a fluid to flow through.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: May 31, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Ching, Ching-Wen Hsiao, Tsung-Ding Wang, Ming Hung Tseng, Chen-Shien Chen
  • Optical connector having a plurality of optical fibres with staggered cleaved ends coupled to associated microlenses
    Patent number: 9354397
    Abstract: The disclosure generally relates to sets of optical waveguides such as optical fiber ribbons, and fiber optic connectors useful for connecting multiple optical fibers to other optical fibers or optical devices. In particular, the disclosure provides an efficient, compact and reliable optical fiber connector (100) that incorporates an optically transmissive substrate (120) receiving the optical fibers (132) in V-grooves on a first major surface thereof with their angle cleaved ends (126) arranged in a staggered arrangement so as to redirect light to an associated microlens (128) at the opposite surface of the transparent substrate (120).
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: May 31, 2016
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: James R. Bylander, Ding Wang
  • Packages with stacked dies and methods of forming the same
    Patent number: 9343433
    Abstract: A method includes bonding a first plurality of device dies onto a wafer, wherein the wafer includes a second plurality of device dies, with each of the first plurality of device dies bonded to one of the second plurality of device dies. The wafer is then sawed to form a die stack, wherein the die stack includes a first device die from the first plurality of device dies and a second device die from the second plurality of device dies. The method further includes bonding the die stack over a package substrate.
    Type: Grant
    Filed: January 28, 2014
    Date of Patent: May 17, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Hsun Lee, Tsung-Ding Wang, Mirng-Ji Lii, Chen-Hua Yu
  • Multiple purpose optical connecting element
    Patent number: 9335476
    Abstract: The disclosure generally relates to sets of optical waveguides such as optical fiber ribbons, and fiber optic connectors useful for connecting multiple optical fibers such as in optical fiber ribbon cables. In particular, the disclosure provides an efficient, compact, and reliable optical fiber connector that incorporates a unitary substrate combining the features of optical fiber alignment and redirection of the optical beam to a connected optical fiber.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: May 10, 2016
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: James R. Bylander, Ding Wang
  • Methods for forming a semiconductor device package
    Patent number: 9318465
    Abstract: A method of forming a semiconductor device package includes bonding a first connector to a first conductive structure on a first package. The method includes bonding a die to a surface of the first package, wherein a top surface of the first connector extends above a top surface of the die. The method includes surrounding the first connector with a molding compound. The method includes removing a portion of the first connector and a portion of the molding compound. The top surface of the remaining first conductor is below the top surface of the die. A first top surface of the remaining molding compound is below the top surface of the die. A second top surface of the remaining molding compound is level with the top surface of the die. The method includes bonding a second connector to the remaining portion of the first connector.
    Type: Grant
    Filed: April 8, 2015
    Date of Patent: April 19, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jung Wei Cheng, Tsung-Ding Wang, Chien-Hsun Lee, Chun-Chih Chuang
  • Semiconductor package having a recess filled with a molding compound
    Patent number: 9275924
    Abstract: A semiconductor package includes a passivation layer overlying a semiconductor substrate, a bump overlying the passivation layer, and a molding compound layer overlying the passivation layer and covering a lower portion of the bump. A sidewall of the passivation layer is covered by the molding compound layer.
    Type: Grant
    Filed: August 14, 2012
    Date of Patent: March 1, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tsung-Ding Wang, Jung Wei Cheng, Bo-I Lee
  • PACKAGE-ON-PACKAGE STRUCTURE WITH ORGANIC INTERPOSER
    Publication number: 20160056087
    Abstract: A device comprises a substrate having a die mounted on the first side of the substrate and a moldable underfill (MUF) disposed on the first side of the substrate and around the die. An interposer is mounted on the first side of the substrate, with the interposer having lands disposed on a first side of the interposer. The interposer mounted to the substrate by connectors bonded to a second side of the interposer, the connectors providing electrical connectivity between the interposer and the substrate. A package is mounted on the first side of the interposer and is electrically connected to the lands. At least one of the lands is aligned directly over the die and wherein a pitch of the connectors is different than a pitch of the lands.
    Type: Application
    Filed: August 22, 2014
    Publication date: February 25, 2016
    Inventors: Jiun Yi Wu, Yu-Min Liang, Mirng-Ji Lii, Chien-Hsun Lee, Tsung-Ding Wang, Jung Wei Cheng
  • UNDERFILL DISPENSING WITH CONTROLLED FILLET PROFILE
    Publication number: 20160056063
    Abstract: A method includes placing an underfill-shaping cover on a package component of a package, with a device die of the package extending into an opening of the underfill-shaping cover. An underfill is dispensed into the opening of the underfill-shaping cover. The underfill fills a gap between the device die and the package component through capillary. The method further includes, with the underfill-shaping cover on the package component, curing the underfill. After the curing the underfill, the underfill-shaping cover is removed from the package.
    Type: Application
    Filed: November 2, 2015
    Publication date: February 25, 2016
    Inventors: Chun-Chih Chuang, Jung Wei Cheng, Chun-Hung Lin, Tsung-Ding Wang
  • POP structures with dams encircling air gaps and methods for forming the same
    Patent number: 9263377
    Abstract: A device includes a bottom package component that includes a bottom die, and a dam over a top surface of the bottom die. The dam has a plurality of sides forming a partial ring, with an air gap surrounded by the plurality of side portions. The air gap overlaps the bottom die. A top package component is bonded to the bottom package component, wherein the air gap separates a bottom surface of the top package component from the bottom die.
    Type: Grant
    Filed: November 13, 2012
    Date of Patent: February 16, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Tsung-Ding Wang, Chen-Shien Chen, Chung-Shi Liu, Jiun Yi Wu
  • MULTIPLE PURPOSE OPTICAL CONNECTING ELEMENT
    Publication number: 20160033724
    Abstract: The disclosure generally relates to sets of optical waveguides such as optical fiber ribbons, and fiber optic connectors useful for connecting multiple optical fibers such as in optical fiber ribbon cables. In particular, the disclosure provides an efficient, compact, and reliable optical fiber connector that incorporates a unitary substrate combining the features of optical fiber alignment and redirection of the optical beam to a connected optical fiber.
    Type: Application
    Filed: October 15, 2015
    Publication date: February 4, 2016
    Inventors: James R. Bylander, Ding Wang