Abstract: A flash memory device having a mini array to store operating parameters. In one embodiment, the flash memory device comprises at least one array block of memory, one or more local latches to store one or more operating parameters and a mini array of non-volatile memory cells. The mini array is used to store the one or more operating parameters. During operation of the flash memory device, the one or more operating parameters are retrieved from the mini array and stored in associated local latches.

Abstract: An improved memory device and architecture has been detailed that enhances a Flash memory device that has an SDRAM compatible interface. The memory device employs a virtual paging scheme that allows the memory to have an efficient Flash internal structure, while logically re-mapping this architecture externally to a compatible virtual SDRAM architecture. This allows for access and operation of the improved memory device with a compatible SDRAM controller device, while Flash specific functions can be performed with an SDRAM command sequence. Internal to the memory, memory array banks are divided into four equal segments by row range and logically re-mapped by placing the segments virtually beside each other. This forms a virtual memory bank structure of equivalent rows and columns as a comparable SDRAM device. Additionally, the improved memory device may also have an extended interface that allows for direct access to the internal Flash memory architecture without logical abstraction.

Abstract: A set of high speed interconnect lines for an integrated circuit has an improved line-to-line capacitance and overall RC time constant. The high speed interconnect line set incorporates a series of interconnect lines, wherein shorter run lines are routed between longer run lines. As the short run interconnect lines reach their destination and fall away they open up the line spacing and improve the line-to-line capacitance that dominates capacitive effects in modern reduced feature size integrated circuits. Additionally, the cross sectional area of the interconnect lines can be increased to lower the line resistance of longer run lines and compensate for the line capacitance without increasing the line-to-line capacitance. The capacitances, resistances, and RC time constants can be optimized for a single line of a group or for the entire group of interconnect lines, providing a low average value or a uniform value across all lines for uniform propagation delay.

Abstract: A set of high speed interconnect lines for an integrated circuit has an improved line-to-line capacitance and overall RC time constant. The high speed interconnect line set incorporates a series of interconnect lines, wherein shorter run lines are routed between longer run lines. As the short run interconnect lines reach their destination and fall away they open up the line spacing and improve the line-to-line capacitance that dominates capacitive effects in modern reduced feature size integrated circuits. Additionally, the cross sectional area of the interconnect lines can be increased to lower the line resistance of longer run lines and compensate for the line capacitance without increasing the line-to-line capacitance. The capacitances, resistances, and RC time constants can be optimized for a single line of a group or for the entire group of interconnect lines, providing a low average value or a uniform value across all lines for uniform propagation delay.

Abstract: A set of high speed interconnect lines for an integrated circuit has an improved line-to-line capacitance and overall RC time constant. The high speed interconnect line set incorporates a series of interconnect lines, wherein shorter run lines are routed between longer run lines. As the short run interconnect lines reach their destination and fall away they open up the line spacing and improve the line-to-line capacitance that dominates capacitive effects in modern reduced feature size integrated circuits. Additionally, the cross sectional area of the interconnect lines can be increased to lower the line resistance of longer run lines and compensate for the line capacitance without increasing the line-to-line capacitance. The capacitances, resistances, and RC time constants can be optimized for a single line of a group or for the entire group of interconnect lines, providing a low average value or a uniform value across all lines for uniform propagation delay.

Abstract: An improved memory device and architecture has been detailed that enhances a Flash memory device that has an SDRAM compatible interface. The memory device employs a virtual paging scheme that allows the memory to have an efficient Flash internal structure, while logically re-mapping this architecture externally to a compatible virtual SDRAM architecture. This allows for access and operation of the improved memory device with a compatible SDRAM controller device, while Flash specific functions can be performed with an SDRAM command sequence. Internal to the memory, memory array banks are divided into four equal segments by row range and logically re-mapped by placing the segments virtually beside each other. This forms a virtual memory bank structure of equivalent rows and columns as a comparable SDRAM device. Additionally, the improved memory device may also have an extended interface that allows for direct access to the internal Flash memory architecture without logical abstraction.

Abstract: A flash memory has erase blocks aligned primarily with array rows and secondarily with array rows. This architecture allows data to be stored across numerous pages without risking accidental erasure caused by crossing multiple erase blocks. As a result, non-volatile memory devices to be more easily substituted for volatile memory devices. In one embodiment, a flash memory includes an array of memory cells that have a plurality of adjacent pages. Addresses of the memory cells are scrambled within the pages to define erase blocks that cross the page boundaries.

Abstract: A method of erasing a memory cell includes the step of erasing a memory cell. The current in the memory cell is measured. If the measured memory cell current approximately exceeds a predetermined level, the memory cell is soft programmed so if the memory cell is not overerased, the memory cell is undisturbed. The memory cell is soft programmed until the measured memory cell current is less than or equal to the predetermined level.

Abstract: A serial command port for a flash memory device, such as an erasable programmable read-only memory (EPROM) or an electrically erasable programmable read-only memory (EEPROM), is disclosed. A main clock generator circuit is used to filter external signals. The main clock generator circuit generates a main clock signal when the external signals have been asserted for a predetermined amount of time. The command port receives commands via a data bus, and a command clock generator generates a command clock signal in response to the main clock signal to latch commands from the data bus into a command register. The command register is coupled to send each command to a command decode logic circuit to be decoded. A state clock generator generates a state clock signal following the main clock signal such that a state latch and logic circuit coupled to the command decode logic circuit changes state in response to the decoded command.

Abstract: A non-volatile memory device having separate read and write paths. In one embodiment, a flash memory device has a memory array, a first multiplexer and a second multiplexer. The memory array has non-volatile memory cells arranged in columns and rows. Each memory cell in a column is coupled to an associated bit line. The first multiplexer is coupled to select bit lines during write operations to the memory array. The second multiplexer is coupled to select bit lines during read operations from the memory array.

Abstract: A serial command port for a flash memory device, such as an erasable programmable read-only memory (EPROM) or an electrically erasable programmable read-only memory (EEPROM), is disclosed. A main clock generator circuit is used to filter external signals. The main clock generator circuit generates a main clock signal when the external signals have been asserted for a predetermined amount of time. The command port receives commands via a data bus, and a command clock generator generates a command clock signal in response to the main clock signal to latch commands from the data bus into a command register. The command register is coupled to send each command to a command decode logic circuit to be decoded. A state clock generator generates a state clock signal following the main clock signal such that a state latch and logic circuit coupled to the command decode logic circuit changes state in response to the decoded command.

Abstract: A set of high speed interconnect lines for an integrated circuit has an improved line-to-line capacitance and overall RC time constant. The high speed interconnect line set incorporates a series of interconnect lines, wherein shorter run lines are routed between longer run interconnect lines. As the short run interconnect lines reach their destination and fall away they open up the line spacing on the remaining interconnect lines and improve the line-to-line capacitance that dominates capacitive effects in modern reduced feature size integrated circuits. Additionally, the cross sectional area of the interconnect lines can be increased to lower the line resistance of longer run lines and compensate for the line capacitance without critically increasing the line-to-line capacitance of these lines and adversely affecting the overall line RC time constant.

Abstract: A flash memory has an interface corresponding to a DDR DRAM. The memory samples commands and addresses on a rising edge of a clock signal. The read and write data are provided on both the rising edge and the falling edge of the clock signal.

Abstract: A computer system comprises a memory controller and a synchronous non-volatile memory device coupled to the memory controller via a main memory bus. The synchronous flash memory device, in one embodiment, has a command interface comprising a write enable connection (WE#) to receive a write enable signal, a column address strobe connection (CAS#) to receive a column address strobe signal, a row address strobe connection (RAS#) to receive a row address strobe signal. A command operation is initiated in response to a sequence of ACTIVE/WRITE and/or ACTIVE/READ commands provided on the WE#, CAS# and RAS# connections.

Abstract: A computer system comprises a memory controller and a synchronous non-volatile memory device coupled to the memory controller via a main memory bus. The synchronous flash memory device, in one embodiment, has a command interface comprising a write enable connection (WE#) to receive a write enable signal, a column address strobe connection (CAS#) to receive a column address strobe signal, a row address strobe connection (RAS#) to receive a row address strobe signal. A command operation is initiated in response to a sequence of ACTIVE/WRITE and/or ACTIVE/READ commands provided on the WE#, CAS# and RAS# connections.

Abstract: A flash memory has been described that can be coupled to an SDRAM controller that performs address scrambling. The flash memory includes a programmable address de-scrambler. The de-scrambler can be programmed to de-scramble primarily row addresses, including bank addresses, to maintain a common erase block location for sequential data. The present invention reduces the possibility of writing contiguous data to multiple erase blocks. The de-scrambler can be implemented as a programmable switch. The switch includes a routing circuit that can be programmed in a non-volatile manner.

Abstract: A flash memory has been described that can be coupled to an SDRAM controller that performs address scrambling. The flash memory includes a programmable address de-scrambler. The de-scrambler can be programmed to de-scramble primarily row addresses, including bank addresses, to maintain a common erase block location for sequential data. The present invention reduces the possibility of writing contiguous data to multiple erase blocks. The de-scrambler can be implemented as a programmable switch. The switch includes a routing circuit that can be programmed in a non-volatile manner.

Abstract: A flash memory has an interface corresponding to a DDR DRAM. The memory samples commands and addresses on a rising edge of a clock signal. The read and write data are provided on both the rising edge and the falling edge of the clock signal.

Abstract: A flash memory has been described that has an interface corresponding to a rambus dynamic random access memory (RDRAM). The memory samples commands and addresses on a rising edge of a clock signal. The read and write data are provided on both the rising edge and the falling edge of the clock signal.

Abstract: A flash memory is described which uses floating gate transistors as memory cells. A source regulation circuit within the memory is described which generates a ramped reference voltage signal. The ramped reference voltage signal is applied to a differential amplifier connected to a reference circuit to produce a ramped erase voltage signal. The ramped erase voltage signal is then applied to sources of the memory cells during an erase operation. Both analog and digital circuits are described for generating the ramped reference voltage signal.