Abstract: Techniques for fabricating metal devices, such as vertical light-emitting diode (VLED) devices, power devices, laser diodes, and vertical cavity surface emitting laser devices, are provided. Devices produced accordingly may benefit from greater yields and enhanced performance over conventional metal devices, such as higher brightness of the light-emitting diode and increased thermal conductivity. Moreover, the invention discloses techniques in the fabrication arts that are applicable to GaN-based electronic devices in cases where there is a high heat dissipation rate of the metal devices that have an original non- (or low) thermally conductive and/or non- (or low) electrically conductive carrier substrate that has been removed.

Abstract: A silver-supporting bamboo charcoal (BC/Ag) comprising silver in different weight ratio of 26% (BC/Ag-1), 29% (BC/Ag-2), 34% (BC/Ag-3), 48% (BC/Ag-4), 57% (BC/Ag-5), or 75% (BC/Ag-6). The BC powders (particle size<10 ?m, Taiwan Paiho) are activated with surfactant sodium alginate under stirred for 1 h. The as-prepared BC powders (2 g) are immersed into 100 mL of biamminesilver nitrate ([Ag(NH3)2]NO3) solutions, which are formed by adding 28 wt. % aqueous ammonia into AgNO3 solution at room temperature. After stirring for 1 h, dilute aqueous solutions of hydrazine monohydrate are separately prepared and introduced to the BC-AgNO3 solutions in appropriate quantities (molar ratio 1:1 with respect to silver nitrate) by a syringe. Stirring is continued under inert atmosphere at room temperature for another 4 h. The BC/Ag particles are separated and washed with deionized water and ethanol, then dried in vacuum at 60° C. for overnight.

Abstract: Embodiments of the invention provide an integrated circuit structure comprising: a substrate; a shield structure comprising a shield member and a ground strap formed on the substrate, wherein the shield member comprises a non-metallic portion, and the ground strap comprises a metallic portion.

Abstract: The BC powders (particle size<10 ?m, Taiwan Paiho) are activated with surfactant sodium alginate under stirred for 1 h. The as-prepared BC powders (2 g) are immersed into 100 mL of biamminesilver nitrate ([Ag(NH3)2]NO3) solutions, which are formed by adding 28 wt. % aqueous ammonia into AgNO3 solution at room temperature. After stirring for 1 h, dilute aqueous solutions of hydrazine monohydrate are separately prepared and introduced to the BC-AgNO3 solutions in appropriate quantities (molar ratio 1:1 with respect to silver nitrate) by a syringe. Stirring is continued under inert atmosphere at room temperature for another 4 h. The BC/Ag particles are separated and washed with deionized water and ethanol, then dried in vacuum at 60° C. for overnight.

Abstract: An antibacterial nano-silver contained polymer absorbent and sanitary articles thereof includes a polymer absorbent and an antibacterial material coated thereon that has a plurality of supporting elements adsorbed nano-silver. The antibacterial nano-silver contained polymer absorbent is adopted on sanitary articles to be in contact with secretion generating portions of users to directly absorb secretions of user's body or prevent microbe-contained external air from entering the user's body to provide disinfecting effect and a healthy condition for the user.

Abstract: This invention provides a plant senescence-inducible promoter and its relevant recombinant plasmid and transgenic plant.

Abstract: Methods for fabricating a semiconductor light-emitting diode (LED) device with increased light extraction are provided. The method generally includes applying a mask to a surface of an LED wafer, etching the surface of the LED wafer such that etched pits are formed in the surface, removing the mask, and roughening or texturing the surface of the LED wafer including the etched pits. In this manner, the surface area of the LED device may be increased when compared to a conventional LED device, and less emitted light may experience total internal reflection (TIR) according to Snell's law, thereby leading to increased light extraction.

Abstract: An auxiliary mirror assembly for a sideview mirror of a car includes an auxiliary mirror including a mirror body and a connecting base, a first support bar and a second support bar each mounted on the connecting base, a first holding base and a second holding base each mounted on the first support bar and each provided with at least one holding flange, a locking hook and a binding strap. Thus, the first support bar and the second support bar are combined with the sideview mirror to attach the auxiliary mirror to the sideview mirror to extend the side-viewing distance of the sideview mirror so that when a trailer is attached to the car, the driver in the car can see clearly the trailer behind the car by the auxiliary mirror.

Abstract: Methods are provided for fabricating a semiconductor light-emitting diode (LED) device by providing an LED wafer assembly having an LED stack and selectively roughening and/or texturing a light-emitting surface of the LED stack's n-doped layer. In this manner, light extraction from the LED device is improved.

Abstract: A method for the separation of multiple dies during semiconductor fabrication is described. On an upper surface of a semiconductor wafer containing multiple dies, metal layers are deposited everywhere except where a block of stop electroplating material exists. The stop electroplating material is obliterated, and a barrier layer is formed above the entire remaining structure. A sacrificial metal element is added above the barrier layer, and then the substrate is removed. After the semiconductor material between the individual dies is eradicated, any desired bonding pads and patterned circuitry are added to the semiconductor surface opposite the sacrificial metal element, a passivation layer is added to this surface, and then the sacrificial metal element is removed. Tape is added to the now exposed barrier layer, the passivation layer is removed, the resulting structure is flipped over, and the tape is expanded to separate the individual dies.

Abstract: A lockable storage container for disc-like information storage media is disclosed. The storage container has a cover and a disc holder. The cover of the storage container has a notch structure formed on the inner surface at an open-side thereof. The disc holder has at least a projection element disposed around the annular sidewall. The storage container is locked by conjugating the projection element and the corresponding notch structure. In order to separate the cover and the disc holder, the projection element has to be broken. Accordingly, the storage container is lockable and prevents the disc-like storage media disposed therein from being stolen.

Abstract: Techniques for controlling current flow in semiconductor devices, such as LEDs are provided. For some embodiments, a current guiding structure may be provided including adjacent high and low contact areas. For some embodiments, a second current path (in addition to a current path between an n-contact pad and a metal alloy substrate) may be provided. For some embodiments, both a current guiding structure and second current path may be provided.

Abstract: A method for the separation of multiple dies during semiconductor fabrication is described. On an upper surface of a semiconductor wafer containing multiple dies, metal layers are deposited everywhere except where a block of stop electroplating material exists. The stop electroplating material is obliterated, and a barrier layer is formed above the entire remaining structure. A sacrificial metal element is added above the barrier layer, and then the substrate is removed. After the semiconductor material between the individual dies is eradicated, any desired bonding pads and patterned circuitry are added to the semiconductor surface opposite the sacrificial metal element, a passivation layer is added to this surface, and then the sacrificial metal element is removed. Tape is added to the now exposed barrier layer, the passivation layer is removed, the resulting structure is flipped over, and the tape is expanded to separate the individual dies.

Abstract: A sideview mirror includes multiple parts, wherein the mirror body, the washer, the spring, the support member, the bearing, the rotation member, and the mounting member are combined to form a window corner type sideview mirror, while the mirror body, the washer, the spring, the support member, and the mounting member are combined to form a car side body type sideview mirror. Thus, the window corner type sideview mirror only needs to provide the fixing member additionally to replace the bearing, the rotation member, and the mounting member to form the car side body type sideview mirror, so that the sideview mirror is both available for a window corner type sideview mirror and a car side body type sideview mirror.

Abstract: The BC powders (particle size<10 ?m, Taiwan Paiho) are activated with surfactant sodium alginate under stirred for 1 h. The as-prepared BC powders (2 g) are immersed into 100 mL of biamminesilver nitrate ([Ag(NH3)2]NO3) solutions, which are formed by adding 25 wt. % aqueous ammonia into AgNO3 solution at room temperature. After stirring for 1 h, dilute aqueous solutions of hydrazine monohydrate are separately prepared and introduced to the BC-AgNO3 solutions in appropriate quantities (molar ratio 1:1 with respect to silver nitrate) by a syringe. Stirring is continued under inert atmosphere at room temperature for another 4 h. The BC/Ag particles are separated and washed with deionized water and ethanol, then dried in vacuum at 60° C. for overnight.

Abstract: Techniques for dicing wafer assemblies containing multiple metal device dies, such as vertical light-emitting diode (VLED), power device, laser diode, and vertical cavity surface emitting laser device dies, are provided. Devices produced accordingly may benefit from greater yields and enhanced performance over conventional metal devices, such as higher brightness of the light-emitting diode and increased thermal conductivity. Moreover, such techniques are applicable to GaN-based electronic devices in cases where there is a high heat dissipation rate of the metal devices that have an original non- (or low) thermally conductive and/or non- (or low) electrically conductive carrier substrate that has been removed.

Abstract: Systems and methods are disclosed for fabricating a semiconductor light-emitting diode (LED) device by forming an n-doped gallium nitride (n-GaN) layer on the LED device and roughening the surface of the n-GaN layer to extract light from an interior of the LED device.

Abstract: Techniques for fabricating metal devices, such as vertical light-emitting diode (VLED) devices, power devices, laser diodes, and vertical cavity surface emitting laser devices, are provided. Devices produced accordingly may benefit from greater yields and enhanced performance over conventional metal devices, such as higher brightness of the light-emitting diode and increased thermal conductivity. Moreover, the invention discloses techniques in the fabrication arts that are applicable to GaN-based electronic devices in cases where there is a high heat dissipation rate of the metal devices that have an original non- (or low) thermally conductive and/or non- (or low) electrically conductive carrier substrate that has been removed.

Abstract: A method of cleaning a reaction chamber having a wafer holder is provided. First, the reaction chamber is cleaned by a cleaning gas. Next, a protection film is formed on the inner surface of the reaction chamber, wherein a gap is formed between the protection wafer and the wafer holder, and a cooling gas is guided therebetween simultaneously.

Abstract: A sideview mirror includes multiple parts, wherein the mirror body, the washer, the spring, the support member, the bearing, the rotation member, and the mounting member are combined to form a window corner type sideview mirror, while the mirror body, the washer, the spring, the support member, and the mounting member are combined to form a car side body type sideview mirror. Thus, the window corner type sideview mirror only needs to provide the fixing member additionally to replace the bearing, the rotation member, and the mounting member to form the car side body type sideview mirror, so that the sideview mirror is both available for a window corner type sideview mirror and a car side body type sideview mirror.