Abstract: Provided is an electronic package, in which a heat dissipating body is formed on an electronic device and is combined with a heat sink so that the electronic device, the heat dissipating body and the heat sink form a receiving space, and a heat dissipating material is formed in the receiving space and in contact with the heat sink and the electronic device, where a fluid regulating space is formed between the heat dissipating material and the heat dissipating body and is used as a volume regulating space for the heat dissipating material during thermal expansion and contraction.

Abstract: A connector lock structure includes an insulating body, a plurality of terminals, a shell, a locking assembly, a sliding board, a pressing element and an unlocking tool. The insulating body is molded around the plurality of the terminals. The shell surrounds the insulating body. The locking assembly includes at least one lacking groove, and at least one elastic arm formed in the at least one lacking groove. The at least one elastic arm has a hook structure. The hook structure is cooperated with a blocking groove of a docking connector. The pressing element is mounted in the insulating body. The sliding board is slidably mounted under the pressing element. One end of the pressing element has a locking portion. The locking portion has a keyhole. The unlocking tool is inserted in the keyhole.

Abstract: A parametric equalizer includes an equalizer circuit, a first protection circuit, a second protection circuit, and a first addition circuit. The equalizer circuit is arranged to receive an input signal, and process the input signal to generate an output signal. The first protection circuit is arranged to generate a first protection signal according to the output signal, the input signal, and a first processed signal. The second protection circuit is arranged to generate a second protection signal according to the input signal and a second processed signal. The first addition circuit is coupled to the first protection circuit and the second protection circuit, and is arranged to combine the first protection signal and the second protection signal to generate an equalizer output signal.

Abstract: Provided is an improved mold structure, including a first mold base, a second mold base and two controllers. The first mold base and the second mold base are operably aligned. When the first mold base and the second mold base are in an aligned state, a mold cavity is jointly framed. Two gas passages, a first mold core and a second mold core are provided. The first mold base is provided with a runner. Two ends thereof are respectively connected to a material tube and a mold cavity of a molding machine. The first and second mold cores are made of porous material. Vent pipelines thereof are connected to the respective gas passages. The two controllers are respectively connected to the gas passages, and control the gas in and out such that the pressure in different areas in the mold cavity reaches a predetermined value, thereby controlling the flow direction of the raw material in the mold cavity.

Abstract: An electronic package is provided and includes a carrier for carrying electronic components. Electrical contact pads of the carrier for planting solder balls are connected with a plurality of columnar conductors, and the conductors are electrically connected to a circuit portion in the carrier. By connecting a plurality of conductors with a single electrical contact pad, structural stress can be distributed and breakage of the circuit portion can be prevented.

Abstract: An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures. The circuit block and the circuit board embedded in the encapsulating layer are spaced apart from each other to allow to separate current conduction paths. As such, the circuit board will not overheat, and issues associated with warpage of the circuit board can be eliminated. Moreover, by embedding the circuit block and the circuit board in the encapsulating layer at a distance to each other, the structural strength of the encapsulating layer can be improved.

Abstract: An adsorption device includes a substrate and a magnetic film on a surface of the substrate. The substrate has magnetic properties and is capable of generating magnetic field. The magnetic film partially covers the surface. The magnetic film generates a magnetic field having a direction that is opposite to a direction of the magnetic field generated by the substrate. Portions of the surface of the substrate not covered by the magnetic film form positions to attract and adsorb target objects, and other portion of the surface of the substrate covered by the magnetic film is not able to attract any target object.

Abstract: The present disclosure provides a package stack structure and a method for manufacturing the same. The method is characterized by stacking coreless circuit portions on the board of an electronic component to reduce the overall thickness of the package stack structure.

Abstract: Semiconductor devices having flow controllers configured to reduce mitigation of mold material between stacked layers, and associated systems and methods, are disclosed herein. In some embodiments, the semiconductor device includes a package substrate that has first and second surfaces. First and second die stacks are formed on the first surface and are adjacent to each other. A portion of the first surface extends between the first and second die stacks. A layer of material is adhered to top surfaces of the first and second die stacks and extends at a distance above the package substrate to form a tunnel between the layer of material, opposing sidewalls of the die stacks, and the package substrate. The semiconductor device further includes a flow controller that is adhered to at least a portion of the first surface inside the tunnel that reduces a cross-sectional surface area of at least a portion of the tunnel.

Abstract: A pixel array is provided. The pixel array includes a plurality of red pixels, a plurality of green pixels, and a plurality of blue pixels. Each green pixel includes a light emitting diode (LED), a first transistor, a second transistor, a third transistor, and a fourth transistor. The LED receives a system low voltage. The first transistor receives a first data signal and a first scan signal. The second transistor is coupled to a second end of the first transistor and the anode of the light emitting diode. The third transistor receives a system high voltage and a first control signal, and is coupled to a first end of the second transistor. The fourth transistor is coupled to the anode of the light-emitting diode of an adjacent green pixel, a control terminal of the third transistor, and the anode of the light-emitting diode.

Abstract: A heat dissipation structure is provided and includes a heat dissipation body and an adjustment channel. A carrying area and an active area adjacent to the carrying area are defined on a surface of the heat dissipation body, the carrying area is used for applying a first heat dissipation material thereonto, and the adjustment channel is formed in the active area, where one end of the adjustment channel communicates with the outside of the heat dissipation structure, and the other end communicates with the carrying area. Therefore, when the heat dissipation body is coupled to the electronic component by the first heat dissipation material, the adjustment channel can adjust a volume of the first heat dissipation material.

Abstract: The present disclosure relates to a driving method for a display device and a display device. The display device includes a display driver, the display driver includes a plurality of driving channels each of which drives corresponding display unit according to display data in a pulse width modulation manner within one frame period, the method comprises: selectively enabling, in each sub-frame subset among a plurality of different sub-frame subsets of the frame period, different channel subset among a plurality of channel subsets of the plurality of driving channels to drive corresponding display unit, wherein each channel subset of the plurality of channel subsets includes two or more driving channels among the plurality of driving channels.

Abstract: An image transmission system is disclosed. The image transmission system includes at least one image capturing device, at least one conversion device, at least one image processor, and at least one flexible printed circuit (FPC). The at least one FPC includes at least one conductive layer and at least one optical waveguide layer. The at least one image capturing device is configured to capture at least one data. The at least one conversion device is configured to perform a conversion between the at least one data and an optical signal. The at least one image processor is configured to obtain the at least one data according to the optical signal, and processes the data. The at least one optical waveguide layer is configured to transmit the optical signal.

Abstract: A semiconductor device includes a drift region, a dielectric film, and an anti-type doping layer. The drift region has a first type conductivity. The anti-type doping layer is located between the drift region and the dielectric film, and has a second type conductivity opposite to the first type conductivity so as to change a current path of a current in the drift region, to thereby prevent the current from being influenced by the dielectric film. A method for manufacturing a semiconductor device and a method for reducing an influence of a dielectric film are also disclosed.

Abstract: A device to attract and hold microscopic items such as micro LEDs magnetically rather than by static electricity includes a substrate and a plurality of magnetic units on a surface of the substrate. The magnetic units are spaced apart from each other and are constrained in the size and direction of their individual magnetic fields. Each of the magnetic units includes a magnet and a cladding layer partially covering the magnet. The cladding layer is made of a magnetic material. A side of the magnet away from the substrate is exposed from the cladding layer to attract and hold one micro LED.

Abstract: A SIM card connector includes an insulating body, a plurality of first terminals and a plurality of second terminals. The insulating body has a plurality of first slots and a plurality of second slots. Each side wall of each first slot has a limiting slot. The plurality of the first terminals are inserted into the plurality of the first slots. Each first terminal has a first base portion, a first soldering portion connected with a lower end of the first base portion, and a first contacting portion connected with an upper end of the first base portion. The plurality of the second terminals are inserted into the plurality of the second slots. Each second terminal has a second contacting portion slantwise extended towards a rear end of the insulating body and exposed beyond a top surface of the insulating body.

Abstract: A hybrid multi-layered optical flexible printed circuit device, comprising: an optical flexible substrate including a first open window and a second open window with a first, a second surfaces opposite to each other; an intrinsic film including a first bonding region aligned with the first open window and a second bonding region aligned with the second open window formed on the first surface; an optical waveguide film including a first notch with a first slant surface aligned with the first bonding region, and a second notch with a second slant surface aligned with the second bonding region formed on the second surface and encompassed the first open window and the second open window; a first flexible printed circuit board formed on the optical waveguide film; and a first optoelectronic device and a second optoelectronic device mounted in the first bonding region and the second bonding region of the intrinsic film.

Abstract: Provided is a mold structure with a fast replacement of a mold core, including an upper mold base and a lower mold base corresponding to the upper mold base. The upper mold base is provided with at least one upper mold base, wherein the bottom of the upper mold base is provided with a push-pull device, the push-pull device includes a pressure cylinder and a push-pull rod capable of expansion and contraction and the upper mold core is driven by the expansion and contraction of the push-pull rod, and is relatively separated from or embedded in the upper mold base, and wherein the bottom of the upper mold core is provided with a chute, and the upper mold core is operatively coupled with or separated from the push-pull rod by the chute. Consequently, the action of replacing the mold core is performed.

Abstract: An electrical connector assembly includes a first connector, and a second connector docked with the first connector. The first connector includes a first insulating housing, a plurality of first signal terminals disposed in the first insulating housing, and a plurality of first power terminals disposed in the first insulating housing. Extension directions of the plurality of the first power terminals are multiple directions. The second connector includes a second insulating housing, a plurality of second signal terminals disposed in the second insulating housing, and a plurality of second power terminals disposed in the second insulating housing. Extension directions of the plurality of the second power terminals are multiple directions. The plurality of the first signal terminals are corresponding to the plurality of the second signal terminals. The plurality of the second power terminals correspondingly contact with the plurality of the first power terminals.

Abstract: A switch circuit provides a first output signal and a second output signal for switching between ternary modulation and quaternary modulation for a target device. A first output signal is provided from one of a first signal, a second signal and a ground signal according to an input signal and a duty signal, wherein the first signal is generated through performing a one-bit left-shift operation for the input signal, and the second signal is generated through adding the input signal and the duty signal. A second output signal is provided from one of a third signal, a fourth signal and the ground signal according to the input signal and the duty signal, wherein the third signal is generated through subtracting the input signal from the duty signal, and the fourth signal is generated through performing a two's-complement transformation and the one-bit left-shift operation for the input signal.