Abstract: A package stacked structure and a method for fabricating the same are provided. The method includes providing a wiring structure disposed with a carrier and a carrier structure provided with an electronic component. The wiring structure is bonded to the carrier structure via a plurality of conductive elements. An encapsulating layer is formed between the wiring structure and the carrier structure and encapsulates the conductive elements and the electronic component. The carrier is then removed. With the arrangement of the carrier, the structural strength of the wiring structure is improved, and warpage of the wiring structure is prevented before stacking the wiring structure onto the carrier structure.

Abstract: An optical identification method, includes: projecting light on a finger to generate reflected light from the finger; receiving the reflected light by a pixel sensing array to obtain a plurality of finger images; and determining whether the finger images present a liveness characteristic, according to a required exposure time or average brightness of the finger images obtained by the pixel sensing array. When the finger images present the liveness characteristic, the optical identification method further includes: determining identification information according to the finger images; or when the finger images do not present the liveness characteristic, the optical identification method further includes: not determining identification information according to the finger images, and optionally, stopping the pixel sensing array from obtaining a subsequent finger image.

Abstract: A virtual bass generating circuit used in a speaker is used to filter out a high frequency part of an audio signal to generate a low passed audio signal, generates an even and odd audio signals respectively having even and odd harmonics of the low passed audio signal according to the low passed audio signal, subtracts an amplified low passed audio signal from an addition of an amplified even audio signal and an amplified odd audio signal to generate a first calculated audio signal, filters out a low frequency part and a high frequency part of the first calculated audio signal to generate a band passed audio signal, and adds the band passed audio signal and the audio signal to generate a second calculated audio signal with enhanced even and odd harmonics of the audio signal.

Abstract: An insulation resistance measuring device for detecting insulation resistance of an electric vehicle comprising a battery system, a measuring unit, a control unit and a calculation unit. The measuring unit comprises a circuit module, a first switch, a second switch and a voltage detecting unit. The circuit module comprises a plurality of resistances, which connected between a positive side and a negative side of the battery system. The first switch is connected between the circuit module and a ground side. The second switch is connected between the circuit module and the negative side. The voltage detecting unit is arranged at a connecting node of the resistances of the circuit module. The control unit is configured to control the first switch and the second switch to turn on or turn off. The calculation unit is configured to calculate a high potential insulation resistance and a low potential insulation resistance of the electric vehicle.

Abstract: A display device comprising an active area and a surrounding area is provided. The active area includes a common electrode for receiving a common voltage. The surrounding area is located at a side of the active area, and the surrounding area includes a shielding metal layer and a surrounding circuit. The shielding metal layer is electrically isolated from the common electrode and receives a shielding voltage. The surrounding circuit and a first shielding metal are overlapped in a vertical projection direction, and the common voltage is power-isolated from the shielding voltage.

Abstract: Provided is a substrate structure including a substrate body, electrical contact pads and an insulating protection layer disposed on the substrate body, wherein the insulating protection layer has openings exposing the electrical contact pads, and at least one of the electrical contact pads has at least a concave portion filled with a filling material to prevent solder material from permeating along surfaces of the insulating protection layer and the electric contact pads, thereby eliminating the phenomenon of solder extrusion. Thus, bridging in the substrate structure can be eliminated even when the bump pitch between two adjacent electrical contact pads is small. As a result, short circuits can be prevented, and production yield can be increased.

Abstract: The present disclosure provides a method for manufacturing an electronic package, with an electronic component bonded to a carrier structure by means of solder tips formed on conductive bumps, wherein the solder tips do not require a reflow process to be in contact with the carrier structure, thereby allowing the conductive bumps to have an adequate amount of solder tips formed thereon and thus precluding problems such as cracking and collapsing of the solder tips.

Abstract: Provided is an injection molding device, including an injection port arranged on an upper mold base; an upper mold arranged in the upper mold base, wherein at least one ejection port, a gasket groove and a gasket are provided and the ejection portion is connected to the injection port; a lower mold base operatively aligned with or separated from the upper mold base and provided with at least one gas passage for the gas to enter or exit; and a lower mold disposed on the lower mold base. The lower mold base is aligned with or separated from the upper mold base, the lower mold is provided with a mold cavity and at least one shaped air path is provided to connect the mold cavity with the gas passage. The lower mold is a porous material and has a plurality of pores. Gas is pre-injected into the mold cavity through the gas passage and at least one air path to maintain a preset pressure inside the mold cavity.

Abstract: A rechargeable battery and an electrode thereof are provided. The rechargeable battery includes two electrodes and an ionic conduction layer. The ionic conduction layer is disposed between the two electrodes. At least one electrode includes a diffusion-assisting structure facing to the ionic conduction layer. The diffusion-assisting structure has a concaved pattern.

Abstract: An electromagnetic wave charge management circuit includes: an antenna to receive an electromagnetic wave signal; a filtering unit electrically connected to the antenna to filter the electromagnetic wave signal received by the antenna; a converting unit electrically connected to the filtering unit to convert the filtered electromagnetic wave signal by the filtering unit into a direct current voltage; a charging unit electrically connected to the converting unit to provide the direct current voltage generated by the converting unit to an internal power supplier of the receiver device; and a controlling unit electrically connected to the filtering unit and the charging unit to transmit a first control signal that is for controlling the filtering unit to filter the electromagnetic wave signal, and a second control signal that is for controlling the charging unit to provide the direct current voltage generated by the converting unit to the internal power supplier.

Abstract: An electricity management method of wireless charging includes: detecting a charging request signal sent by a receiver device; selecting a transmitter device according to a location of the receiver device; detecting the location of the receiver device and a plurality of micro-electrometric wave charging environmental parameters thereof; collecting a strength distribution of a micro-electrometric wave signal frequency band in an area where the transmitter device is located, and transmitting area charging performance information based on the strength distribution of the micro-electrometric wave signal frequency band and area information of the area where the transmitter device is located; selecting one of the plurality of charging modes based on the charging request signal and the micro-electrometric wave charging environmental parameters; and based on the selected charging mode, controlling the transmitter device to turn on a charging function corresponding to the receiver device to charge the receiver device.

Abstract: A method of forming a package and a package are provided. The method includes placing a main die and a dummy die side by side on a carrier substrate. The method also includes forming a molding material along sidewalls of the main die and the dummy die. The method also includes forming a redistribution layer comprising a plurality of vias and conductive lines over the main die and the dummy die, where the plurality of vias and the conductive lines are electrically connected to connectors of the main die. The method also includes removing the carrier substrate.

Abstract: An electronic package is provided, which includes: a first substrate; a first electronic component disposed on the first substrate; a second substrate stacked on the first substrate through a plurality of first conductive elements and a plurality of second conductive elements and bonded to the first electronic component through a bonding layer; and a first encapsulant formed between the first substrate and the second substrate. The first conductive elements are different in structure from the second conductive elements so as to prevent a mold flow of the first encapsulant from generating an upward pushing force during a molding process and hence avoid cracking of the second substrate. The present disclosure further provides a method for fabricating the electronic package.

Abstract: A non-volatile memory includes a back gate, a first graphene ribbon layer, a dielectric layer, a second graphene ribbon layer and a porous dielectric layer. The back gate is disposed in a substrate. The first graphene ribbon layer is disposed on the substrate. The dielectric layer covers the first graphene ribbon layer but exposes an exposed part of the first graphene ribbon layer. The second graphene ribbon layer including two end parts connected by a cantilever part is disposed above the first graphene ribbon layer, and the cantilever part is right above the exposed part of the first graphene ribbon layer. The porous dielectric layer is disposed on the dielectric layer and seals the cantilever part. The present invention also provides a method of forming said non-volatile memory.

Abstract: A TSV structure includes a substrate comprising at least a TSV opening formed therein, a conductive layer disposed in the TSV opening, and a bi-layered liner disposed in between the substrate and the conductive layer. More important, the bi-layered liner includes a first liner and a second liner, and a Young's modulus of the first liner is different from a Young's modulus of the second liner.

Abstract: A signal processing method for a touch panel includes transmitting a first driving signal to a first touch channel of the touch panel; and transmitting a second driving signal to a second touch channel of the touch panel, wherein the second touch channel is neighboring to the first touch channel. The first driving signal is substantially identical to the second driving signal during a first period, and the first driving signal is substantially inverse to the second driving signal during a second period neighboring to the first period.

Abstract: A device performs a method for using image data to aid voice recognition. The method includes the device capturing (302) image data of a vicinity of the device and adjusting (304), based on the image data, a set of parameters for voice recognition performed by the device (102). The set of parameters for the device performing voice recognition include, but are not limited to: a trigger threshold of a trigger for voice recognition; a set of beamforming parameters; a database for voice recognition; and/or an algorithm for voice recognition. The algorithm may include using noise suppression or using acoustic beamforming.

Abstract: A touch display panel includes a pixel array, a touch module, and a multiplexer circuit. The pixel array includes a plurality of pixels, a plurality of gate lines, and a plurality of source lines. The pixels are electrically coupled to the source lines and the gate lines. The touch module and the pixel array are overlapped. The multiplexer circuit is coupled between all of the source lines and a source driver and has a plurality of multiplexers. The multiplexers are respectively coupled to n source lines and respectively include a plurality of switches and a bypass trace. The switches are respectively coupled between the first source line to the (n?1)th source line of the n source lines and the source drivers. The bypass trace is coupled between the nth source line of the n source lines and the source driver.

Abstract: An exposure time determination method for image sensing operation includes: providing a first stage exposure condition which includes a first exposure time; sensing an image according to the first stage exposure condition to generate a first histogram which has a first histogram brightness maximum, a first histogram brightness minimum, and a first histogram width; increasing or decreasing the first exposure time to a second exposure time as a second stage exposure condition, and sensing the image according to the second stage exposure condition to generate a second histogram which has a second histogram brightness maximum, a second histogram brightness minimum, and a second histogram width; comparing the first histogram width with the second histogram width to generate a comparison result, and determining a third exposure time to be a third stage exposure condition according to the comparison result; and sensing the image according to the third stage exposure condition.