Abstract: A method for managing network wake-up commands by a controller of a server includes receiving a system health data. The method includes receiving a network wake-up command from a network interface controller of the server. The method further includes the determining whether to wake-up the server based on the system health data to yield a determination, and commanding the server to wake-up, when the determination is to wake-up the server.

Abstract: A service controller of a computing device can store console messages so that an external management device can retrieve the console messages after a malfunction or crash of the computing device. For example, the service controller can be configured to redirect serial output (e.g., console messages, system log messages, system error message, etc.) to a network interface controller for transmission over a network connection. The service controller can be configured to store the console messages in non-volatile memory of the service controller. The service controller can receive a request for the stored console messages and transmit the stored console messages to an external device.

Abstract: A method and system for processing Domain name Services (DNS) request in a gateway with at least one local area network (LAN) interface and at least one wide area network (WAN) interface. The gateway receives a first DNS request from a first host via one of the at least one LAN interface of the gateway. The gateway then selects a plurality of DNS servers. At least one of the plurality of DNS server is accessible through at least one tunnel. The gateway transmits a plurality of new DNS requests to the plurality of DNS servers. The contents of the plurality of new DNS requests are the same as the content of the first DNS request.

Abstract: Systems, methods, and computer-readable storage media for detecting smoke in a computer system. The system detects smoke via a first smoke detector located at an airflow inlet of the system or a second smoke detector located at an airflow outlet of the system. Next, the system determines whether the smoke originates from inside of the system or outside of the system to yield a determination of an originating location of the smoke. Based on the determination of the originating location of the smoke, the system then generates a response to the smoke.

Abstract: According to an embodiment, a semiconductor device is provided. The device includes: The second region has a greater curvature than the first region. The device includes: an N-type epitaxy layer; a P-well in the N-type epitaxy layer; a drain in the N-type epitaxy layer; a source in the P-well; and a bulk in the P-well and in contact with the source, wherein the bulk has a greater area in the second region than in the first region.

Abstract: Methods and apparatuses for wafer level packaging (WLP) semiconductor devices are disclosed. A redistribution layer (RDL) is formed on a first passivation layer in contact with a conductive pad over a surface of a die. The RDL layer is on top of a first region of the first passivation layer. A second passivation layer is formed on the RDL layer with an opening to expose the RDL layer, and over the first passivation layer. An under bump metallization (UBM) layer is formed over the second passivation layer in contact with the exposed RDL layer. A second region of the first passivation layer disjoint from the first region is determined by projecting an outer periphery of a solder ball or other connector onto the surface.

Abstract: Some embodiments relate to a semiconductor device on a substrate. An interconnect structure is disposed over the substrate, and a first conductive pad is disposed over the interconnect structure. A second conductive pad is disposed over the interconnect structure and is spaced apart from the first conductive pad. A third conductive pad is disposed over the interconnect structure and is spaced apart from the first and second conductive pads. A fourth conductive pad is disposed over the interconnect structure and is spaced apart from the first, second, and third conductive pads. A first ESD protection element is electrically coupled between the first and second pads; and a second ESD protection element is electrically coupled between the third and fourth pads. A first device under test is electrically coupled between the first and third conductive pads; and a second device under test is electrically coupled between the second and fourth pads.

Abstract: Methods and systems for processing Domain Name Service (DNS) request in a gateway with a plurality of WAN network interfaces. After receiving a first DNS request via one of network interfaces of the gateway, the gateway selects at least one DNS server and at least one access network and then transmits a plurality of new DNS requests to the selected at least one DNS server through the selected at least one access network and via one of network interfaces of the gateway.

Abstract: A rework process includes attaching a first bond head to a first semiconductor package. The contact pads of the first semiconductor package are bonded to contact pads of a second semiconductor package by solder joints. The rework process further includes performing a first local heating process to melt the solder joints, removing the first semiconductor package using the first bond head, and removing at least a portion of solder from the contact pads of the second semiconductor package.

Abstract: A method and system for transmitting and receiving data packets between two network nodes via one or more end-to-end connections. An interface is provided for selecting one or more possible end-to-end connection(s) or established end-to-end connection(s). The method and system may further comprise receiving a policy, wherein one or more selected end-to-end connections are established based, at least in part, on the policy. The policy may also restrict or promote selection of certain established end-to-end connection(s) via the interface provided. The selected and established end-to-end connection(s) are used for transmitting and receiving data packets.

Abstract: A method for managing network wake-up commands by a controller of a server includes receiving a system health data. The method includes receiving a network wake-up command from a network interface controller of the server. The method further includes the determining whether to wake-up the server based on the system health data to yield a determination, and commanding the server to wake-up, when the determination is to wake-up the server.

Abstract: A device includes a first package component, and a second package component underlying, and bonded to, the first package component. A molding material is disposed under the first package component and molded to the first and the second package components, wherein the molding material and the first package component form an interface. An isolation region includes a first edge, wherein the first edge of the isolation region contacts a first edge of the first package component and a first edge of the molding material. The isolation has a bottom lower than the interface.

Abstract: A die has a first surface, a second surface opposite the first surface, and sidewalls includes a first portion and a second portion, wherein the first portion is closer to the first surface than the second portion. A fillet contacts the first portion of sidewalls of the die and encircles the die. A work piece is bonded to the die through solder bumps, with the second surface facing the work piece. A first underfill is filled a gap between the die and the work piece, wherein the first underfill contacts the fillet, and wherein the first underfill and the fillet are formed of different materials.

Abstract: An energy management strategy for boats and ships is provided. The output and distribution of energy are dynamically adjusted in accordance with commands, tides, time, locations, weather, hydrologic conditions and other factors may impact the sailing, in order to optimize the energy efficiency of boats and ships.

Abstract: A circuit includes a first node having a first supply voltage, a second node having a second supply voltage, and a voltage detector coupled between the first node and the second node, the voltage detector including a first output node. A clamp circuit is coupled between the first node and the second node. The voltage detector is configured to drive the first output node to the first supply voltage in response to a difference between the first supply voltage and the second supply voltage exceeding a predetermined threshold voltage value. The clamp circuit is configured to establish a conduction path between the first node and the second node in response to the first or second output node being driven to the first supply voltage.

Abstract: Embodiments generally relate to updating a basic input/output system (BIOS) configuration in a computing system. The present technology discloses techniques that that can enable a remote BIOS configuration updating using a shared storage device between a service controller and a BIOS. By enabling an out-of-band management protocol, the present technology can achieve a remote and efficient BIOS management method.

Abstract: A light-emitting device comprises a carrier; and a first semiconductor element comprising a first semiconductor structure and a second semiconductor structure, wherein the second semiconductor structure is closer to the carrier than the first semiconductor structure is to the carrier, the first semiconductor structure comprises a first MQW structure configured to emit a first light having a first dominant wavelength during normal operation, and the second semiconductor structure comprises a second MQW structure configured not to emit light during normal operation.

Abstract: A device includes a first package component, and a second package component underlying, and bonded to, the first package component. A molding material is disposed under the first package component and molded to the first and the second package components, wherein the molding material and the first package component form an interface. An isolation region includes a first edge, wherein the first edge of the isolation region contacts a first edge of the first package component and a first edge of the molding material. The isolation has a bottom lower than the interface.

Abstract: In some implementations, an IP address can be configured for a computing device using an out-of-band communication channel. For example, a system administrator can configure a system controller (e.g., baseband management controller) with an IP address using an out-of-band communication channel. In some implementations, the system controller can be configured with the IP address when the computing device is powered down. The system controller can store the IP address in memory associated with the system controller. In some implementations, an operating system of the computing device can be configured with an agent (e.g., process, application, utility) that will request the IP address from the system controller and configure the computing device to use the IP address. For example, the operating system agent can use various operating system commands to configure the IP address for the computing device based on the IP address received from the system controller.

Abstract: According to an embodiment, a semiconductor device is provided. The device includes: The second region has a greater curvature than the first region. The device includes: an N-type epitaxy layer; a P-well in the N-type epitaxy layer; a drain in the N-type epitaxy layer; a source in the P-well; and a bulk in the P-well and in contact with the source, wherein the bulk has a greater area in the second region than in the first region.