Patents by Inventor Han Yu

Han Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230141093
    Abstract: The present disclosure describes a semiconductor structure and a method for forming the same. The method can include forming a fin structure over a substrate. The fin structure can include a channel layer and a sacrificial layer. The method can further include forming a first recess structure in a first portion of the fin structure, forming a second recess structure in the sacrificial layer of a second portion of the fin structure, forming a dielectric layer in the first and second recess structures, and performing an oxygen-free cyclic etching process to etch the dielectric layer to expose the channel layer of the second portion of the fin structure. The oxygen-free cyclic etching process can include two etching processes to selectively etch the dielectric layer over the channel layer.
    Type: Application
    Filed: January 2, 2023
    Publication date: May 11, 2023
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Han-Yu LIN, Jhih-Rong HUANG, Yen-Tien TUNG, Tzer-Min SHEN, Fu-Ting YEN, Gary CHAN, Keng-Chu LIN, Li-Te LIN, Pinyen LIN
  • Patent number: 11647603
    Abstract: A server containing hard disk modules which can be slid into place and which allow connection at the front and at the rear of a housing. The server includes the housing which defines an opening, the hard disk modules, and a plurality of trays. Receiving channels communicating with the opening are defined in the housing, the receiving channels are isolated and arranged side by side and each channel can receive one tray. A hard disk module is positioned in one tray, a front end and a rear end of the housing defines front connection port and rear connection port for cable connections to each hard disk module.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: May 9, 2023
    Assignee: Fulian Precision Electronics (Tianjin) Co., LTD.
    Inventors: Han-Yu Li, Wen-Hu Lu, Shu-Tong Wang, Li-Yi Yin, Gong-Wen Zhang, Yang Li, San-Long Zhou
  • Patent number: 11646234
    Abstract: A semiconductor device includes a semiconductor substrate, a semiconductor fin protruding from the semiconductor substrate, and an isolation layer disposed above the semiconductor substrate. The isolation layer includes a first portion disposed on a first sidewall of the semiconductor fin and a second portion disposed on a second sidewall of the semiconductor fin. Top surfaces of the first and second portions of the isolation layer are leveled. The first portion of the isolation layer includes an air pocket. The semiconductor device also includes a dielectric fin with a bottom portion embedded in the second portion of the isolation layer.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: May 9, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Han-Yu Lin, Yi-Ruei Jhan, Fang-Wei Lee, Tze-Chung Lin, Chao-Hsien Huang, Li-Te Lin, Pinyen Lin, Akira Mineji
  • Publication number: 20230133801
    Abstract: A carrier assembly for installing a hard disk drive (HDD) rapidly without tools or screws or other fasteners disk includes a bracket and a carrier. The carrier is movably disposed within the bracket. The hard disk drive is disposed with the carrier. The bracket includes a side plate and a plurality of first protrusions arranged on the side plate along with electrical connectors. The side plate defines interconnecting slots, a vertical first slot and a horizontal second slot. The carrier includes a lateral plate, a rotating handle connected to the lateral plate, and second protrusions arranged on the lateral plate. When the rotating handle is manually rotated, the second protrusion becomes locked within the first slot or the second slot to fix the HDD in place.
    Type: Application
    Filed: June 23, 2022
    Publication date: May 4, 2023
    Inventors: GE LIU, HAN-YU LI, BIN-BIN YANG, MENG-YA CUI
  • Publication number: 20230135533
    Abstract: A blank dummy structure adaptable for slide rails and absence of slide rails, the blank dummy structure includes a main plate, two buckles, two rotating members, and two fasteners. The buckle comprises a snap component, the snap component is connected with the main plate to slide between first and second positions on the main plate. The rotating member and the snap component are arranged on the same side of the main plate, the rotating member on the main plate, comprises a limiting component. the rotating member being rotatably connected with the main plate to rotate the rotating member between a limit position and an avoidance position. The fastener configured to cooperate with the rack when the rotating member is in the avoidance position. The buckle, the rotating member, and the fastener are mounted on the main plate. A rack is also disclosed.
    Type: Application
    Filed: August 23, 2022
    Publication date: May 4, 2023
    Inventors: BIN-BIN YANG, HAN-YU LI, CHENG-HE LI, MENG-YA CUI
  • Publication number: 20230118154
    Abstract: Systems and methods to identify new protein targets of a chemical compound or its derivatives were described. The methods can be used for detection of new binding partners as long as the chemical compound can covalently bind to the protein targets. Once protein targets are resolved, information related to new protein targets can then be used to couple with real-world patient data such as adverse events, efficacy data, and disease correlation data to deduce real-world evidence. Systems collectively with all this information can aide clinical development and use of pharmaceutical drug. Methods are provided for detection of covalently bound phenyl vinyl sulfone (PVS) or its derivatives, and afatinib or its derivatives. Furthermore, generation of antiserum recognizing carrier bound PVS or carrier bound afatinib is described. PRMT1 is described as a new target of PVS and RRM1, RRM2, and NFKB are described as new targets of afatinib.
    Type: Application
    Filed: December 16, 2022
    Publication date: April 20, 2023
    Inventors: GEEN-DONG CHANG, MING-SHYUE LEE, CHENG-HAN YU
  • Publication number: 20230118700
    Abstract: A method for forming a semiconductor structure includes forming a fin on a semiconductor substrate. The fin includes channel layers and sacrificial layers stacked one on top of the other in an alternating fashion. The method also includes removing a portion of the fin to form a first opening and expose vertical sidewalls of the channel layers and the sacrificial layers, epitaxially growing a source/drain feature in the first opening from the exposed vertical sidewalls of the channel layers and the sacrificial layers, removing another portion of the fin to form a second opening to expose a vertical sidewall of the source/drain feature, depositing a dielectric layer in the second opening to cover the exposed vertical sidewall of the source/drain feature, and replacing the sacrificial layers with a metal gate structure in the second opening. The dielectric layer separates the source/drain feature from contacting the metal gate structure.
    Type: Application
    Filed: December 15, 2022
    Publication date: April 20, 2023
    Inventors: Han-Yu Lin, Chansyun David Yang, Tze-Chung Lin, Fang-Wei Lee, Fo-Ju Lin, Li-Te Lin, Pinyen Lin
  • Patent number: 11624084
    Abstract: Presented herein are methods and compositions for enhancing specific enrichment of target sequences in a nucleic acid library. Off-target hybridization probes may be used to reduce binding and/or capture of off-target regions of a nucleic acid library in a targeted sequencing workflow. The off-target hybridization probes may be specific for locations known to generate off-target sequencing reads for a particular set of hybridization probes.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: April 11, 2023
    Assignee: ILLUMINA, INC.
    Inventors: Li Teng, Chia-Ling Hsieh, Charles Lin, Han-Yu Chuang
  • Publication number: 20230097322
    Abstract: A method for employing a browser extension in relation to extending a financing offer to a user may include monitoring browser activity of a user via the browser extension responsive to loading a web page. The method may further include determining a merchant identity associated with an online product or service based on the browser activity, determining a preauthorized loan amount for the financing offer to the user based on the merchant identity, and displaying an interface element associated with the financing offer on the web page.
    Type: Application
    Filed: September 29, 2021
    Publication date: March 30, 2023
    Inventors: Emerson Hum, Jui-Chun Chien, Emilio Lopez, Han Yu Kang, Robert Arshonsky, Abhinay Korukonda, Christina Gee
  • Publication number: 20230082042
    Abstract: A server device which is self-adaptive to different placements and locations includes a chassis, a plurality of storage elements, and a storage cabinet. First and third slide rails are positioned at opposite sides of the storage cabinet along a first direction. Second and fourth slide rails are positioned at other two opposing sides of the storage cabinet. The storage cabinet is movably positioned in the chassis along a third direction. When the chassis is horizontal, the first slide rail and the third slide rail provide support for the storage cabinet and when the chassis is vertical, support is provided by the second and fourth slide rails. The problem of the storage cabinet being difficult to slide when the placement of the chassis is changed is reduced, and the server device is more flexible in its placement.
    Type: Application
    Filed: December 29, 2021
    Publication date: March 16, 2023
    Inventors: HAN-YU LI, BIN-BIN YANG, JIN-WEI ZHANG
  • Patent number: 11605728
    Abstract: A semiconductor device structure is provided. The semiconductor device includes a first nanowire structure over a second nanowire structure, a gate stack wrapping around the first nanowire structure and the second nanowire structure, a source/drain feature adjoining the first nanowire structure and the second nanowire structure, a gate spacer layer over the first nanowire structure and between the gate stack and the source/drain feature, and an inner spacer layer between the first nanowire structure and the second nanowire structure and between the gate stack and the source/drain feature. The gate spacer layer has a first carbon concentration, the inner spacer has a second carbon concentration, and the second carbon concentration is lower than the first carbon concentration.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: March 14, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Han-Yu Lin, Chansyun David Yang, Fang-Wei Lee, Tze-Chung Lin, Li-Te Lin, Pinyen Lin
  • Publication number: 20230070726
    Abstract: A power converter is provided. The power converter includes a housing, a heat dissipation module, and a first circuit board. The housing forms a receiving space, wherein the housing includes a first housing port and a second housing port. The heat dissipation module is detachably connected to the housing, and disposed in the receiving space. The heat dissipation module includes an inner path that communicates the first housing port with the second housing port. Working fluid enters the inner path via the first housing port. The working fluid leaves the inner path via the second housing port. The first circuit board includes a first circuit board body and a first heat source, wherein the first heat source is disposed on the first circuit board body, and the first heat source is thermally connected to the inner path of the heat dissipation module.
    Type: Application
    Filed: November 16, 2022
    Publication date: March 9, 2023
    Inventors: Sheng-Nan TSAI, Ying-Chung CHUANG, Chia-Jung LIU, Yi-Wei CHEN, Han-Yu TAI, Shao-Hsiang LO
  • Publication number: 20230066097
    Abstract: A method of the present disclosure includes forming a fin-shaped structure including a plurality of semiconductor layers, a first hard mask layer, a second hard mask layer, and a third hard mask layer, forming a patterned masking layer having a mask portion and a window portion, wherein the third hard mask layer is exposed through the window portion, performing a first etch process to expose the second hard mask layer through the window portion, performing a second etch process to etch the exposed second hard mask layer and to leave behind second hard mask layer residues, performing a third etch process to remove the second hard mask layer residues, etching the plurality of semiconductor layers in the fin-shaped structure through the window portion to divide the fin-shaped structure into a first segment and a second segment, and forming an isolation feature around the first segment and the second segment.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 2, 2023
    Inventors: Han-Yu Tsai, Zu-Yin Liu, You-Ting Lin, Jiun-Ming Kuo, Kuo-Chin Liu
  • Publication number: 20230067530
    Abstract: A structure for mounting a storage device to a server and providing a fast installation and removal of a storage device includes a carrier and a chassis. The carrier includes a rotatable handle with a cam on the axis of rotation and a frame. The cam is connected to the frame. The chassis includes an immovable limiting component. With the carrier mounted in the chassis, rotation of the handle clockwise or counterclockwise pushes the carrier to move, to lock or unlock the carrier because of the limiting component resting against the cam. The structure greatly improves the convenience of the installation and removal of the storage device. A computing device is also disclosed.
    Type: Application
    Filed: August 25, 2022
    Publication date: March 2, 2023
    Inventors: HAN-YU LI, WEN-HU LU, JUN LI, CHEN XING
  • Publication number: 20230067696
    Abstract: A semiconductor device comprising a semiconductor channel, an epitaxial structure coupled to the semiconductor channel, and a gate structure electrically coupled to the semiconductor channel. The semiconductor device further comprises a first interconnect structure electrically coupled to the epitaxial structure and a dielectric layer that contains nitrogen. The dielectric layer comprises a first portion protruding from a nitrogen-containing dielectric capping layer that overlays either the gate structure or the first interconnect structure.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 2, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Lien Huang, Yi-Shan Chen, Kuan-Da Huang, Han-Yu Lin, Li-Te Lin, Ming-Huan Tsai
  • Publication number: 20230064393
    Abstract: The present disclosure describes a method that includes forming a fin structure with a stacked fin portion on a substrate. The stacked fin portion includes a first semiconductor layer and a second semiconductor layer, in which the second semiconductor layer includes germanium. The method further includes etching the fin structure to form an opening and etching a portion of the second semiconductor layer with a fluorine-containing gas through the opening.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 2, 2023
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tze-Chung LIN, Han-Yu LIN, Fang-Wei LEE, Li-Te LIN, Pinyen LIN
  • Publication number: 20230055697
    Abstract: A server containing hard disk modules which can be slid into place and which allow connection at the front and at the rear of a housing. The server includes the housing which defines an opening, the hard disk modules, and a plurality of trays. Receiving channels communicating with the opening are defined in the housing, the receiving channels are isolated and arranged side by side and each channel can receive one tray. A hard disk module is positioned in one tray, a front end and a rear end of the housing defines front connection port and rear connection port for cable connections to each hard disk module.
    Type: Application
    Filed: October 29, 2021
    Publication date: February 23, 2023
    Inventors: HAN-YU LI, WEN-HU LU, SHU-TONG WANG, LI-YI YIN, GONG-WEN ZHANG, YANG LI, SAN-LONG ZHOU
  • Publication number: 20230058481
    Abstract: The invention provides a chassis structure, a server, and a method of dissipating heat from server. The chassis structure comprises chassis body, two fan components, two tray components, and a power supply. The chassis body defines a receiving space bounded by two spaced partitions, the two partitions divide the receiving space into a middle cavity and two side cavities. The fan components are at one end of each side cavity and are connected to the chassis body. The two tray components carry slots for inserting hard disks. The power supply is arranged in the middle cavity and supplies power to the hard disks inserted in the slots, the power supply also has a fan, the power supply positioned at one end of the middle cavity.
    Type: Application
    Filed: June 28, 2022
    Publication date: February 23, 2023
    Inventors: HAN-YU LI, WEN-HU LU, LI-YI YIN, MING-LIANG ZHANG, SHU-TONG WANG
  • Publication number: 20230050441
    Abstract: An adapter device enabling a peripheral component interconnect express (PCIe) slot in a server to additionally accept an open compute project (OCP) card includes a bracket assembly compatible with an OCP card and a server. The adapter device comprises a chassis, a front-end bracket, an adapter assembly, and a rail assembly. The front-end bracket defines a first inserting port for OCP card insertion, the adapter assembly comprises OCP interface, adapter circuit board, and PCIe interface. The PCIe interface is connected to the adapter circuit board, and the adapter circuit board provides electrical connection and conversion between OCP interface and PCIe interface. The rail assembly between the front-end bracket and the OCP interface carries in the OCP card when the card is inserted.
    Type: Application
    Filed: June 28, 2022
    Publication date: February 16, 2023
    Inventors: HAN-YU LI, GONG-WEN ZHANG, YANG LI, JUN LI, SAN-LONG ZHOU, JIN-XING ZHANG
  • Patent number: 11579858
    Abstract: Method, device, and storage medium for processing a driver on a terminal device side are provided. A method includes obtaining connection information between a peripheral device corresponding to the driver and a terminal device; determining, according to the connection information, driver installation options capable of successfully installing the driver; and displaying the driver installation options capable of successfully installing the driver.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: February 14, 2023
    Assignee: ZHUHAI PANTUM ELECTRONICS CO., LTD.
    Inventors: Dongcheng Hu, Jingling Chen, Han Yu, Jibing Peng, Xiang Chen